Radial plasma jet pulse vacuum arc evaporation source and thin film deposition device

Abstract

The invention discloses a radial plasma jet pulse vacuum arc evaporation source and a thin film deposition device. According to the pulse arc evaporation source, a cylindrical counter electrode capable of conducting pulse arc discharge is adopted, the coating material is evaporated to generate plasma, and under the limit of an electrode end surface, the plasma generates a radial jet flow which is uniformly distributed under the driving of the high-voltage intensity, so that the film deposition uniformity is improved; vertical reciprocating motion of the evaporation source can improve the film material utilization rate and deposition rate; the thin film deposition device provides a matched moving workpiece table mechanism, and the large-area uniform and high film material utilization rate thin film deposition can be realized; the batch workpiece consistency can be improved; the whole deposition chamber is compact in mechanism, and on the premise of the same productivity, compared with traditional equipment, the device has a lower cost; the deposition temperature is more lower; and complicated factors and response measures which influence the uniformity are not required to be considered, the operation is simpler, and the requirements on operators are reduced.

Description

technical field [0001] The invention belongs to the technical field of thin film deposition, and in particular relates to a radial plasma jet-based pulsed arc evaporation source and a thin film deposition device. Background technique [0002] In order to plate the desired material onto the surface of the workpiece, thin film deposition (coating) is required. Therefore, first of all, there must be thin film deposition equipment, which is often called a coating machine in the industry. The basic point is to use heating, sputtering and other methods to heat, melt, evaporate or sputter the material to be plated in a vacuum chamber. In vacuum, these evaporated or sputtered materials fly to the workpiece in the form of molecules, and deposit on it to form a thin film ( figure 1 ). For the convenience of description, the directional flow composed of a large number of molecules is called deposition jet below. At present, the main methods for forming deposition jets are resistanc...

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Problems solved by technology

Depend on figure 2 It can be seen from the figure that most of the deposition jets do not reach the workpiece, and the ineffective deposition jets result in a very low utilization rate of the film material

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