Conductive polyphenylene ether/polyamide 66 composition and its preparation method
A technology of polyamide and polyphenylene ether, which is applied in the field of conductive polyphenylene ether/polyamide 66 composition and its preparation, can solve the problems of flexibility, low mass density aspect ratio, difficult dispersion of polymers, etc., and achieve excellent mechanical properties, Effect of improving electrical conductivity, improving yellowing phenomenon and thermal stability
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Embodiment 1
[0073] In this embodiment, a conductive polyphenylene ether / polyamide 66 composition is prepared from the following raw materials in parts by weight:
[0074]
[0075] The preparation method of above-mentioned conductive polyphenylene ether / polyamide 66 composition, comprises the following steps:
[0076] (1) After drying the high-viscosity polyphenylene ether resin and the low-viscosity polyphenylene ether resin at a temperature of 80°C for 8 hours, and drying the low-viscosity polyamide 66 resin at a temperature of 110°C for 8 hours , cooling, the cooled high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, low-viscosity polyamide 66 resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate and pentaerythritol zinc were added to the high-speed mixer (the speed was 1000 rpm / min) for mixing;
[0077] (2) the styrene and glycidyl methacrylate copolyme...
Embodiment 2
[0081] In this embodiment, a conductive polyphenylene ether / polyamide 66 composition is prepared from the following raw materials in parts by weight:
[0082]
[0083] The preparation method of above-mentioned conductive polyphenylene ether / polyamide 66 composition, comprises the following steps:
[0084] (1) After drying the high-viscosity polyphenylene ether resin and the low-viscosity polyphenylene ether resin at a temperature of 110°C for 4 hours, and drying the low-viscosity polyamide 66 resin at a temperature of 140°C for 4 hours , cooling, the cooled high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, low-viscosity polyamide 66 resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate and pentaerythritol zinc were added to the high-speed mixer (the speed was 1000 rpm / min) for mixing;
[0085] (2) the styrene and glycidyl methacrylate copolym...
Embodiment 3
[0089] In this embodiment, a conductive polyphenylene ether / polyamide 66 composition is prepared from the following raw materials in parts by weight:
[0090]
[0091] The preparation method of above-mentioned conductive polyphenylene ether / polyamide 66 composition, comprises the following steps:
[0092] (1) After drying the high-viscosity polyphenylene ether resin and the low-viscosity polyphenylene ether resin at a temperature of 90°C for 6 hours, and drying the low-viscosity polyamide 66 resin at a temperature of 120°C for 6 hours , cooling, the cooled high-viscosity polyphenylene ether resin, low-viscosity polyphenylene ether resin, low-viscosity polyamide 66 resin, and the N,N'-bis(2,2,6,6-tetramethyl- 4-piperidinyl)-1,3-benzenedicarboxamide, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphate and pentaerythritol zinc were added to the high-speed mixer (the speed was 1000 rpm / min) for mixing;
[0093] (2) the styrene and glycidyl methacrylate copolyme...
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