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Inductor encapsulation powder based on thermoplastic polymer material and production process thereof

A thermoplastic polymer and inductance packaging technology, applied in the field of inductance manufacturing, can solve the problems that the inductance cannot achieve strength, compaction density and inductance value, inductance performance deviation, increase the complexity of the process, etc., so as to achieve less environmental impact and less performance The effect of deviation, less performance defects

Pending Publication Date: 2020-02-25
上海太朔材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in many cases, when the molding process is carried out after a period of storage, the granulated powder has begun to polymerize to a certain extent (sometimes to a large extent) inside, resulting in molding The final inductance cannot reach the normal design parameters such as strength, pressing density and inductance value
If the storage conditions are different (temperature, time), it will lead to a huge performance deviation of the inductance performance after pressing
Low-temperature freezing storage can effectively reduce the curing reaction speed, but this adds new problems to storage: refrigeration equipment is required, more energy consumption is required, and transportation requires cold chains, etc.
[0004] 2. Thermosetting resins have an exothermic effect when they are cured
But this increases the complexity of the process
[0006] Therefore, thermosetting resins have many difficulties in manufacturing some high-performance inductors by molding.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Dissolve 1 kg of fluorine-containing soluble PI (DuPont PY5006T) in 10 kg of NMP (N-methylpyrrolidone), and then add 25 kg of BASF's EQ carbonyl iron powder to the solution, with a particle size of D50=5 microns. Airtightly mix in the kneader for 30 minutes, after mixing evenly, vacuumize, heat the kneader to 120 degrees, and continue mixing. Until the content of NMP in the mixture reaches 2% to 4%, the mixture is taken out and granulated on the granulation equipment. After the granulation is completed, the obtained granulated powder is dried in an oven at 120 degrees to completely remove the solvent NMP. Then sieve to collect the 100 mesh to 300 mesh powder. Residual powder can be recovered, dissolved with solvent NMP, and continued to granulate. Finally, the mixed powder particles with PI content of 4% and iron powder content of 96% are obtained.

[0052] The powder particles are fed quantitatively and transported to the cavity of the molding machine prefabricated w...

Embodiment 2

[0055] Dissolve 750 grams of PSU (BASF E1010) and 250 grams of PMMA (Chimei CM-205) in 12 kilograms of chloroform, then add 33 kilograms of alloy iron powder (KIP304AS from Kawasaki Steel, Japan) to the solution, and mix them in a closed kneader After 30 minutes, after mixing well, vacuum and continue mixing. Until the content of chloroform in the mixture reaches 2% to 7%, the mixture is taken out and granulated on the granulation equipment. After the granulation is completed, the obtained granulated powder is dried in an oven at 80 degrees to remove the remaining solvent chloroform. Then sieve to collect the 70-mesh to 200-mesh powder. The residual powder can be recovered, dissolved with a solvent, and continued to granulate. Finally, the PSU+PMMA content is 3%, the iron powder content is 97%, and the powder particles with a certain mesh number are obtained.

[0056] Feed the powder particles quantitatively and transport them to the mold cavity of the prefabricated coil and...

Embodiment 3

[0059] Feed 1 kg of PC (Sabick PC-1414), 10 kg of carbonyl iron powder (BASF SQ particle size D50=7 microns), and 10 kg of amorphous alloy (Antai Technology, D50=3 microns) into the mixer, Heat the kneader to 220 degrees under vacuum conditions, and knead in airtight for 60 minutes. After mixing evenly, keep the temperature at 220 degrees, extrude and granulate, and get 50 mesh to 120 mesh powder particles after granulation cooling. The PC content in the finally obtained powder particles is 5%, and the iron powder content is 95%.

[0060] Quantitatively feed the powder particles and transport them to the mold cavity of the prefabricated coil and iron core molding machine. The molding temperature is set to 280 degrees Celsius, the pressure is kept at 5 tons, and the holding time is 30 seconds. Then the mold is ejected to obtain the inductor. No post-bake required.

[0061] After testing, the inductance obtained by this process is 50 volts higher than that of thermosetting epo...

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PUM

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Abstract

Inductor encapsulation powder based on a thermoplastic polymer material and a production process thereof are disclosed. According to a technical scheme, the powder includes 0.5-25% by mass of a thermoplastic polymer and 25-99.5% by mass of magnetic metal powder. According to the inductor encapsulation powder, heat resistance of a cured inductor is at least 50 DEG C higher than that of an inductorencapsulated by utilizing conventional resin, and under the same addition amount, the encapsulated inductor has a better insulation level and better resistance to salt spray corrosion.

Description

technical field [0001] The invention relates to the technical field of inductor manufacturing, in particular to an inductor packaging powder based on a thermoplastic polymer material and a production process thereof. Background technique [0002] The molding method is a very important method of manufacturing small or miniature inductors, and sometimes it is the only feasible manufacturing method. These small or miniature inductors are essential precision passive components in the fields of displays, mobile phones, 5G, Internet of Things, Internet of Vehicles, and artificial intelligence. In the molding process, the magnetic powder material can be packaged together, and it can play a series of functions such as adhesion, protection, insulation and rust prevention, which is the inductance packaging material. As these inductors are more and more used in more application scenarios, the heat resistance, weather resistance, aging resistance, corrosion resistance, UV resistance, h...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08L81/06C08L33/12C08L69/00C08L77/06C08L81/02C08K3/18C08K3/08
CPCC08K3/08C08K3/18C08K2003/0856C08K2201/003C08K2201/01C08L77/06C08L81/06C08L2201/08C08L79/08C08L33/12C08L69/00C08L81/02
Inventor 韩坤肖德海
Owner 上海太朔材料技术有限公司
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