Cerium oxide polishing solution, preparation method and applications thereof

Abstract

The invention relates to the technical field of polishing solutions, and discloses a cerium oxide polishing solution, a preparation method and applications thereof, wherein the polishing solution contains a grinding agent, a dispersing agent, a defoaming agent and water, the grinding agent is a mixture of cerium oxide, lanthanum oxide, lanthanum fluoride, lanthanum oxyfluoride and titanium oxide,the dispersing agent is a mixture of allyl polyoxyethylene ether and / or polyoxyethylene octyl phenol ether, triethylhexyl phosphoric acid, vinyl bis stearamide and sodium p-styrenesulfonate, and the defoaming agent is a copolymer of polyoxyethylene polyoxypropylene alcohol amine ether and polyether dimethyl siloxane. With the application of the polishing solution to polish glass surface, the polishing efficiency is high, the dispersing capacity is strong, the lasting defoaming effect is good, and defoaming can be performed for a long time.

Description

technical field [0001] The invention relates to the technical field of polishing liquid, in particular to a cerium oxide polishing liquid and its preparation method and application. Background technique [0002] At present, chemical mechanical polishing (CMP) technology is recognized as the only global planarization technology, which is widely used in the manufacture of advanced electronic products such as integrated circuit silicon wafers and optical glass. The chemical mechanical polishing fluid is a key element in CMP. At present, the excellent chemical mechanical polishing fluid mainly depends on imports, which seriously limits the development of precision machining technology in China. Chemical-mechanical polishing liquid is a research hotspot in China. The current production method is mainly to uniformly mix polishing powder and a certain proportion of additives by chemical dispersion or mechanical dispersion or a combination of chemical and mechanical methods. [000...

AI Technical Summary

Problems solved by technology

[0011] (2) Severe foaming: During the use of the current polishing liquid, due to the debris mixed with the substrate and abrasives, the organic or inorganic macromolecular additives added to the polishing liquid, and the friction generated during the polishing process The high heat causes more foam to be generated during the recycling of the polishing liquid, which seriously hinders the uniform and effective contact between the cerium oxide and the glass substrate, greatly reducing the polishing efficiency

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