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Room temperature sintering method of nano copper conductive ink

A technology of conductive ink and sintering method, which is applied in the direction of conductive pattern formation, ink, electrical components, etc., can solve the problems of not getting conductivity, etc., and achieve the effect of simple process

Inactive Publication Date: 2019-11-15
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the few attempts (JMATER CHEM C, 2017, 5), did not get the ideal conductivity

Method used

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  • Room temperature sintering method of nano copper conductive ink
  • Room temperature sintering method of nano copper conductive ink
  • Room temperature sintering method of nano copper conductive ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) Disperse copper nanoparticles with a diameter of 11nm (prepared according to the method of I&ECR, 2018, 57) in n-octane, prepare an ink with a solid content of 30w%, put it in an ultrasonic cleaner for 2 hours, and obtain a deep red ink.

[0028] (2) Take an appropriate amount of ink on the polyethylene terephthalate (PET) film, and use the preparer to coat the film.

[0029] (3) soak the film prepared in step (2) in 10v% formic acid ethanol solution for 20s, and use formic acid to fully remove oleylamine on the surface of the particles, so that the surface of the film changes from hydrophobicity to hydrophilicity. Then wash with ethanol 3 times and blow dry.

[0030] (4) Repeat steps (2) and (3) for 3 coatings;

[0031] (5) soak the film of step (4) in 3w%NaBH 4 In the aqueous solution for 0.08-3min, then washed with water for 3 times, and dried.

[0032] The sheet resistance of the film was measured by a four-probe tester, the film thickness was measured by SEM...

Embodiment 2

[0034] (1) Disperse copper nanoparticles with a diameter of 11nm (prepared according to the method of I&ECR, 2018, 57) in n-octane, prepare an ink with a solid content of 30w%, put it in an ultrasonic cleaner for 2 hours, and obtain a deep red ink.

[0035] (2) Take an appropriate amount of ink on the polyethylene terephthalate (PET) film, and use the preparer to coat the film.

[0036] (3) Soak the film prepared in step (2) in a methanol solution of 10v% formic acid for 20s, and use formic acid to fully remove oleylamine on the surface of the particles, so that the surface of the film changes from hydrophobicity to hydrophilicity. Then wash with methanol 3 times and blow dry.

[0037] (4) Repeat steps (2) and (3) for 3 coatings;

[0038] (5) soak the film of step (4) in 0.75w% NaBH 4 In the solution for 1-9min, wash with water 3 times, and dry.

[0039] The sheet resistance of the film was measured by a four-probe tester, the film thickness was measured by SEM, and the res...

Embodiment 3

[0041] 1) Disperse copper nanoparticles with a diameter of 11nm (prepared according to the method of I&ECR, 2018, 57) in n-octane, prepare an ink with a solid content of 30w%, put it in an ultrasonic cleaner for 2 hours, and obtain a deep red ink.

[0042] 2) Take an appropriate amount of ink on the polyethylene terephthalate (PET) film, and use the preparer to coat the film.

[0043] 3) Soak the membrane prepared in step 2) in a methanol solution of 10v% acetic acid for 20s, and use formic acid to fully remove oleylamine on the surface of the particles, so that the surface of the membrane changes from hydrophobic to hydrophilic. Then wash with methanol 3 times and blow dry.

[0044] 4) Repeat steps 2) and 3) to coat the film 3 times;

[0045] 5) Soak the film of step 4) in 0.75w% NaBH 4 In the solution for 4-30min, then wash with water 3 times, and dry.

[0046] The sheet resistance of the film was measured by a four-probe tester, the film thickness was measured by SEM, an...

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Abstract

The invention discloses a room temperature sintering method of the nano copper conductive ink and belongs to the technical field of the conductive ink. The method comprises steps that a. the ink is printed or coated on a flexible film substrate with a printing machine or a film coating machine; b. the film of the step a is dipped in alcohol solution of 0.1-100 v% organic acid for 0.1-30 min, and washed with solvent for 2-4 times and blown dry; c. the steps a and b are repeated for repeated printing or coating to achieve desired thickness of the printed layer; and d. the film in the step c is dipped in a certain concentration of reducing agent solution for 0.05-60 min, and then washed with the water for 2-4 times and blown dry. The method is advantaged in that the method is suitable for thecheap nano-copper ink, sintering in the air at the room temperature is achieved, the prepared copper film has low resistivity and can be utilized on a variety of heat-sensitive and flexible substrates, and the process is simple and suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of conductive ink, in particular to a room temperature sintering method of nanometer copper conductive ink. Background technique [0002] In recent years, metal nanomaterials, as electronic functional materials, have the characteristics of easy and flexible connection, easy to achieve low-temperature sintering, and active chemical properties, and have gradually become a research hotspot in the field of microelectronics. The traditional etching method not only has serious material waste and complicated preparation process, but also has problems such as high cost and serious environmental pollution. Printed electronic technology combines printing technology and electronic technology well, and has broad application prospects. The core of this technology lies in the preparation and application of functional inks. Among them, conductive ink is an important category of functional ink and has received extensive a...

Claims

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Application Information

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IPC IPC(8): H05K3/12H05K1/09C09D11/52
CPCC09D11/52H05K1/097H05K3/1283
Inventor 王涛戴小凤
Owner TSINGHUA UNIV
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