Cr-Sb phase change storage material and preparation and application thereof
A phase-change storage, cr-sb technology, applied in the field of microelectronics, can solve problems such as difficulty in amorphization, and achieve the effects of fast crystallization, simple components, and reduced preparation process requirements.
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2019-12-13
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of microelectronics, and more specifically relates to a Cr-Sb phase-change storage material and its preparation and application. Background technique
[0002] Phase change storage is based on phase change storage materials (mostly chalcogenides) between the amorphous state (low refractive index, high resistance state "1") and crystalline state (high refractive index, low resistance state "0") Reversible and rapid transition to achieve data storage and erasing, and this transition is non-volatile, that is, no additional energy is required to maintain the current state. The data is then read out by measuring changes in the material's electrical resistance or refractive index. Generally speaking, phase-change memory materials have at least two states with different structures, that is, an amorphous state and one (or more) crystalline states, and due to the huge structural difference, the two-state materials ha...
Examples
Embodiment 1
[0035] The general formula of the chemical composition of the nano-Cr-Sb phase-change film material used for phase-change memory prepared in this embodiment is Cr 10 Sb 90 .
[0036] The Cr-Sb nano film material is prepared by magnetron sputtering; during the preparation, high-purity argon is introduced as the sputtering gas, the sputtering pressure is 0.5 Pa, and the background vacuum is required to be 10 -4 Below Pa; the sputtering target is Cr 10 Sb 90 The alloy target is sputtered by a DC source, the sputtering power is 32W, and the target base distance is set to 120mm. Concrete preparation method comprises the following steps:
[0037] (1) Select SiO with a size of 1cm*1cm 2 / Si(100) substrate, clean the surface and back, remove dust particles, organic and inorganic impurities. Specifically, the following steps may be included:
[0038] (1-1) Cut out 1cm*1cm of SiO with a silicon wafer knife 2 / Si (100) substrate, used as the substrate for sputtering;
[0039] (1...
Embodiment 2
[0054] The general formula of the chemical composition of the nano-Cr-Sb phase-change film material used for phase-change memory prepared in this embodiment is Cr 5 Sb 95 .
[0055]The Cr-Sb nano film material is prepared by magnetron sputtering; during the preparation, high-purity argon is introduced as the sputtering gas, the sputtering pressure is 0.5 Pa, and the background vacuum is required to be 10 -4 Below Pa; the sputtering target is Cr 5 Sb 95 The alloy target is sputtered by a DC source, the sputtering power is 32W, and the target base distance is set to 120mm. Concrete preparation method comprises the following steps:
[0056] (1) Select SiO with a size of 1cm*1cm 2 / Si(100) substrate, clean the surface and back, remove dust particles, organic and inorganic impurities. Specifically, the following steps may be included:
[0057] (1-1) Cut out 1cm*1cm of SiO with a silicon wafer knife 2 / Si (100) substrate, used as the substrate for sputtering;
[0058] (1-2)...
Embodiment 3
[0070] The general formula of the chemical composition of the nano-Cr-Sb phase-change film material used for phase-change memory prepared in this embodiment is Cr 30 Sb 70 .
[0071] The Cr-Sb nano film material is prepared by magnetron sputtering; during the preparation, high-purity argon is introduced as the sputtering gas, the sputtering pressure is 0.5 Pa, and the background vacuum is required to be 10 -4 Below Pa; the sputtering target is Cr 30 Sb 70 The alloy target is sputtered by a DC source, the sputtering power is 32W, and the target base distance is set to 120mm. Concrete preparation method comprises the following steps:
[0072] (1) Select SiO with a size of 1cm*1cm 2 / Si(100) substrate, clean the surface and back, remove dust particles, organic and inorganic impurities. Specifically, the following steps may be included:
[0073] (1-1) Cut out 1cm*1cm of SiO with a silicon wafer knife 2 / Si (100) substrate, used as the substrate for sputtering;
[0074] (1...