Preparation method of high-silicon aluminum alloy electronic packaging material

Abstract

The invention discloses a preparation method of a high-silicon aluminum alloy electronic packaging material. The preparation method is characterized by comprising the steps: firstly, obtaining a high-silicon aluminum alloy plate with required silicon content through a traditional casting method; then refining the high-silicon aluminum alloy plate by a rapid solidification method to obtain thin strip-shaped high-silicon aluminum alloy; finally, superposing a plurality of pieces of thin strip-shaped high-silicon aluminum alloy according to the required thickness, and performing hot-press formingto obtain the high-silicon aluminum alloy electronic packaging material with the required silicon content. According to the preparation method, a plurality of advanced preparation processes such as arapid solidification method and a hot pressing method are comprehensively adopted, on the premise of keeping relatively high silicon content, and the high-silicon aluminum alloy electronic packagingmaterial which is nearly completely densified and has two uniformly distributed phases of aluminum matrix and fine silicon is obtained, and has the advantages of simple operation, simple equipment, low porosity, excellent performance, environmental friendliness, mature technology and the like.

Description

technical field [0001] The invention relates to a preparation method of a high-silicon aluminum alloy electronic packaging material. Background technique [0002] Commonly used electronic packaging materials are divided into three categories: plastic packaging materials, ceramic packaging materials and metal packaging materials. As a new generation of electronic packaging materials, high-silicon aluminum alloy has the advantages of low density, good thermal conductivity, low thermal expansion coefficient, and good machining performance. It has been paid more and more attention in the field of electronic packaging. The application and continuous development of high-silicon aluminum alloys in the field of electronic packaging materials can make up for some defects of traditional electronic packaging materials. With the continuous improvement of preparation technology, high-silicon aluminum alloys have a very broad development space as a new type of lightweight electronic packa...

AI Technical Summary

Problems solved by technology

[0003] There are mainly the following methods for preparing high-silicon aluminum alloys: (1) Pressurized impregnation method: higher pressure is required, so the sealing performance of the mold used is higher, and the pressurization system is more complicated and cannot be widely used.

(2) Powder metallurgy method: Due to the complex process and high cost, the powder is easily oxidized and the density is not enough, it is difficult to meet the airtightness requirements of electronic packaging

(3) Spray deposition method: the requirements for equipment are too high, the cost is relatively expensive, and the preparation cycle is long