A kind of ion beam printing method based on ion beam printing system

Abstract

The invention discloses an ion beam printing method based on an ion beam printing system. The ion beam printing system includes a roll-to-roll printing machine placed in a vacuum and a medium-high-energy wide-area ion installed on the roll-to-roll printing machine. source, medium and low-energy wide-range ion source, and low-energy ion source; the ion beam printing method includes: firstly coating a dry film on a polyimide substrate, etching the dry film according to a preset circuit pattern, and then using ion The beam printing system deposits broad-energy metal ions on the circuit pattern to form a thin film substrate, and finally the thin film substrate is subjected to dry film peeling to obtain a printed circuit board. The invention uses the ion beam printing system to deposit broad-range energy metal ions, can prepare ultra-fine lines, the line width and line spacing can be less than 3 microns, the deposited film layer has good compactness, good film surface smoothness, low production cost, and is suitable for High-frequency and high-speed transmission applications, and there is no problem of electroplating solution polluting the environment, which is more environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of electronic circuit printing, in particular to an ion beam printing method based on an ion beam printing system. Background technique [0002] With the development of science and technology, especially the rapid development of the electronic information industry, the requirements for electronic circuits are getting higher and higher. Electronic products with features such as small size, low energy consumption, and light weight are more and more favored by consumers. Under the demand and development trend of light weight and miniaturization, the line width and line spacing of electronic circuits are also getting smaller and smaller. With the reduction of line width and line spacing, due to the surface tension of the etching liquid in the existing etching method, it is difficult to make the etching liquid penetrate into the line groove for etching, or partially enter the line groove for etching, resulting i...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an ion beam printing method based on an ion beam printing system to solve the problem that the line width and line spacing of the electronic circuit made by the existing electronic circuit etching method are difficult to be less than 20 microns, and the prepared Problems of low yield and high cost of electronic circuit boards

Images