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A kind of preparation method of ceramic-based conductive adhesive material

A conductive adhesive, ceramic-based technology, used in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of limited application range, easy oxidation of metal powder, affecting performance, etc., and achieve excellent conductive effect.

Active Publication Date: 2020-12-15
JIAXING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the volume resistivity of conductive adhesives used in some high-tech fields in the domestic market is generally 10 -4 Q cm, some conductive adhesives cured at high temperature can reach 10 -5 Q cm, but the scope of use is limited, because heating may cause problems such as deformation and thermal aging of electronic components, which will affect their performance
Metal powder has extremely low resistance, but is easy to oxidize. In order to obtain a lower resistance value and overcome the disadvantages of metal powder being easy to oxidize, conductive ceramic powder with excellent electrical conductivity and oxidation resistance has gradually become a recent research hotspot.

Method used

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  • A kind of preparation method of ceramic-based conductive adhesive material
  • A kind of preparation method of ceramic-based conductive adhesive material

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A preparation method of a ceramic-based conductive adhesive material, comprising the following steps:

[0017] S1. TiB 2 Dissolve the nanopowder in ethanol and ultrasonically disperse evenly, then add it into the liquid polyacrylonitrile oligomer, and mill it evenly in a ball mill. The speed of the ball mill is 500r / min, and the milling time is 2h to obtain a mixture. The cured product was pre-oxidized in the air, and then the cured product was sintered at 1200 ° C for 2 hours to obtain graphene-based carbon-coated TiB 2 ;

[0018] S2. Dissolve the aniline monomer in an aqueous solution of 0.045mol / L sodium dodecylbenzenesulfonate and then add the graphene-based carbon-coated TiB prepared in S1 2 , sonicated uniformly, in which 2 mL of aniline and 0.2 g of graphene-based carbon-coated TiB were added per 100 mL of sodium dodecylbenzenesulfonate aqueous solution 2 , to obtain suspension A;

[0019] S3. Dissolve ammonium persulfate in 0.1mol / L hydrochloric acid aqueous...

Embodiment 2

[0023] A preparation method of a ceramic-based conductive adhesive material, comprising the following steps:

[0024] S1. TiB 2 Dissolve the nano-powder in ethanol and ultrasonically disperse evenly, then add it to the liquid polyacrylonitrile oligomer, and mill it evenly in a ball mill. The speed of the ball mill is 700r / min, and the milling time is 4h to obtain a mixture. The cured product was pre-oxidized in the air, and then the cured product was sintered at 800 ° C for 6 hours to obtain graphene-based carbon-coated TiB 2 ;

[0025] S2. Dissolve the aniline monomer in an aqueous solution of 0.045mol / L sodium dodecylbenzenesulfonate and then add the graphene-based carbon-coated TiB prepared in S1 2 , ultrasonic homogeneity, wherein, every 100 mL of sodium dodecylbenzenesulfonate aqueous solution was added 2 mL of aniline and 0.4 g of graphene-based carbon-coated TiB 2 , to obtain suspension A;

[0026] S3. Dissolve ammonium persulfate in 0.15 mol / L hydrochloric acid aqu...

Embodiment 3

[0030] A preparation method of a ceramic-based conductive adhesive material, comprising the following steps:

[0031] S1. TiB 2 Dissolve the nano-powder in ethanol and ultrasonically disperse evenly, then add it into the liquid polyacrylonitrile oligomer, and mill it evenly in a ball mill. The speed of the ball mill is 600r / min, and the milling time is 4h to obtain a mixture. Pre-oxidized in the air to obtain a cured product, and then sintered the cured product at 950 ° C to obtain a graphene-based carbon-coated TiB 2 ;

[0032] S2. Dissolve the aniline monomer in an aqueous solution of 0.045mol / L sodium dodecylbenzenesulfonate and then add the graphene-based carbon-coated TiB prepared in S1 2 , ultrasonic homogeneity, wherein, every 100mL of sodium dodecylbenzenesulfonate aqueous solution was added 2mL of aniline and 0.2-0.4g of graphene-based carbon-coated TiB 2 Suspension A is obtained;

[0033] S3. Dissolve ammonium persulfate in 0.13 mol / L hydrochloric acid aqueous so...

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Abstract

The invention provides a preparation method of a ceramic-based electrically conductive adhesive material. The preparation method comprises the following steps: S1, preparing graphene-based carbon-coated TiB2; S2, preparing a suspension A; S3, preparing a electrically conductive TiB2-C-PANI; S4, mixing E-51 epoxy resin, glycerol epoxy resin, an organosilicone defoaming agent KS-603, methylhexahydrophthalic anhydride and 2-ethyl-4-methylimidazole in a mass ratio of (100-120):(25-35):(3-5):(40-50):(1-4) to obtain matrix resin; and S5, adding the electrically conductive TiB2-C-PANI prepared in thestep S3 into the matrix resin, and uniformly mixing the materials to obtain the uncured electrically conductive adhesive. The ceramic adhesive electrically conductive material has excellent electrical conductivity, and is not easy to deform and thermally age during use.

Description

technical field [0001] The invention relates to the field of novel conductive adhesive materials, in particular to a preparation method of ceramic-based conductive adhesive materials. Background technique [0002] Conductive adhesive is a special adhesive with conductive properties. It is usually mainly composed of matrix resin and conductive filler. The conductive filler is the basis for the conductive adhesive to realize the conductive connection, and the matrix resin mainly plays a supporting role. Through The bonding effect connects the conductive fillers to form a conductive path, and realizes the conductive connection of the materials to be connected. Conductive adhesive has many advantages. For example, it can be cured at a lower temperature or even at room temperature, which can avoid material deformation and component damage caused by high temperature during welding; it can avoid stress concentration of riveting and loss and leakage of electromagnetic signals. At p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/04C09J11/08
CPCC08K2201/001C08L2201/04C08L2205/025C08L2205/03C09J9/02C09J11/04C09J11/08C09J163/00C08L63/00C08L79/02C08K9/10C08K3/042C08K3/38
Inventor 沈丽尧
Owner JIAXING UNIV