Epoxy adhesive and application and application method thereof

A technology of epoxy adhesive and epoxy resin, which is applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., can solve the problems of high cost of etching solution, large pollution, long cycle, etc., to improve product stability and Production efficiency, production cost reduction, and the effect of reducing environmental pollution

Pending Publication Date: 2019-11-29
西安航天三沃化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the manufacturing process, the materials of the two conductive layers need to be etched separately, and then hot-pressed and laminated with the insulating protection materials on both sides respectively. Using this process will cause the conductive layer and the insulating layer on one side to undergo repeated acid and alkali corrosion. and high-temperature baking, which reduces product performance and service life, low production efficiency, high cost, and large pollution
[0003] This patent is mainly aimed at solving the problems of high energy consumption, long cycle time, high cost of etching liquid treatment, and non-compliance with environmental protection requirements in the production process of FPC light strips, so as to develop a carrier circuit material for FPC light strips without etching process

Method used

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  • Epoxy adhesive and application and application method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Prepare epoxy adhesive, raw material and preparation method are as follows:

[0021] Step 1: Put 100 parts of bisphenol A epoxy resin, 50 parts of nitrile rubber, and 15 parts of methyl ethyl ketone into a high-dispersion kettle and mix and stir for 1 hour;

[0022] Step 2: Continue to add 50 parts of kaolin, 150 parts of aluminum hydroxide and 40 parts of butanone to the mixture obtained in step 1 and mix and stir for 2 hours;

[0023] Step 3: Continue to add 1.8 parts of dicyandiamine, 0.2 parts of m-phenylenediamine, 0.1 part of triethanolamine, 0.2 parts of 2-phenyl-4 methylimidazole and 1 part of butanone into the mixture obtained in step 2 and mix and stir for 2 Hour;

[0024] Step 4: Adjust the solid content of the adhesive by adding methyl ethyl ketone solvent or prolonging the stirring time, stop stirring when the solid content is 45±2%, and prepare an epoxy adhesive.

[0025] Use the epoxy adhesive prepared according to the above process to prepare a PET cop...

Embodiment 2

[0034] Prepare epoxy adhesive, raw material and preparation method are as follows:

[0035] Step 1: Put 60 parts of bisphenol F epoxy resin, 140 parts of novolac epoxy resin, 100 parts of styrene-butadiene rubber, 20 parts of acrylic resin, and 25 parts of methyl ethyl ketone in a high-dispersion kettle and mix and stir for 2 hours;

[0036] Step 2: Continue to add 50 parts of aluminum hydroxide and 20 parts of butanone to the mixture obtained in step 1 and mix and stir for 3 hours;

[0037] Step 3: Continue to add 4 parts of phthalic anhydride, 0.5 parts of triethanolamine, 0.5 parts of 2-methylimidazole and 1 part of butanone to the mixture obtained in step 2 and mix and stir for 3 hours;

[0038] Step 4: Adjust the solid content of the adhesive by adding methyl ethyl ketone solvent or prolonging the stirring time, stop stirring when the solid content is 45±2%, and prepare an epoxy adhesive.

[0039] Use the epoxy adhesive prepared according to the above process to prepare ...

Embodiment 3

[0048] Prepare epoxy adhesive, raw material and preparation method are as follows:

[0049] Step 1: Put 180 parts of bisphenol A epoxy resin, 120 parts of brominated epoxy resin, 30 parts of nitrile rubber, 50 parts of styrene-butadiene rubber, and 20 parts of methyl ethyl ketone in a high-dispersion kettle and mix and stir for 3 hours;

[0050] Step 2: Continue to add 50 parts of kaolin, 100 parts of magnesium oxide and 30 parts of butanone to the mixture obtained in step 1 and mix and stir for 3 hours;

[0051] Step 3: Continue to add 2.6 parts of diethylenetriamine, 1.4 parts of m-phenylenediamine, 0.4 parts of triethanolamine, 0.1 part of 2-methylimidazole and 2 parts of butanone into the mixture obtained in step 2 and mix and stir for 3 hours;

[0052] Step 4: Adjust the solid content of the adhesive by adding methyl ethyl ketone solvent or prolonging the stirring time, stop stirring when the solid content is 45±2%, and prepare an epoxy adhesive.

[0053] Use the epoxy a...

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Abstract

The invention discloses an epoxy adhesive and application and an application method thereof, aiming at solving the problems of high energy consumption, long period, high etching solution treatment cost, non-compliance with environmental protection requirements and the like in the production process of FPC lamp strips. The epoxy adhesive comprises epoxy resin, a curing agent, a toughening agent, acuring accelerator, a filler and a solvent. The epoxy adhesive is used for preparing a PET copper-clad plate, and the application method comprises the following steps: firstly, uniformly coating one side or both sides of an electric insulating film with the epoxy adhesive; secondly, removing a solvent from the electric insulating film coated with the adhesive through a drying oven and drying; thirdly, rolling and laminating the electric insulating film with a semi-cured adhesive layer and a release material; and finally, curing the product to obtain the PET copper-clad plate. The epoxy adhesive and the PET copper-clad plate using the adhesive have the characteristics of low release and high stripping force, improve product stability and production efficiency, reduce environmental pollution, reduce production cost and are more green and environment-friendly.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic component materials, and in particular relates to an epoxy adhesive and its application and application method. Background technique [0002] With the development of LED lighting technology, the application fields of flexible LED lighting materials are becoming more and more extensive. Flexible LED light strips generally include a five-layer structure, including insulating materials on both sides of the outermost sides, two conductive layers in the middle, and a central insulating layer that isolates the two conductive layers. The production process of LED light strip is the conventional production process of FPC with etching. Therefore, in the manufacturing process, the materials of the two conductive layers need to be etched separately, and then hot-pressed and laminated with the insulating protection materials on both sides respectively. Using this process will cause the cond...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J109/02C09J11/04C09J7/25C09J7/30
CPCC08K2003/2227C09J11/04C09J109/02C09J163/00C09J2463/00C09J2467/006C09J7/255C09J7/30C08L9/02C08K3/346C08K3/22
Inventor 燕莎罗保卢亢朱江花马荔高建宾郭茜王培
Owner 西安航天三沃化学有限公司
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