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Preparation method of enhanced copper-based strip

A copper-based, reinforced technology, applied in furnace types, manufacturing tools, metal rolling, etc., can solve the problem of not being able to have both high strength and high conductivity, solve the problem of component quality control, and achieve electromechanical performance. , the effect of improving quality

Active Publication Date: 2020-03-27
北京碳垣新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application of copper and copper alloy strips usually requires both high electrical conductivity and high strength. Although it is mainly aimed at its good electrical conductivity, copper and copper alloy materials prepared by traditional techniques cannot have both high strength and high electrical conductivity.

Method used

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  • Preparation method of enhanced copper-based strip
  • Preparation method of enhanced copper-based strip
  • Preparation method of enhanced copper-based strip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1 The preparation method of reinforced copper-based strip material X1

[0026] Pretreatment: Use pure copper foil as the base material with a purity of 99.9% and a thickness of 50 microns; place the copper foil in pickling solution (mixed with acetic acid and water at a volume ratio of 1:1) and ultrasonically treat it for 10 minutes. After cleaning with deionized water, put it into ethanol for ultrasonic treatment for 10 minutes, dry it before use, and store it in acetone when it is not used for a long time.

[0027] In-situ growth: the copper foil is processed into a cylindrical shape by folding and placed in a CVD furnace tube, and methane is used as a carbon source to perform roll-to-roll continuous graphene in-situ growth on the surface of the copper foil. The specific process is: put the sample into the CVD furnace at room temperature, close the furnace tube; use the vacuum pump to continuously pump out the residual air in the furnace, then turn off the ...

Embodiment 2

[0031] Embodiment 2 The preparation method of reinforced copper-based strip material X2

[0032] Pretreatment: Use copper-nickel alloy foil with a copper content of 78% as the substrate, with a thickness of 100 microns; place the copper-nickel foil in pickling solution (mixed with acetic acid and water at a volume ratio of 1:1) and ultrasonically treat it for 15 minutes , washed with deionized water, then placed in ethanol for ultrasonic treatment for 15 minutes, dried for later use, and stored in acetone for long-term use.

[0033] In-situ growth: Copper-nickel foil is processed into a cylindrical shape by curling and placed in a CVD furnace tube, and acetylene is used as a carbon source to perform in-situ growth of roll-to-roll continuous graphene on the surface of the copper alloy foil. The specific process is: close the CVD furnace tube; use the vacuum pump to continuously pump out the residual air in the furnace, then close the vacuum pump and feed the gas, in which the a...

Embodiment 3

[0037] Embodiment 3 The preparation method of reinforced copper-based strip material X3

[0038] Pretreatment: Use copper-nickel alloy foil with a copper content of 57% as the substrate, with a thickness of 75 microns; place the copper-nickel foil in pickling solution (mixed with acetic acid and water at a volume ratio of 1:1) and ultrasonically treat it for 5 minutes , washed with deionized water, put into ethanol and ultrasonically treated for 5 minutes, dried for later use, and stored in acetone for long-term use.

[0039] In-situ growth: The copper-nickel foil is processed into a cylindrical shape by curling and placed in a CVD furnace tube, and ethanol is used as the carbon source to perform in-situ growth of roll-to-roll continuous graphene on the surface of the copper alloy foil. The specific process is as follows: close the CVD furnace tube; use the vacuum pump to continuously pump out the residual air in the furnace, then close the vacuum pump and introduce gas, in wh...

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Abstract

The invention relates to a preparation method of an enhanced copper-based strip. The preparation method comprises the following steps: carrying out enhancement pretreatment on a copper or copper alloystrip; growing graphene on the copper or copper alloy strip by using a gaseous or liquid carbon source by adopting a normal-pressure chemical vapor deposition method; carrying out multi-pass cold rolling on the copper or copper alloy strip at room temperature; repeatedly carrying out pretreatment, graphene surface growth and cold rolling on the copper or copper and copper alloy strip subjected tocold rolling for multiple times to form a prefabricated product; and carrying out rapid crystallization and continuous annealing on the enhanced copper-based strip prefabricated product to prepare the enhanced copper-based strip. According to the method, continuous graphene in-situ growth on the surface is carried out after the copper strips are stacked, then large-deformation rolling is carriedout on the stacked copper strips, the process is repeated, and then good matching of high strength and high conductivity is achieved by controlling recrystallization.

Description

technical field [0001] The invention relates to the technical field of metal composite materials, in particular to a method for preparing a reinforced copper-based strip. Background technique [0002] Copper and copper alloy strips are one of the most important basic materials in the power electronics industry. Since the conductivity of copper is second only to silver, it is 1.6 times greater than nickel. With the development of electronic and electrical technology, copper and copper alloy strips are widely used in cable strips for various types of cable outer conductors, transformer strips for foil-wound (dry-type) transformers, copper alloy strips for electronic connectors, and micro-motor rectifiers. Sub-use copper strips and frame materials for the production of various electronic circuits and integrated circuits. In addition, key components in vacuum systems, electrical instruments, telephones, televisions, computers and other equipment (such as elastic elements, elec...

Claims

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Application Information

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IPC IPC(8): C23C16/26C23C16/56C23C16/02C22F1/08C21D9/52B21B37/56
CPCB21B37/56B21B2265/10C21D9/52C22F1/08C23C16/0227C23C16/26C23C16/56
Inventor 侯星云
Owner 北京碳垣新材料科技有限公司
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