Stacked tile component, solar cell sheet and manufacturing method of stacked tile component

Abstract

The invention relates to a stacked tile component, a solar cell sheet and a manufacturing method of the stacked tile component. A plurality of solar cell sheets in the stacked tile component are successively connected in a stacked tile mode at a first direction. A positive electrode extending along a second direction is arranged on a top surface of a matrix sheet of each solar cell sheet. A back electrode or a back electric field is arranged on a bottom surface of the matrix sheet. When the two solar cell sheets are connected in the stacked tile mode along the first direction, the positive electrode of one of the two solar cell sheets is directly contacted with the back electrode or the back electric field of the other solar cell sheet so as to achieve conductive connection. In the invention, the solar cell sheets are conductively interconnected through direct contact between the positive electrode and the back electrode so that conductivity of a binder is not required. Due to the arrangement, manufacturing cost can be reduced, and an existing possible problem generated due to existence of a conductive adhesive can be avoided.

Description

technical field [0001] The invention relates to the field of energy, in particular to a method for manufacturing a shingled assembly, a solar battery sheet and a shingled assembly. Background technique [0002] With the accelerated consumption of conventional fossil energy such as coal, oil, and natural gas around the world, and the continuous deterioration of the ecological environment, especially the increasingly severe global climate change caused by greenhouse gas emissions, the sustainable development of human society has been seriously threatened. Countries around the world have formulated their own energy development strategies to deal with the limitation of conventional fossil energy resources and the environmental problems brought about by their development and utilization. Solar energy has become one of the most important renewable energy sources due to its reliability, safety, extensiveness, longevity, environmental protection, and resource adequacy, and is expect...

AI Technical Summary

Problems solved by technology

The most serious is the occurrence of current virtual connection or even open circuit. The main reason is generally that the connection ability between materials is weak after combination.

The weak connection ability is mainly manifested in the fact that the conductive adhesive operation in the manufacturing process requires a process operation window. In the actual production process, this window is relatively narrow and is very susceptible to environmental factors, such as the temperature and humidity of the workplace, and the time spent in the air after the glue is applied. The length and so on will make the conductive glue lose its activity

At the same time, uneven sizing and lack of sizing are prone to occur due to changes in the characteristics of the glue under dispensing, spraying or printing processes, which will have great hidden dangers to product reliability.

Secondly, the conductive adhesive is mainly composed of polymer resin and a large amount of precious metal powder, which is expensive and destroys the ecological environment to a certain extent (the production and processing of precious metals are more polluting to the environment)

Furthermore, the conductive adhesive is a paste, which has a certain degree of fluidity during the glue sizing or lamination process, and it is very easy to overflow the glue and cause a short circuit between the positive and negative poles of the shingled interconnected battery string.

[0007] That is to say, for most of the shingled components made of conductive adhesive bonding, there are problems such as weak interconnection strength, high environmental requirements for the process, easy short-circuit of the process using glue overflow, high cost of use, and low production efficiency.

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