Aluminum alloy lead frame and manufacturing method thereof

A technology of aluminum alloy wire and manufacturing method, which is applied in the field of lead frames, can solve the problems of weakening the bonding force between the reflective layer and aluminum, the decrease of the bonding force of the plating layer, and the falling off of the welding wire, so as to improve the application value, improve the adhesion, and reduce the weight. Effect

Active Publication Date: 2021-03-23
安森科技材料股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, aluminum has a strong affinity with oxygen, and the surface is easy to form an oxide film to weaken the bonding force between the reflective layer and aluminum, and aluminum is an amphoteric metal with high chemical activity. The corrosion of the aluminum surface caused by the pre-coating treatment will reduce the bonding force of the coating; Reflective coating stripping, soldering layer separation, or soldering wire falling off, so the base material of the lead frame is still mostly copper and its alloy

Method used

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  • Aluminum alloy lead frame and manufacturing method thereof
  • Aluminum alloy lead frame and manufacturing method thereof
  • Aluminum alloy lead frame and manufacturing method thereof

Examples

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Embodiment 1

[0054] Embodiment 1: Aluminum Alloy Lead Frame

[0055] Such as figure 1 As shown, the aluminum alloy lead frame of Example 1 was prepared by the following method. First of all, 5005 series aluminum-magnesium alloy is selected as the aluminum alloy substrate L1, and its thickness is 0.3mm; the substrate can be in the form of a coil and manufactured by a continuous process. Using vacuum coating technology, a first intermediate layer L2 is formed on the upper surface 11 of the aluminum alloy substrate L1. The first intermediate layer L2 is a titanium metal layer with a thickness of 20 nm; A functional layer L3 is formed on the upper surface, the functional layer L3 is a copper layer with a thickness of 800nm; and then a second intermediate layer L6 is formed on the lower surface 12 of the aluminum alloy substrate L1 by vacuum coating technology, and the second intermediate layer L6 is a titanium metal layer , with a thickness of 20nm; in the next step, a welding layer L7 is fo...

Embodiment 2

[0057] Embodiment 2: Aluminum Alloy Lead Frame

[0058] Such as figure 2 As shown, the aluminum alloy substrate of Example 2 is manufactured by using the vacuum coating technology throughout the manufacturing process through the following method. First, 1085 series aluminum alloy is selected as the aluminum alloy substrate L1, and its thickness is 0.2mm; the substrate can be in the form of a coil and manufactured by a continuous process. A first intermediate layer L2 is formed on the upper surface 11 of the aluminum alloy substrate L1, and the first intermediate layer L2 is a titanium oxide layer (TiO x ), its thickness is 10nm; Then, form functional layer L3 on the first intermediate layer L2, functional layer L3 is a copper layer, its thickness is 800nm; And form reflective layer L4 on functional layer L3, reflective layer L4 is silver layer , its thickness 1000nm; Form the first protective layer L5 on the reflective layer L4 again, the first protective layer L5 is a sili...

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Abstract

The invention provides an aluminum alloy lead frame and a manufacturing method thereof. The lead frame provides an aluminum alloy substrate with an upper surface and a lower surface opposite to each other. A reflective composite layer is arranged on the upper surface. The reflective composite layer comprises a first intermediate layer, a functional layer, and a reflective layer in order. The firstintermediate layer is arranged between the aluminum alloy substrate and the functional layer, and a welding composite layer is arranged on the lower surface thereof. The welding composite layer comprises a second intermediate layer, a welding layer, and a second protective layer in order. The second intermediate layer is arranged between the aluminum alloy substrate and the welding layer to acquire an aluminum alloy lead frame. According to the invention, the binding force of the functional layer and the welding layer with the aluminum alloy substrate is improved, so that the problems of pooradhesion of the film layers of a general aluminum alloy substrate and poor reflectivity of the existing copper alloy lead frame are improved; the application value is improved; and furthermore, the lead frame with advantages in price and weight is provided.

Description

technical field [0001] The invention relates to a lead frame, especially an aluminum alloy lead frame. Background technique [0002] Light Emitting Diode (LED: Light Emitting Diode) is a light-emitting device as a light source. Its characteristics of high brightness, low energy consumption, small size, long life, and stable performance make it widely and rapidly developed. When the dies are bonded on the lead frame to form various types of LEDs, the lead frame shoulders the requirements of high light extraction performance, better electrical conductivity and thermal conductivity; the copper alloy lead frame commonly used in the market has the characteristics of good thermal conductivity and good electrical conductivity. In addition, a reflective metal layer is provided on the surface of the copper alloy lead frame, which can effectively extract the light source emitted from the LED element. Such as China Taiwan Invention Patent No. I564406 LED copper alloy lead frame and it...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/60H01L23/495
CPCH01L23/49582H01L33/60H01L33/62H01L2933/0066
Inventor 德瑞克·提罗蔡鸿麟高于迦
Owner 安森科技材料股份有限公司
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