Bionic laminated graphene/perylene diimide derivative heat conduction film and preparation method thereof

A peryleneimide and thermally conductive film technology is applied in the field of biomimetic layered graphene/peryleneimide derivative thermally conductive films and their preparation to achieve the effects of improving longitudinal heat transfer paths and improving mechanical properties

Inactive Publication Date: 2019-09-17
GUILIN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention uses perylene imide derivatives and graphene to carry out π-π stacking to prepare a composite film with a layered structure, which improves the dispersion, mechanical properties and thermal conductivity of graphene in the composite film material. literature report

Method used

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  • Bionic laminated graphene/perylene diimide derivative heat conduction film and preparation method thereof
  • Bionic laminated graphene/perylene diimide derivative heat conduction film and preparation method thereof

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Experimental program
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Effect test

Embodiment approach 1

[0021] (1) Add 0.5g perylene anhydride, 5.5g polyethylene polyamine, 40mL xylene in a three-necked flask, reflux under N 2 Under protection, the temperature was raised to 80°C. After reacting for 10 hours, the solution was precipitated in 40mL of methanol, and the filter cake was washed with distilled water several times until the filtrate was neutral, and dried overnight at 60°C in a vacuum oven to obtain perylene imide Amine Derivatives (APBI).

[0022] (2) Take 1.0 g of graphene slurry with a solid content of 0.05 g, add 300 mL of deionized water and ultrasonicate for 30 minutes, then add 0.5 mg of APBI synthesized in step (1), continue ultrasonic dispersion for 1 hour, and filter the dispersion to form a film , after drying at 80° C., using a mechanical pressure of 10 MPa and a pressing time of 5 minutes, a peryleneimide functionalized graphene heat-conducting film (APBI-GNS) with a thickness of 20 μm was obtained. The measured transverse thermal conductivity is 287W / m·K,...

Embodiment approach 2

[0024] (1) Add 1.0g perylene anhydride, 11g polyvinylpolyamine, 40mL xylene in a three-necked flask, reflux under N 2 Under protection, the temperature was raised to 80°C, and after 12 hours of reaction, the solution was precipitated in 40mL of methanol, and the filter cake was washed with distilled water several times until the filtrate was neutral, and dried overnight at 60°C in a vacuum drying oven to obtain perylene imide Amine Derivatives (APBI).

[0025] (2) Take 1.0 g of graphene slurry with a solid content of 0.05 g, add 300 mL of deionized water for ultrasonication for 30 min, then add 1.0 mg of APBI synthesized in step (1), continue ultrasonic dispersion for 1.5 h, and suction filter the dispersion into After the film was dried at 80°C, a mechanical pressure of 10 MPa was used for a pressing time of 5 minutes to obtain a peryleneimide functionalized graphene thermally conductive film (APBI-GNS) with a thickness of 20 μm. The measured transverse thermal conductivity ...

Embodiment approach 3

[0027] (1) Add 1.0g perylene anhydride, 11g polyvinylpolyamine, 40mL xylene in a three-necked flask, reflux under N 2 Under protection, the temperature was raised to 80°C. After reacting for 12 hours, the solution was precipitated in 50mL of methanol, and the filter cake was washed with distilled water several times until the filtrate was neutral, and dried overnight at 60°C in a vacuum drying oven to obtain perylene imide Amine Derivatives (APBI).

[0028] (2) Take 1.0 g of graphene slurry with a solid content of 0.05 g, add 400 mL of deionized water and ultrasonicate for 30 min, then add 1.5 mg of APBI synthesized in step (1), continue ultrasonic dispersion for 2 h, and filter the dispersion to form a film , after drying at 80° C., using a mechanical pressure of 12 MPa and a pressing time of 8 minutes, a peryleneimide functionalized graphene thermally conductive film (APBI-GNS) with a thickness of 24 μm was obtained. The measured transverse thermal conductivity is 210W / m·K,...

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Abstract

The invention provides a bionic laminated graphene / perylene diimide derivative heat conduction film and a preparation method thereof. The film is of a shell-like "brick-mud" laminated structure. The preparation method of the film comprises the following steps: (1) mixing a graphene water dispersion and a perylene diimide derivative in a mass ratio of 50:(0.5-25), carrying out stirring, carrying out uniform ultrasonic dispersion, and carrying out suction filtration and film formation; and (2) pressing the film obtained in the step (1) at mechanical pressure of 8-15MPa for 5-10 minutes, so as to obtain the laminated graphene / perylene diimide derivative heat conduction film. Due to a pi-pi overlapping function of the perylene diimide derivative and the graphene, the shell-like "brick-mud" laminated structure is constructed, and the longitudinal heat conduction property and the mechanical property of the laminated graphene / perylene diimide derivative heat conduction film are improved. The film has the characteristics of being simple in preparation process, high in heat conduction coefficient, friendly to the environment, low in production cost, and the like, and can be widely applied to fields such as thermal interference materials and other electronic products.

Description

technical field [0001] The invention relates to the field of film material preparation, in particular to a biomimetic layered graphene / peryleneimide derivative heat conduction film and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of high density, lightness, thinness, shortness and smallness, the integration speed and power of various components are further increased, resulting in higher and higher operating temperatures of components and higher heat dissipation requirements. high. Therefore, it is urgent to develop high thermal conductivity materials. At present, the most widely used thermal management materials are metal materials, such as copper and aluminum, which are characterized by high density and low thermal conductivity. Graphene is a new carbonaceous material in which a single layer of carbon atoms is tightly packed into a two-dimensional honeycomb lattice structure. With its unique stru...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 陆绍荣任丽虞锦洪陆天韵彭庆元李裕琪徐旭
Owner GUILIN UNIVERSITY OF TECHNOLOGY
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