An electronic equipment housing and electronic equipment

Abstract

The invention discloses an electronic equipment casing, which comprises a base body, a texture layer and a coating layer sequentially stacked on the base body, and inorganic particles are dispersed in the texture layer. The present invention disperses inorganic particles in the texture layer of the electronic equipment casing, and the inorganic particles can effectively reduce the thermal expansion coefficient of the texture layer, so that the difference between the thermal expansion coefficient of the texture layer of the electronic equipment casing and the thermal expansion coefficient of the coating layer is reduced, and the thermoforming During the process, the thermal stress between the texture layer and the coating layer is reduced, and the problem of cracking of the coating layer is significantly improved.

Description

technical field

[0001] The invention relates to the field of electronic products, in particular to an electronic equipment shell and the electronic equipment. Background technique

[0002] With the advent of the 5G era, due to the limited signal penetration ability of metal shells, its application in the 5G field is limited to a certain extent. Therefore, the choice of polymer materials that are conducive to 5G signal penetration as electronic equipment shells The widespread attention of engineers is expected to be used in large-scale commercial applications. By setting a multi-layer structure such as texture layer, coating layer and ink layer on the substrate, the electronic device housing based on polymer material can have the visual effect of optical texture pattern and metallic luster, thereby enhancing the polymer material housing. texture. On the other hand, in order to make the electronic equipment have a good feel, it is also necessary to hot-press the housing of t...

Examples

Embodiment 1

[0033] A layer of UV-curable adhesive containing zirconium dioxide was applied on the surface of polymethyl methacrylate (thickness 0.05 mm) and polycarbonate (thickness 0.3 mm) double-layer transparent polymer substrate using a transfer printing machine Particles (average particle size is 40nm), the weight of zirconia particles is 8% of the weight of UV curing glue; under the action of UV light, the UV curing glue is polymerized and cured to form a texture layer with a certain shape (thickness is 7 μm) ; Deposit titanium nitride and silicon dioxide coating layers on the surface of the texture layer (total thickness is 100 nm), the coating can reflect blue light with a central wavelength of 450 nm; heat press the polymer matrix treated above to obtain electronic equipment shells Body S1.

Embodiment 2

[0035] Use a transfer machine to coat a layer of UV-curable adhesive on the surface of polymethyl methacrylate (thickness 0.05 mm) and polycarbonate (thickness 0.5 mm) double-layer transparent polymer substrate, which contains silica Particles (average particle size 20nm), the weight of silica particles is 25% of the weight of the UV curable adhesive; under the action of UV light, the UV curable adhesive is polymerized and cured to form a textured layer with a certain shape (thickness 15 μm) ; Deposit titanium dioxide and silicon dioxide coating layers (total thickness 50 nm) on the surface of the texture layer, and the coating can reflect blue light with a center wavelength of 450 nm; print an ink layer (thickness 15 μm) on the surface of the coating layer, which will pass through the above The treated polymer matrix is ​​thermocompressed to obtain an electronic device casing S2.

Embodiment 3

[0037] A three-layer transparent polymer substrate of polymethyl methacrylate (thickness 0.05 mm), polycarbonate (thickness 0.5 mm) and polymethyl methacrylate (thickness 0.05 mm) was coated with a transfer printing machine. A layer of UV curable adhesive, containing silica particles (average particle size 30 nm) in the UV curable adhesive, the weight of the silica particles is 40% of the weight of the UV curable adhesive; the UV curable adhesive is polymerized and cured under the action of UV light, Form a texture layer with a certain shape (thickness is 30 μm); deposit titanium dioxide and silicon dioxide coating layers on the surface of the texture layer (total thickness is 50 nm), the coating can reflect blue light with a central wavelength of 450 nm; on the coating layer An ink layer (thickness: 30 μm) was printed on the surface, and the above-mentioned treated polymer matrix was thermocompressed to obtain the electronic device casing S3.

technical field

[0001] The invention relates to the field of electronic products, in particular to an electronic equipment shell and the electronic equipment. Background technique

[0002] With the advent of the 5G era, due to the limited signal penetration ability of metal shells, its application in the 5G field is limited to a certain extent. Therefore, the choice of polymer materials that are conducive to 5G signal penetration as electronic equipment shells The widespread attention of engineers is expected to be used in large-scale commercial applications. By setting a multi-layer structure such as texture layer, coating layer and ink layer on the substrate, the electronic device housing based on polymer material can have the visual effect of optical texture pattern and metallic luster, thereby enhancing the polymer material housing. texture. On the other hand, in order to make the electronic equipment have a good feel, it is also necessary to hot-press the housing of t...

Examples

Embodiment 1

[0033] A layer of UV-curable adhesive containing zirconium dioxide was applied on the surface of polymethyl methacrylate (thickness 0.05 mm) and polycarbonate (thickness 0.3 mm) double-layer transparent polymer substrate using a transfer printing machine Particles (average particle size is 40nm), the weight of zirconia particles is 8% of the weight of UV curing glue; under the action of UV light, the UV curing glue is polymerized and cured to form a texture layer with a certain shape (thickness is 7 μm) ; Deposit titanium nitride and silicon dioxide coating layers on the surface of the texture layer (total thickness is 100 nm), the coating can reflect blue light with a central wavelength of 450 nm; heat press the polymer matrix treated above to obtain electronic equipment shells Body S1.

Embodiment 2

[0035] Use a transfer machine to coat a layer of UV-curable adhesive on the surface of polymethyl methacrylate (thickness 0.05 mm) and polycarbonate (thickness 0.5 mm) double-layer transparent polymer substrate, which contains silica Particles (average particle size 20nm), the weight of silica particles is 25% of the weight of the UV curable adhesive; under the action of UV light, the UV curable adhesive is polymerized and cured to form a textured layer with a certain shape (thickness 15 μm) ; Deposit titanium dioxide and silicon dioxide coating layers (total thickness 50 nm) on the surface of the texture layer, and the coating can reflect blue light with a center wavelength of 450 nm; print an ink layer (thickness 15 μm) on the surface of the coating layer, which will pass through the above The treated polymer matrix is ​​thermocompressed to obtain an electronic device casing S2.

Embodiment 3

[0037] A three-layer transparent polymer substrate of polymethyl methacrylate (thickness 0.05 mm), polycarbonate (thickness 0.5 mm) and polymethyl methacrylate (thickness 0.05 mm) was coated with a transfer printing machine. A layer of UV curable adhesive, containing silica particles (average particle size 30 nm) in the UV curable adhesive, the weight of the silica particles is 40% of the weight of the UV curable adhesive; the UV curable adhesive is polymerized and cured under the action of UV light, Form a texture layer with a certain shape (thickness is 30 μm); deposit titanium dioxide and silicon dioxide coating layers on the surface of the texture layer (total thickness is 50 nm), the coating can reflect blue light with a central wavelength of 450 nm; on the coating layer An ink layer (thickness: 30 μm) was printed on the surface, and the above-mentioned treated polymer matrix was thermocompressed to obtain the electronic device casing S3.

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