Charging contact structure and preparation method thereof

Abstract

The invention discloses a charging contact structure and a preparation method thereof. The charging contact structure comprises a magnet substrate and an anti-synthetic perspiration electrolytic metallayer; a surface of the magnet substrate is coated with a plating layer; the plating layer sequentially includes an anti-corrosive metal layer, an acid copper layer, a metal barrier layer from insideto outside. According to the embodiment disclosed by the invention, through electroplating of a special functional plating layer on the magnet substrate, not only the flatness and smoothness of the surface of the magnet substrate are improved, but also the effects that the magnet substrate has the performances of salt spray resistance testing, the anti-synthetic perspiration static testing and anti-synthetic perspiration electrolytic testing after an SMT (Surface Mounted Technology); and the problems that the magnet substrate in the existing charging contact structure cannot be subject to SMTor cannot be charged after being subject to SMT are solved. According to the embodiment disclosed by the invention, the magnet substrate with the coating layer is mounted to a printed circuit board through the SMT and is then magnetized; and the problems that the conventional magnets attract with each other after being magnetized and subjected to SMT and the magnets are demagnetized after encountering heat are solved.

Description

technical field [0001] The invention relates to the technical field of charging devices, in particular to a charging contact structure and a preparation method thereof. Background technique [0002] At present, the commonly used charging methods for smart wearable products include the connector method and the charging contact plus shrapnel or connector (Pogo pin) method; for example, Bluetooth wireless headsets and charging boxes use the Pogo pin charging method. Among them, the base material of the charging contact and the electroplating scheme often encounter two problems: first, the surface mount technology (SMT) soldering cannot be done after the traditional magnet electroplating; second, the contact on the product is subjected to At the same time, the friction force will also be electrolyzed by the current in the state of sweat, and the plating layer will fall off. After the plating layer falls off, the internal magnetic material that is easily oxidized is exposed, whic...

AI Technical Summary

Problems solved by technology

However, the charging contact structure with Ni-Cu-Ni coating, Cu-Ni coating or Cu coating has the following problems: 1) the surface coating is easy to burst during SMT; 2) it cannot pass the salt spray test and artificial sweat static test; 3) If the artificial sweat electrolysis test is carried out after SMT, all the coatings will be electrolyzed within 1 minute, resulting in failure to charge

The charging contact structure with Ni-Cu-Ni-Au-Ag-Pd-Au plating layer can not pass the artificial sweat electrolysis test very well, for example, after charging after SMT, all the plating layers will be electrolyzed off within 1 minute causing can't charge

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