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Tape for processing wafer

A technology for pasting wafers and tapes, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve problems such as contamination of reflow equipment, debris, wafer surface contamination, etc.

Active Publication Date: 2020-02-14
ONOHAKOBI TECH INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, when the curing of the thermosetting components is incomplete, the existing sheet used to form a protective film is laminated on the back of the wafer, and there are problems in the process of transporting the product to the next process due to the weakening of the adhesive force. disengagement problem
In addition, problems such as cracking or chipping (chipping: the state where the cutting line is torn during the scribing process) may occur depending on the curing state of the resin during the dicing process of the cured thermosetting protective film layer. Part of the cured resin is broken during the reflow process and expands to cracks, so the wafer surface may be contaminated by resin fragments or powder
In this case, the process needs to add 2 to 3 times of washing processes, and there is a problem that the debris or powder of the resin will pollute the reflow device, thereby increasing the maintenance / warranty cost of the instrument

Method used

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  • Tape for processing wafer
  • Tape for processing wafer
  • Tape for processing wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] Example 1. Manufacture of Tape for Wafer Processing

[0089] 1.1. Manufacture of the lower peeling part

[0090] A PET film with a thickness of approximately 10 μm was prepared, and a silicon-based release agent was coated on one side of the PET film with a thickness of 1 μm to manufacture a lower release portion film.

[0091] 1.2. Manufacture of the main body

[0092] 5 g of carbon black was mixed in 95 g of polyimide to prepare a substrate layer composition, and cured into a plate shape to produce a black polyimide film with a thickness of 13 μm. In addition, 50 g of toluene, 20 g of methyl ethyl ketone, 7.0 g of benzenedicarboxylic acid (a mixture of 1,3-benzenedicarboxylic acid and 1,4-benzenedicarboxylic acid), 1.4 g of sebacic acid, 2.8 g of 2,2-Dimethyl-1,3-propanediol, 13.8 g of ethylene glycol, and 5 g of poly(hexamethylene diisocyanate) were mixed to prepare a hot-melt adhesive composition.

[0093] The hot-melt adhesive composition was applied to one side...

Embodiment 2 to 7

[0098] Embodiment 2 to 7, the manufacture of tape for wafer processing

[0099] In said Example 1.2., except that the composition of the hot-melt adhesive composition was changed to the following Table 1, the tape for wafer processing was produced by the same method as in Example 1.

[0100] 【Table 1】

[0101]

experiment example 1

[0106] Experimental Example 1. Confirmation of Tape Characteristics for Wafer Processing

[0107] After the tapes for wafer processing manufactured according to Examples 1 to 7 and Comparative Examples 1 to 4 are applied to mirror wafers, lamination, oven curing (Oven Cure), cutting (Sawing), UV irradiation and disassembly (Detach), and each process was evaluated and the results are shown in Table 3.

[0108] At this time, each evaluation method is described as follows:

[0109] 1.1. Evaluation of Rework

[0110] After removing the lower peeling layer of the adhesive layer for protecting the tape for wafer processing, a lamination process was performed at 60° C. for 30 seconds using a roll laminator, and the tape for wafer processing was passed to have a thickness of 120 μm, an 8-inch The outer diameter of the silicon wafer shape is cut and processed.

[0111] After re-attaching the wafer processing tape attached to the wafer, the lamination process is performed again using...

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Abstract

The present invention relates to a tape for processing a wafer, which comprises a main body unit and an upper peeling unit, wherein the main body unit includes a base material layer including an adhesive layer and a pigment, and the upper peeling unit includes an upper peeling adhesive layer and an upper peeling base material layer. In addition, the adhesive layer has strengthened adhesion by heattreatment.

Description

[0001] Cross References to Related Applications [0002] This application claims priority and benefit from Korean Patent Application No. 10-2018-0125441 filed on October 19, 2018, which is hereby incorporated by reference for all purposes as if fully set forth herein. technical field [0003] The invention relates to a tape for wafer processing and a manufacturing method thereof. Background technique [0004] As a method of attaching (mounting) a semiconductor chip on a circuit board, there is a method of performing direct welding by using an electrode pattern under the chip without using an intermediate medium such as a metal wire or a ball grid array (BGA), which is called flip-chip method. [0005] The flip-chip method uses a leadless semiconductor without leads, so that the size of the semiconductor package and the chip is the same, so that miniaturization and weight reduction can be achieved, and the distance (pitch) between electrodes can be fine-tuned. The advantage...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J7/35C09J167/02C09J175/06C08L79/08C08K3/04C08J5/18H01L21/67
CPCC08J5/18C08J2379/08C08K3/04C09J2467/00C09J2467/005C09J2475/00C09J2479/086C09J7/25C09J7/35C09J2301/122C09J2301/304H01L21/67132C09J11/04C09J167/00C09J183/04C09J2203/326C09J7/20C09J7/40C09J2301/312H01L21/67098H01L21/6836
Inventor 罗丙淳全成浩
Owner ONOHAKOBI TECH INST CO LTD