Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LTCC substrate structure and laser processing method thereof

A laser processing method and substrate technology, which are applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of high integration, many layers, and high device operating power density, achieve balanced stress, reduce thickness, and achieve flexibility. sexual effect

Active Publication Date: 2019-09-24
苏州福唐智能科技有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, although the heat dissipation of the LTCC substrate has been greatly improved compared with the traditional PCB board, due to the high integration, the number of layers, and the high power density of the device, the heat dissipation of the LTCC substrate is still a key issue, which has become an impact on the system. One of the determinants of job stability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LTCC substrate structure and laser processing method thereof
  • LTCC substrate structure and laser processing method thereof
  • LTCC substrate structure and laser processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] see figure 1 and 2 ,in figure 1 for along figure 2 The cross-sectional view of the A1A2 line, the LTCC substrate structure of the present invention is formed by stacking a plurality of ceramic sheets 1, each of the plurality of ceramic sheets has opposite first surfaces and second surfaces, and on the first surface and multiple sides between the second surface; the material of the ceramic sheet can be selected from materials commonly used in this field, such as alumina, aluminum nitride, etc., and ceramic materials with better heat dissipation are usually selected.

[0019] Laser etching a first depression and a second depression on the first surface of each of the plurality of ceramic sheets 1, and filling the first depression and the second depression with a conductive substance to form a plurality of blind holes 3 and a plurality of through holes 2; wherein, the plurality of blind holes 3 are formed in the peripheral area of ​​the ceramic sheet 1 and surround t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an LTCC substrate structure and a laser processing method thereof. A through hole and blind holes are formed through laser etching, so that the warping caused by non-uniform overall heat conduction can be prevented, and the unreliability during co-firing is prevented; and the flexibility of electric lead-out can be realized on the basis of reducing the thickness by utilizing the side surface connection of the blind holes, and the blind holes are formed in the edge region, so that the stress during contraction can be balanced, and the warping can be prevented.

Description

technical field [0001] The invention relates to semiconductor processing technology, belongs to the H01L23 / 00 classification number, and specifically relates to an LTCC substrate structure and a laser processing method thereof. Background technique [0002] Ceramic materials have excellent characteristics of high frequency, high speed transmission and wide passband. According to different ingredients, the dielectric constant of LTCC materials can vary in a wide range, and the use of high-conductivity metal materials as conductor materials is conducive to improving the quality factor of the circuit system and increasing the flexibility of circuit design; LTCC can It adapts to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit boards, which greatly optimizes the heat dissipation design of electronic equipment, has high reliability, can be used in harsh environments, and prolongs its service life; it c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/373H01L21/48
CPCH01L21/4857H01L21/486H01L23/3735H01L23/49822H01L23/49827H01L23/49838
Inventor 陈洁陈乐薛水仙
Owner 苏州福唐智能科技有限公司
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com