Cerium oxide polishing solution, preparation method and applications thereof

A technology of polishing liquid and cerium oxide, which is applied in the field of polishing liquid, can solve problems such as hindering the uniform and effective contact between cerium oxide and glass substrates, reducing polishing efficiency, etc.

Active Publication Date: 2020-03-10
HUIZHOU BYD IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] (2) Severe foaming: During the use of the current polishing liquid, due to the debris mixed with the substrate and abrasives, the organic or inorganic macromolecular additives added to the polishing liquid, and the friction generated during the poli

Method used

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  • Cerium oxide polishing solution, preparation method and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] This example is to illustrate the cerium oxide polishing solution prepared by the preparation method of the present invention.

[0062] (1) Each component and weight percentage

[0063] Abrasive: particle size D 50 = 1.0 μm, D 100 = 8.6 μm;

[0064] 360 parts by weight of cerium oxide; 150 parts by weight of lanthanum oxide; 30 parts by weight of lanthanum fluoride; 28 parts by weight of lanthanum oxyfluoride; 32 parts by weight of titanium oxide;

[0065] Dispersant:

[0066] 38 parts by weight of allyl polyoxyethylene ether; 18 parts by weight of triethylhexyl phosphoric acid; 8 parts by weight of vinylbisstearamide; 6 parts by weight of sodium styrene sulfonate;

[0067] Defoamer:

[0068] 8 parts by weight of polyoxyethylene polyoxypropylene alcohol amine ether; 6 parts by weight of polyether dimethyl siloxane copolymer;

[0069] Water: 2400 parts by weight.

[0070] (2) Preparation method

[0071] ①Prepare 2400 parts of water, stir with a 1500r / min high-spe...

Embodiment 2

[0075] This example is to illustrate the cerium oxide polishing solution prepared by the preparation method of the present invention.

[0076] (1) Each component and weight percentage

[0077] Abrasive: particle size D 50 = 1.6 μm, D 100 = 9.4 μm;

[0078] 320 parts by weight of cerium oxide; 170 parts by weight of lanthanum oxide; 40 parts by weight of lanthanum fluoride; 32 parts by weight of lanthanum oxyfluoride; 38 parts by weight of titanium oxide;

[0079] Dispersant:

[0080] 38 parts by weight of polyoxyethylene octylphenol ether; 18 parts by weight of triethylhexyl phosphoric acid; 8 parts by weight of vinylbisstearamide; 6 parts by weight of sodium styrene sulfonate.

[0081] Defoamer:

[0082] 10 parts by weight of polyoxyethylene polyoxypropylene alcohol amine ether; 8 parts by weight of polyether dimethyl siloxane copolymer;

[0083] Water: 2400 parts by weight.

[0084] (2) Preparation method

[0085] ①Prepare 2400 parts of water, stir with a 1500r / min hig...

Embodiment 3

[0089] This example is to illustrate the cerium oxide polishing solution prepared by the preparation method of the present invention.

[0090] (1) Each component and weight percentage

[0091] Abrasive: particle size D 50 = 1.0 μm, D 100 = 5.4 μm;

[0092] 310 parts by weight of cerium oxide; 182 parts by weight of lanthanum oxide; 22 parts by weight of lanthanum fluoride; 42 parts by weight of lanthanum oxyfluoride; 44 parts by weight of titanium oxide;

[0093] Dispersant:

[0094] 20 parts by weight of allyl polyoxyethylene ether; 20 parts by weight of polyoxyethylene octylphenol ether; 16 parts by weight of triethylhexyl phosphoric acid; 10 parts by weight of vinylbisstearamide; 8 parts by weight of sodium styrene sulfonate;

[0095] Defoamer:

[0096] 6 parts by weight of polyoxyethylene polyoxypropylene alcohol amine ether; 12 parts by weight of polyether dimethyl siloxane copolymer;

[0097] Water: 2400 parts by weight.

[0098] (2) Preparation method

[0099] ①...

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PUM

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Abstract

The invention relates to the technical field of polishing solutions, and discloses a cerium oxide polishing solution, a preparation method and applications thereof, wherein the polishing solution contains a grinding agent, a dispersing agent, a defoaming agent and water, the grinding agent is a mixture of cerium oxide, lanthanum oxide, lanthanum fluoride, lanthanum oxyfluoride and titanium oxide,the dispersing agent is a mixture of allyl polyoxyethylene ether and/or polyoxyethylene octyl phenol ether, triethylhexyl phosphoric acid, vinyl bis stearamide and sodium p-styrenesulfonate, and the defoaming agent is a copolymer of polyoxyethylene polyoxypropylene alcohol amine ether and polyether dimethyl siloxane. With the application of the polishing solution to polish glass surface, the polishing efficiency is high, the dispersing capacity is strong, the lasting defoaming effect is good, and defoaming can be performed for a long time.

Description

technical field [0001] The invention relates to the technical field of polishing liquid, in particular to a cerium oxide polishing liquid and its preparation method and application. Background technique [0002] At present, chemical mechanical polishing (CMP) technology is recognized as the only global planarization technology, which is widely used in the manufacture of advanced electronic products such as integrated circuit silicon wafers and optical glass. The chemical mechanical polishing fluid is a key element in CMP. At present, the excellent chemical mechanical polishing fluid mainly depends on imports, which seriously limits the development of precision machining technology in China. Chemical-mechanical polishing liquid is a research hotspot in China. The current production method is mainly to uniformly mix polishing powder and a certain proportion of additives by chemical dispersion or mechanical dispersion or a combination of chemical and mechanical methods. [000...

Claims

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Application Information

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IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 游容曹昆鹏段水亮
Owner HUIZHOU BYD IND
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