A bare copper tinning process
A technology of tin plating and process, applied in the direction of hot-dip plating process, metal material coating process, coating, etc., can solve problems such as unreasonable, poor precision, affecting the effect and output of tin plating of products
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[0033] The present invention will be further explained below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.
[0034] like figure 1 Shown is 1, a kind of bare copper tin plating process, it is characterized in that, comprises the following steps:
[0035] Step 1: Pull the busbar; put the busbar roll into the wire drawing machine to pull and feed the wire;
[0036] Step 2: Put the drawn copper wire in step 1 into the tension net of the pay-off cover, and use the gray cloth to block the...
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