Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A low gloss black polyimide film comprising a stress canceling resin layer and a method for producing the same

A black polyimide, polyimide resin technology, applied in synthetic resin layered products, chemical instruments and methods, coatings, etc., can solve the problem of low gloss, low gloss, difficult to produce thin films, and difficult to protect circuit cover films Matching process and other issues, to achieve the effect of excellent flatness and excellent mechanical properties

Active Publication Date: 2020-03-03
KUKDO CHEM CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, despite the high sales price, the demand for it is still increasing, and the existing preparation methods have limitations in achieving low gloss and are difficult to produce thin films, so there is an urgent need to develop alternative processes
[0004] In view of this, although Korean patent 10-1813263 invention provides a kind of black polyimide film, it passes through the surface transfer printing of the support body film with low gloss surface characteristic, under the situation of not adding matting agent (matting agent), realizes Low gloss, but in the process of flexibly coating the polyimide resin layer on the support film, there are problems such as large curling, twisting, and bending toward the inside of the polyimide resin layer
Therefore, the subsequent adhesive coating process cannot be performed or the cover film matching process for protecting the circuit is difficult during the production of the flexible printed circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A low gloss black polyimide film comprising a stress canceling resin layer and a method for producing the same
  • A low gloss black polyimide film comprising a stress canceling resin layer and a method for producing the same
  • A low gloss black polyimide film comprising a stress canceling resin layer and a method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0056] The preparation method of the existing black polyimide film related to an embodiment of the present invention adopts the solution casting method (Solution Casting), which includes the following steps: polyamic acid solution is polymerized by dianhydride and diamines; The polyamic acid solution and carbon black, such as silicon dioxide, TiO 2 The matting agent, acid anhydrides and tertiary amines used for imidization are mixed as a catalyst to form a film. At this time, the polyamic acid solution and the mixed catalyst are coated (casting, Casting) on ​​the support (endless belt), and after drying in the specified temperature range, the self-supporting gel film in a semi-dry state Peeled from the endless belt and transferred to a high temperature drying oven to go through the amidation process to provide a low gloss black polyimide film.

[0057] However, due to the large difference in specific gravity between the matting particles and polyimide in this composition, pre...

Embodiment 1

[0082] As a soluble polyimide solution polymerization process, after filling a 1-liter reactor with nitrogen, 51.428 g (0.268 mol) of trimellitic anhydride and 200 g of N-methyl-2-pyrrolidone were added to the reactor. Afterwards, while the reactor was stirred at a rotating speed of about 200 RPM, 79.448 g (0.3029 mol) of 4,4'-methylene diphenyl diisocyanate was dissolved in 200 g of N-methyl-2-pyrrolidone for a period of 1 hour, slowly added to the reactor, and further stirred at 200 RPM for about 30 minutes. After the solution was slowly heated to 80°C over 30 minutes, and stirred for another 30 minutes, 10.303g (0.047mol) of pyromellitic anhydride and 125g of N-methyl-2-pyrrolidone were added in sequence , and stirred for 30 minutes, then over a period of about 30 minutes, the temperature was raised to 140° C. again. Afterwards, while keeping the temperature of the solution at 140°C, rotate and stir at a speed of 100RPM for about 30 minutes, slowly cool the solution that h...

Embodiment 2

[0087] A black polyimide film was prepared in the same manner as in Example 1, except that the thickness of the stress-relieving resin layer in the support film was 5 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
elastic modulusaaaaaaaaaa
tensile strengthaaaaaaaaaa
glass transition temperatureaaaaaaaaaa
Login to View More

Abstract

The present invention provides a low gloss black polyimide film comprising a stress canceling resin layer and a method for producing the same. The low gloss black polyimide film is manufactured of a soluble black polyimide resin composite. Without adding a matting agent, the low gloss black polyimide film has low gloss through surface transfer printing of a support film. The black polyimide film further comprises a stress offsetting resin layer to prevent curling and distortion and achieve excellent smoothness. Heat resistance, insulation and optical / shielding properties are improved, which facilitate application of the black polyimide film in preparation of covering films of flexible printed circuit boards or electromagnetic shielding film materials. In addition, the black polyimide filmhas high flexibility and excellent circuit shadowing property, so that the black polyimide film can be used as insulating films as covering films or insulating film for electromagnetic shielding in flexible printed circuit board lamination processed.

Description

technical field [0001] The invention provides a low-gloss black polyimide film, which is made of a soluble black polyimide resin composition, and can be transferred through the surface of a support film without adding a matting agent. to achieve no light. The present invention further provides a black polyimide film including a stress-relieving resin layer to prevent curling, twisting, and the like. Accordingly, the present invention relates to a black polyimide film with further improved heat resistance, insulation, and optical / shielding properties, which are favorable for the use of the black polyimide in the preparation of flexible printed circuit boards. Applications in coverlay or electromagnetic shielding film materials. Background technique [0002] Polymers with an acid imide structure are generally referred to as polyimides. Generally, polyimide is prepared by condensation of aromatic tetracarboxylic anhydride and aromatic diamine, which has excellent properties ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08G73/10C09D179/08C09D7/61C08L67/00
CPCC08J7/042C08G73/1035C08G73/1003C09D179/08C09D7/61C08J2367/00C08J2479/08C08J2401/12C08K3/04C09D5/32H05K3/281H05K9/0081B32B7/02B32B27/06B32B33/00B32B2255/26B32B2307/544B32B2307/408B32B2307/212
Inventor 明凡永金昇均金柱彬金胜宪金相妧李知训金裕彬
Owner KUKDO CHEM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com