A kind of glue solution for lead-free high reliability fr-4 copper clad laminate production

A FR-4, reliable technology, used in the field of copper clad laminates, can solve the problems that ordinary circuit boards cannot fully meet, the adhesion between pads and substrates is poor, and the soldering temperature of lead-free solder is high, so as to achieve good adhesion, Low melting point temperature and the effect of improving crystallinity

Active Publication Date: 2021-07-13
建滔电子材料(江阴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary circuit boards can no longer fully meet these new requirements, especially in terms of pad pull-off strength
Due to the thin and short design method and the requirements of lead-free solder, the pad size, line width and line spacing become smaller, and the lead-free solder soldering temperature is higher, resulting in the high temperature environment of the soldering operation. The force becomes worse, resulting in a decrease in pull-off strength, which ultimately affects the reliability of the circuit board work

Method used

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  • A kind of glue solution for lead-free high reliability fr-4 copper clad laminate production
  • A kind of glue solution for lead-free high reliability fr-4 copper clad laminate production
  • A kind of glue solution for lead-free high reliability fr-4 copper clad laminate production

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A preparation method of lead-free high-reliability FR-4 copper clad laminate, the steps comprising:

[0021] Prepare FR-4 glue according to the following glue preparation ratio:

[0022]

[0023] Put the above materials into the shear kettle according to the ratio, and add the solvent acetone, and stir at a high speed to obtain the glue solution evenly.

[0024] Immerse the above glue with electronic grade E-type glass cloth, bake it to make a prepreg, then stack the prepreg according to the requirements, and cover both sides with electrolytic copper foil at a temperature of 228°C and a surface pressure of 30kgf / cm 2 After curing for 2-3 hours under the same conditions, a high-reliability lead-free FR-4 copper-clad laminate was obtained. The main properties of the board are shown in Table 1.

Embodiment 2

[0026] A preparation method of lead-free high-reliability FR-4 copper clad laminate, the steps comprising:

[0027] Prepare FR-4 glue according to the following glue preparation ratio:

[0028]

[0029] The above materials are put into the shearing kettle according to the proportion, and the solvent butanone and propylene glycol monomethyl ether are added, and the glue is evenly obtained by stirring at a high speed.

[0030] Immerse the above glue with electronic grade E-type glass cloth, bake it to make a prepreg, then stack the prepreg according to the requirements, and cover both sides with electrolytic copper foil at a temperature of 224°C and a surface pressure of 30kgf / cm 2 After curing for 2-3 hours under the same conditions, a high-reliability lead-free FR-4 copper-clad laminate was obtained. The main properties of the board are shown in Table 1.

[0031] Table 1 main properties of the board

[0032]

[0033] It can be seen from Table 1 that the FR-4 board prod...

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Abstract

The invention relates to a glue solution for the production of lead-free and high-reliability FR‑4 copper-clad laminates, which belongs to the technical field of copper-clad laminates. The main raw materials include 22-26 parts of high-brominated epoxy resin, 14-18 parts of E-51 base resin, 2-4 parts of tetrafunctional epoxy resin, 4-16 parts of polybutylene adipate / terephthalate, 28-32 parts of linear bisphenol A formaldehyde resin, 0.0200-0.0210 parts of accelerator, 15-18 parts of inorganic filler, and 12-15 parts of solvent. The FR-4 copper-clad laminate prepared by the invention not only ensures the heat resistance of the product, but also ensures good adhesion between the base material and the copper foil, improves the pull-off strength of the solder pad when the circuit board is made, and can It meets the requirements of the PCB processing process for the heat resistance and processing performance of the board.

Description

technical field [0001] The invention relates to a lead-free high-reliability glue solution for producing FR-4 copper-clad laminates, which belongs to the technical field of copper-clad laminates. Background technique [0002] As the basic material of the electronics industry, copper clad laminates are mainly used for processing and manufacturing printed circuit boards, and are widely used in electronic communications and instruments. FR-4 copper clad laminate is a type of flame retardant substrate with epoxy resin as adhesive and electronic grade glass fiber cloth as reinforcement material. It still has high mechanical strength at room temperature to about 150°C and has good dimensional stability. , Impact resistance and moisture resistance, excellent electrical properties in dry and wet states. FR-4 epoxy copper clad laminate is the largest and most widely used copper clad laminate product in the copper clad laminate series, and it is an important base material for making ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08L63/00C08L67/02C08L61/12C08G59/68
CPCC08G59/621C08G59/686C08L63/00C08L67/02C08L2203/20C08L2205/025C08L2205/035C08L61/12
Inventor 周培峰
Owner 建滔电子材料(江阴)有限公司
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