Process for preparing heat-conducting polymer material by utilizing SLS to form porous ceramic heat-conducting network

Abstract

The invention relates to a process for preparing a heat-conducting polymer material by utilizing SLS to form a porous ceramic heat-conducting network, the method comprises the following steps: blending ceramic powder and powder; introducing the structure of a designed integrated filler into software, setting the technological parameters of the SLS, and printing and forming mixed powder; spraying an epoxy chloropropane solution on the obtained porous ceramic heat-conducting network and drying; placing the dried porous ceramic heat-conducting network in a muffle furnace, heating, and naturally cooling; filling the cooled porous ceramic heat conduction network into a thermosetting resin matrix, and using a prepreg-vacuum curing process to prepare the heat-conducting polymer material. The process for preparing the heat-conducting polymer material by utilizing the SLS to form the porous ceramic heat-conducting network is simple in process and high in flexibility, and the prepared heat-conducting polymer material has extremely high heat conductivity and ultrahigh strength, simultaneously has good toughness and rigidity, and has wide application prospect.

Description

Technical field [0001] The invention belongs to the technical field of polymer materials, and specifically relates to a process for preparing thermally conductive polymer materials by using SLS to form a porous ceramic thermally conductive network, and in particular to a process for preparing thermally conductive polymer materials using SLS to form a porous ceramic thermally conductive network for automotive manufacturing and aerospace Process of polymer materials. Background technique [0002] The research direction of thermal conductivity modification of polymers is divided into two categories, one is to increase the overall thermal conductivity by adding fillers with better thermal conductivity, and the other is to optimize the dispersion form of the filler in the matrix to reduce the "threshold" , Improve the formation efficiency of the three-dimensional heat conduction path. At present, the exploration of high thermal conductivity fillers is relatively mature, and it is of ...

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Problems solved by technology

[0003] Although these two types of methods in the prior art can effectively construct a heat conduction network, the fillers that form the heat conduction network only rely on external pressure to gather together, lacking the connection of binding forces (such as intermolecular forces, chemical bonds, etc.) , it will inevitably lead to a decrease in the mechanical properties of the material, and there are pores between the fillers, which will reduce the thermal conductivity

[0004] The thermal conductivity of commercially available thermal resins is mostly around 1W / (mK), which is far from the actual application requirements.

Moreover, due to the high addition amount, the mechanical properties and processing properties of the product are reduced, and it cannot be used in extreme environments.

[0005] The Chinese patent application number is CN201811469670.2, which discloses a preparation method of hexagonal boron nitride / epoxy resin composite material with high thermal conductivity, using hexagonal boron nitride and epoxy resin as raw materials, through solvent dispersion, vacuum filtration, Sheeting treatment and curing treatment to prepare high thermal conductivity hexagonal boron nitride / epoxy resin composite material, the process is complex, only rely on external pressure to gather together, lack of bonding force, will lead to decline in mechanical properties of the material, and there are pores between the fillers, reduce thermal conductivity

[0006] Chinese patent application number CN201811004019.8 discloses a preparation method of boron nitride / epoxy resin composite material with a three-dimensional structure, the process is complicated and the thermal conductivity is not high

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