Particle dispersion toughened aluminum nitride ceramic substrate and preparation method thereof

A technology of aluminum nitride ceramics and aluminum nitride, which is applied in the field of particle dispersion toughened aluminum nitride ceramic substrates and its preparation, which can solve the problem of insufficient fracture toughness of aluminum nitride ceramics and difficulty in meeting the high performance requirements of aluminum nitride ceramic materials, etc. question

Active Publication Date: 2019-11-12
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Therefore, in view of the above content, the present invention provides a particle dispersion toughened aluminum nitride ceramic substrate and its preparation method, which solves the insufficient fracture toughness of aluminum nitride ceramics in the prior art, and it is difficult to meet the high requirements for material performance in the application field of aluminum nitride ceramics The problem

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  • Particle dispersion toughened aluminum nitride ceramic substrate and preparation method thereof

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Embodiment 1

[0021] A particle dispersion toughened aluminum nitride ceramic substrate, in parts by weight, the aluminum nitride ceramic is made of the following raw material components: 75 parts of aluminum nitride powder, 2 parts of yttrium chloride, 1 part of lanthanum chloride 2 parts, 2 parts of hafnium carbide, 3 parts of zirconia, 0.5 parts of aluminum oxide, 5 parts of polyimide, 1 part of bis(2-ethylhexyl) phthalate, and 4 parts of defoamer.

[0022] The preparation steps of the particle dispersion toughened aluminum nitride ceramic substrate are as follows:

[0023] (1) Ball milling: Weigh 75 parts of aluminum nitride powder, 2 parts of yttrium chloride, 1 part of lanthanum chloride, 2 parts of hafnium carbide, 3 parts of zirconia, and 0.5 part of aluminum oxide in a ball mill in parts by weight. And add isopropanol 50 to carry out ball milling, ball milling time is 10h, obtain mixed slurry;

[0024] (2) Preparation of cast slurry: add 5 parts of polyimide, 1 part of bis(2-ethyl...

Embodiment 2

[0030] A particle dispersion toughened aluminum nitride ceramic substrate. In parts by weight, the aluminum nitride ceramic is made of the following raw material components: 80 parts of aluminum nitride powder, 2 parts of gadolinium trichloride, 2 parts of terbium, 3 parts of hafnium carbide, 4 parts of zirconia, 0.8 parts of aluminum oxide, 7 parts of polyimide, 2 parts of bis(2-ethylhexyl) phthalate, and 6 parts of defoamer.

[0031] The preparation steps of the particle dispersion toughened aluminum nitride ceramic substrate are as follows:

[0032] (1) Ball milling: Weigh 80 parts of aluminum nitride powder, 2 parts of gadolinium trichloride, 2 parts of terbium trichloride, 3 parts of hafnium carbide, 4 parts of zirconia, and 0.8 parts of aluminum oxide in a ball mill , and added 60 parts of isopropanol for ball milling, and the ball milling time was 14h to obtain a mixed slurry;

[0033] (2) Preparation of cast slurry: Add 7 parts of polyimide, 2 parts of bis(2-ethylhexy...

Embodiment 3

[0039] A particle dispersion toughened aluminum nitride ceramic substrate. In parts by weight, the aluminum nitride ceramic is made of the following raw material components: 90 parts of aluminum nitride powder, 4 parts of ytterbium trichloride, 2 parts of lutetium, 4 parts of hafnium carbide, 5 parts of zirconia, 1 part of aluminum oxide, 10 parts of polyimide, 3 parts of bis(2-ethylhexyl) phthalate, and 8 parts of defoamer.

[0040] The preparation steps of the particle dispersion toughened aluminum nitride ceramic substrate are as follows:

[0041] (1) Ball milling: Weigh 90 parts of aluminum nitride powder, 4 parts of ytterbium trichloride, 2 parts of lutetium trichloride, 4 parts of hafnium carbide, 5 parts of zirconia, and 1 part of aluminum oxide in a ball mill in parts by weight , and added 70 parts of isopropanol for ball milling, and the ball milling time was 18h to obtain a mixed slurry;

[0042] (2) Preparation of cast slurry: add 10 parts of polyimide, 3 parts of ...

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Abstract

The invention relates to the technical field of preparation of aluminum nitride ceramic substrates, provides a particle dispersion toughened aluminum nitride ceramic substrate and a preparation methodthereof, and solves the problem that an aluminum nitride ceramic has insufficient fracture toughness and cannot satisfy high requirements for material performance in the application field in the prior art. The aluminum nitride ceramic is prepared from the following raw material components: 75-90 parts of aluminum nitride powder, 3-6 parts of a sintering auxiliary agent, 2-4 parts of hafnium carbide, 3-5 parts of zirconium oxide, 0.5-1 part of aluminum oxide, 5-10 parts of polyimide, 1-3 parts of bis(2-ethylhexyl) phthalate, and 4-8 parts of an antifoaming agent. The method provided by the invention adopts a composite toughening manner to modify an aluminum nitride ceramic substrate, and the fracture toughness of the ceramic substrate is obviously superior to that of an aluminum nitride ceramic substrate prepared by single toughening modification.

Description

technical field [0001] The invention relates to the technical field of preparation of aluminum nitride ceramic substrates, in particular to a particle dispersion toughened aluminum nitride ceramic substrate and a preparation method thereof. Background technique [0002] Aluminum nitride (A1N) is a covalent bond compound with a hexagonal wurtzite structure, which has high thermal conductivity, good high-temperature insulation and dielectric properties, high material strength at high temperatures, low thermal expansion coefficient, and is compatible with semiconductor silicon materials. Matching, non-toxic and other advantages, it is an ideal heat dissipation material for electronic packaging, which can efficiently dissipate the heat of large-scale components such as large-scale integrated circuits, and can be used as a high-performance ceramic substrate material for assembling ultra-large-scale integrated circuits. [0003] However, the mechanical properties of aluminum nitri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/58C04B35/622C04B35/626C04B35/632C04B35/634C04B35/638C04B35/64
CPCC04B35/58C04B35/622C04B35/62605C04B35/632C04B35/6342C04B35/638C04B35/64C04B2235/602C04B2235/6562C04B2235/6567C04B2235/661
Inventor 杨大胜施纯锡
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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