Unsaturated resin-based composite material, preparation method and applications thereof

Abstract

The invention relates to the field of unsaturated resin materials, particularly to an unsaturated resin-based composite material, a preparation method and applications thereof, wherein the raw materials of the unsaturated resin-based composite material comprise a unsaturated resin, a thermal conduction filler and a modifier, the unsaturated resin is a unsaturated polyester resin and / or vinyl esterresin, the thermal conduction filler is alumina and silicon carbide, the modifier is polyethylene and / or polytetrafluoroethylene, and a weight ratio of the modifier to the thermal conduction filler is 15-25:400-650. According to the present invention, the thermal conductivity of the unsaturated resin-based composite material of the present invention is more than 2W / m''K, and is more than twice the thermal conductivity of the conventional unsaturated polyester resin and / or vinyl ester resin-based composite material; and the unsaturated resin (unsaturated polyester resin and / or vinyl ester resin) has good compatibility with the thermal conduction filler, such that the problem of excessive hardness caused by the addition of the thermal conduction filler can be avoided, the Barcol hardness ofthe material is less than 70, and the wear on the mold and the contact member is reduced.

Description

technical field [0001] The invention relates to the field of unsaturated resin materials, in particular to an unsaturated resin-based composite material and its preparation method and application. Background technique [0002] Unsaturated resins refer to resins containing unsaturated double bonds in their molecular chains, such as unsaturated polyester resins, vinyl ester resins, etc. Unsaturated polyester resin is the most commonly used type of thermosetting resin. It is generally a polycondensation of unsaturated dibasic acid diol or saturated dibasic acid unsaturated diol. It has ester bonds and unsaturated double bonds. type polymer compound. Because it has good heat resistance, mechanical properties, chemical corrosion resistance and dielectric properties, and has many varieties and low prices, it has been widely used. Vinyl ester resin not only retains the basic chain segment of epoxy resin, inherits the excellent characteristics of epoxy resin, but also introduces u...

AI Technical Summary

Problems solved by technology

[0005] Although aluminum nitride and boron nitride have high thermal conductivity, the water resistance of aluminum nitride is poor, which will affect the water resistance of the finished product; boron nitride is anisotropic, which will limit the direction of heat conduction

Moreover, the prices of the above two are much higher than commonly used fillers such as aluminum hydroxide and calcium carbonate. As the main raw materials with an added amount of more than half of the total weight, this will greatly limit the market promotion of finished products.

[0006] At the same time, due to the general compatibility of such fillers with high thermal conductivity with unsaturated polyester resins / vinyl ester resins, the fillers are prone to be exposed during processing; and the thermally conductive fillers with moderate physical properties and prices have their own problems. The problem of high hardness will not only greatly increase the wear on the mold during the material forming process, but also cause wear on the contact parts due to the high surface hardness of the material during application, which will increase the customer's production cost in a disguised form.

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