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Grinding method of large-size single crystal diamond

A single crystal diamond, large-size technology, used in grinding/polishing equipment, grinding machines, metal processing equipment, etc., can solve the problems of poor surface accuracy, large surface and sub-surface damage, and low diamond processing efficiency. High precision, less machining damage and less energy consumption

Active Publication Date: 2020-02-11
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the existing problems of low diamond processing efficiency, poor surface accuracy, large surface and subsurface damage, etc., and provide a grinding method for large-size single crystal diamond

Method used

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  • Grinding method of large-size single crystal diamond
  • Grinding method of large-size single crystal diamond
  • Grinding method of large-size single crystal diamond

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Mix the base material, active abrasive and hard abrasive evenly and sieve. The above base material is copper powder with a particle size of 50 μm and a density of 8.92 g / cm 3 . The above-mentioned active abrasive is iron powder with a particle size of 40 μm, and the hard abrasive is aluminum oxide with a particle size of 40 μm. The mass ratio of the active abrasive to the hard abrasive is 1:2, and the mass ratio of the matrix material to the sum of the hard abrasive and the active abrasive is 1:2;

[0035] (2) Mix the material obtained in step (1) with starch and aluminum oxide hollow spheres and sieve evenly, then add dextrin and mix and sieve. The final concentration of the spheres is 30wt%, and the size of the alumina hollow spheres is 40 μm;

[0036] (3) After the material obtained in step (2) is cold-pressed and molded, it is sintered to make a grinding wheel; the sintering process is specifically: the temperature is raised from room temperature to 300°C at a...

Embodiment 2

[0040] (1) Mix the base material, active abrasive and hard abrasive evenly and sieve. The above base material is ceramic powder with a particle size of 1 μm and a density of 2.6 g / cm 3 . The above-mentioned active abrasive is iron powder with a particle size of 10 μm, the hard abrasive is alumina with a particle size of 10 μm, the mass ratio of the active abrasive to the hard abrasive is 1:2, and the mass of the sum of the matrix material, the hard abrasive and the active abrasive is The ratio is 1:2;

[0041] (2) Mix the material obtained in step (1) with starch and aluminum oxide hollow spheres and sieve evenly, then add dextrin and mix and sieve. The final concentration of spheres is 30wt%;

[0042] (3) After the material obtained in step (2) is cold-pressed and molded, it is sintered to make a grinding wheel; the sintering process is specifically: the temperature is raised from room temperature to 300°C at a heating rate of 2.5°C / min, and the heating time is 120min. The...

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Abstract

The invention discloses a grinding method of a large-size single crystal diamond. Carbon atoms of the large-size single crystal diamond and active abrasive are utilized to have a chemical reaction under specific grinding conditions, carbide is generated, then the generated carbide is removed by using a hard abrasive material, and the purpose of high-efficiency and high-quality grinding of the diamond surface is achieved. Grinding fluid adopted by the grinding method is deionized water, and has no pollution to the environment. According to the grinding method, the grinding process parameter (rotating speed) is far lower than that of dynamic friction machining. Compared with a traditional diamond graphitization removal mode, the grinding method can obtain the high-quality diamond surface with lower surface roughness, fewer cracks and shallower grooves. According to the grinding method, the processing cost is effectively reduced, and a good foundation is laid for the application of the large-size single crystal diamond in the field of high and new technology.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision grinding, and in particular relates to a grinding method of large-size single crystal diamond. Background technique [0002] Single crystal diamond has a unique face-centered cubic lattice structure, and has excellent physical, chemical and electrical properties, such as: high thermal conductivity, is an ideal heat dissipation material for electronic devices; good light transmission, is an infrared optical window and high The ideal material for the power laser window; good chemical stability is the guarantee for the device to be used stably in harsh environments; wide band gap is the guarantee for high stability and high reliability of semiconductor devices. These excellent properties make it the most ideal material for third-generation semiconductors. However, since diamond is the hardest substance in nature, single crystal diamond has the characteristics of high hardness and high brittl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/22B24B1/00
CPCB24B19/22B24B1/00H01L21/02013B24B9/16B24D18/0009
Inventor 陆静马忠强徐西鹏王艳辉罗求发
Owner HUAQIAO UNIVERSITY