Digital twinning model for manufacturing process of flexible circuit board

A flexible circuit board and manufacturing process technology, which is applied in CAD circuit design, CAD numerical modeling, design optimization/simulation, etc., can solve problems such as implementation prediction exceptions, and achieve the goals of reducing production costs, improving production efficiency, and increasing yield Effect

Inactive Publication Date: 2020-02-14
WUHAN UNIV
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to address the current problems in the manufacturing process of flexible circuit boards, and propose a digital twin model for the manufacturing process of flexible circuit boards, so as to optimize the manufacturing parameters of each process and implement abnormal prediction

Method used

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  • Digital twinning model for manufacturing process of flexible circuit board

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Embodiment Construction

[0031] Below in conjunction with accompanying drawing and specific embodiment the present invention will be described in further detail:

[0032] An embodiment of the present invention provides a digital twin model for a flexible circuit board manufacturing process.

[0033] In the punching process, the coordinate information of the drill bit, the chip shape image information, the drilling force and the drilling temperature are monitored and collected, and the data are transmitted to the thermodynamic model and data processing platform of the punching process.

[0034] Establish the punching process thermodynamic model corresponding to the physical space punching process in the virtual space, construct the finite element solid model of the punching process, and establish the heat conduction control equation according to the Fourier heat transfer law and the law of energy conservation to punch holes The information collected by the process is used as the simulation input. Based...

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Abstract

The invention discloses a digital twinning model for a manufacturing process of a flexible circuit board. The digital twinning model of the flexible circuit board manufacturing process is composed ofthree parts, namely a physical space, a virtual space, a data information chain and a data processing system, wherein the physical space is the manufacturing process of the flexible circuit board, wherein the virtual space is a flexible circuit board manufacturing process model, and a virtual entity system model capable of representing the full life cycle of flexible circuit board manufacturing isconstructed in the virtual information space. The data information chain and the data processing system are information transmission chains connected with the physical space and the virtual space, and the transmitted information is subjected to artificial intelligence analysis through the information processing system. According to the digital twinning model for the manufacturing process of the flexible circuit board, real-time monitoring, fault prediction and process parameter optimization are carried out on the full-life-cycle production process, the yield of the flexible circuit board is improved, the production cost of products is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of manufacturing technology of flexible circuit board products, in particular to a digital twin model used in the manufacturing process of flexible circuit boards. Background technique [0002] As a basic product of the modern electronics industry, flexible circuit boards have developed rapidly in recent years. Flexible circuit boards have been widely used in electronic products such as notebook computers, memory cards, digital cameras, digital video cameras, and mobile phones. The flexible printed circuit board uses polyimide as the base plate, and copper foil is attached to the surface as a printed circuit conductor, which can provide mounting support for various electronic components and IC chips, and realize signal transmission, insulation and mutual electrical connection. electrical characteristics. Compared with traditional printed circuit boards, flexible circuit boards have the advantages of lightness, thinne...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/23G06F30/39G06F111/10
Inventor 李辉沈威刘胜
Owner WUHAN UNIV
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