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Modified phenol formaldehyde resin thermal insulation board and preparation method thereof

A technology of phenolic resin and thermal insulation board, which is applied in the field of building thermal insulation materials, can solve the problems of failure to exert effective fire protection performance, unfavorable long-term use, inconvenience in construction and transportation, etc., and achieves convenience in transportation and construction operations, enhanced rigidity, and performance The effect of green environmental protection

Inactive Publication Date: 2020-02-14
天津市天地阳光保温材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, compared with polyurethane rigid foam, modified phenolic resin insulation board has the disadvantages of high brittleness and high acidity.
If the brittleness is high, there will be problems such as powder falling, low elasticity, low compressive strength, low tensile strength and thermal conductivity of the insulation board during use, so that its own excellent fireproof performance cannot be effectively exerted; and it is harmful to construction. and transportation have caused a lot of inconvenience
High acidity will corrode the metal, cement and other substrates in contact with the insulation board, which is not conducive to long-term use

Method used

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  • Modified phenol formaldehyde resin thermal insulation board and preparation method thereof

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Comparison scheme
Effect test

Embodiment 1

[0032] A kind of modified phenolic resin insulation board of embodiment 1, it is prepared by following method:

[0033] Take by weighing 64kg of nanoclay and 112kg of deionized water, fully stir and mix; add 25wt% ammonia water to adjust the pH of the solution to 8, and obtain the modified solution;

[0034] Peel the willow branches and immerse them in the above-mentioned modifying solution; apply constant temperature and pressure at 0.12 MPa and 25°C for 48 hours, at this time, the nano-clay in the modifying solution is brown-black; take out the willow branches and crush them to a length of 2-3mm , a strip fiber with a thickness of 0.5-1 mm, dried to obtain modified willow fiber;

[0035] Take by weighing 15 kg of the above-mentioned modified willow fiber, 80 kg of phenolic resin, 30 kg of hollow glass microspheres with a particle diameter of 50-80 μm, 5 kg of calcium carbonate and 3 kg of surfactant, and mix to obtain a mixture; add 95kg of deionized water was fully stirred...

Embodiment 2

[0038] A kind of modified phenolic resin insulation board of embodiment 2, it is prepared by following method:

[0039] Take by weighing 70kg of nanoclay and 123kg of deionized water, fully stir and mix; add 25wt% ammonia water to adjust the pH of the solution to 8, and obtain the modified solution;

[0040] Peel the willow branches and immerse them in the above-mentioned modifying solution; apply constant temperature and pressure at 0.13 MPa and 30°C for 48 hours, at this time, the nano-clay in the modifying solution is brown-black; take out the willow branches and crush them to a length of 2-3mm , a strip fiber with a thickness of 0.5-1 mm, dried to obtain modified willow fiber;

[0041]Take by weighing 20 kg of the above-mentioned modified willow fiber, 100 kg of phenolic resin, 35 kg of vitrified microbeads with a particle diameter of 50-80 μm, 6 kg of water glass and 3 kg of surfactant, and mix to obtain a mixture; add 123kg of deionized water was fully stirred evenly to...

Embodiment 3

[0044] A kind of modified phenolic resin insulation board of embodiment 3, it is prepared by following method:

[0045] Take by weighing 80kg of nanoclay and 140kg of deionized water, fully stir and mix; add 25wt% ammonia water to adjust the pH of the solution to 8, and obtain the modified solution;

[0046] Peel the willow branches and immerse them in the above-mentioned modifying solution; apply constant temperature and pressure at 0.13 MPa and 40°C for 48 hours, at this time, the nano-clay in the modifying solution is brown-black; take out the willow branches and crush them to a length of 2-3mm , a strip fiber with a thickness of 0.5-1 mm, dried to obtain modified willow fiber;

[0047] Take by weighing 20kg of the above-mentioned modified willow fiber, 120 kg of phenolic resin, 45 kg of expanded perlite with a particle size of 50-80 μm, 6 kg of silicon carbide and 5 kg of surfactant, and mix to obtain a mixture; add 147kg deionized water, fully stirred evenly, to obtain a...

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Abstract

The invention relates to the technical field of building thermal insulation materials, particularly to a modified phenol formaldehyde resin thermal insulation board, which comprises the following rawmaterials by weight: 80-130 parts of a phenol formaldehyde resin, 30-50 parts of an inorganic filler, 15-25 parts of modified plant fiber, 5-10 parts of a foaming agent, 3-5 parts of a curing agent and 3-5 parts of a surfactant, wherein the modified plant fibers comprise one or a plurality of materials selected from modified willow branch fibers, modified wisteria fibers and modified vinca major lfibers. According to the invention, the defects of high brittleness and high acidity of the traditional modified phenol formaldehyde resin thermal insulation board are overcome; by modifying the specific plant fibers, the specific toughness of the plant fibers is further improved, and the toughening effect is remarkable; and the modified plant fibers are weakly alkaline and are matched with otherraw materials, so that the acidity of the modified phenol formaldehyde resin thermal insulation board is reduced. The invention further provides a preparation method of the modified phenol formaldehyde resin thermal insulation board, wherein the preparation method has advantages of simpleness and easy operation.

Description

technical field [0001] The invention relates to the technical field of building thermal insulation materials, in particular to a modified phenolic resin thermal insulation board and a preparation method thereof. Background technique [0002] Modified phenolic resin insulation board is made of phenolic foam, the main components of which are phenol and formaldehyde. , curing agent and other additives made of closed-cell rigid foam. Phenolic foam is made of phenolic resin as the main raw material, adding curing agent, foaming agent and other auxiliary components. When the resin is cross-linked and cured, the foaming agent generates gas and disperses in it to form a foamed plastic. [0003] Under the direct action of the flame, the modified phenolic resin insulation board has carbon formation, no dripping, no curling, and no melting phenomenon; after the flame burns, a layer of "graphite foam" is formed on the surface to effectively protect the foam structure in the layer , th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/06C08L97/02C08K13/04C08K7/28C08K3/34C08K3/26C08K7/26C08K7/20C08J9/08
CPCC08J9/08C08J9/0061C08J9/0071C08J9/0066C08J9/0095C08J2361/06C08J2497/02C08J2203/02
Inventor 王忠义
Owner 天津市天地阳光保温材料有限公司
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