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Cyanide-free tin electroplating solution and electroplating method thereof

A technology of electroplating solution and tin salt, which is applied in the field of cyanide-free electroplating solution and its electroplating, which can solve problems such as the influence of coating color, slow deposition rate, easy mold growth in the plating solution, etc., and achieve excellent electroplating effect, better use feeling, good looking effect

Inactive Publication Date: 2020-03-27
广东超导电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tartrate electroplating is the earliest cyanide-free system studied. Because the plating solution is non-toxic, non-polluting, and easy to adjust, it is widely used. However, the color of the plating layer is greatly affected by the pH of the plating solution, and it is difficult to control it stably.
The HEDP system has the characteristics of stable solution, good dispersion ability, uniform coating color and simple operation, but the disadvantage is that the current density should not be too high, and the coating should not be too thick, otherwise copper powder will easily be produced, and iron impurities in the plating solution are difficult to deal with. Iron impurities will lead to narrowing of the current density range, slow down the deposition rate, rough coating, and affect the bonding force between the coating and the substrate
The citrate system can obtain a semi-bright coating, but the brightness range is narrow, the bonding force of the coating is unstable, and the plating solution is prone to mildew and poor stability

Method used

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  • Cyanide-free tin electroplating solution and electroplating method thereof
  • Cyanide-free tin electroplating solution and electroplating method thereof
  • Cyanide-free tin electroplating solution and electroplating method thereof

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Embodiment 1

[0033] The present embodiment electroplating solution has included following components:

[0034]

[0035] The electroplating method using the present embodiment electroplating solution is:

[0036] (1) Preparation of electroplating solution: dissolve the following components in hot water at 25° C. to form an electroplating solution, containing 245 g of potassium pyrophosphate in the described per liter of electroplating solution; 16 g of dipotassium hydrogen phosphate; 30 g of nitrilotriacetic acid and 0.01 g of gelatin;

[0037] (2) Use pH test paper to detect the pH value of the solution, and use sodium hydroxide or phosphoric acid to adjust so that the pH value of the solution is 8;

[0038] (3) Use distilled water to configure stannous pyrophosphate solution, stir to make it fully dissolve;

[0039] (4) Add the electroplating solution obtained in step (1) into the electrolytic tank, use a current of 0.15A, and electrolyze for 60 minutes under the condition of hot wate...

Embodiment 2

[0041] The present embodiment electroplating solution has included following components:

[0042]

[0043] The electroplating method using the present embodiment electroplating solution is:

[0044] (1) Preparation of electroplating solution: dissolving each raw material component in hot water to form an electroplating solution, containing 260g of pyrophosphate in the described per liter of electroplating solution; buffering agent 20g; auxiliary complexing agent 35g and gelatin 0.02g;

[0045] (2) Use pH test paper to detect the pH value of the solution, and use sodium hydroxide or phosphoric acid to adjust so that the pH value of the solution is 8;

[0046] (3) Use distilled water to dissolve ascorbic acid, configure antioxidant solution, stannous pyrophosphate solution, stir to make it fully dissolved;

[0047] (4) Add the electroplating solution obtained in step (1) into the electrolytic tank, use a current of 0.25A, electrolyze for 70 minutes under hot water conditions...

Embodiment 3

[0049] The present embodiment electroplating solution has included following components:

[0050]

[0051] The electroplating method of cyanide-free electroplating solution is the same as embodiment 2 in the present embodiment.

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Abstract

The invention discloses a cyanide-free tin electroplating solution which comprises soluble tin salt, pyrophosphate, a buffer agent, an auxiliary coordination agent and a brightener. Specifically, theelectroplating method of the electroplating solution comprises the following steps: preparing the electroplating solution; adjusting the pH value; preparing an antioxidant solution and a stannous pyrophosphate solution; and carrying out electroplating. The cyanide-free tin electroplating solution prepared by the invention is simple in component, easy to maintain and applicable to a relatively widecurrent density range, tin of a plating layer is relatively uniform and fine and relatively good in appearance, and the electroplating effect is excellent.

Description

technical field [0001] The invention relates to an electroplating solution, in particular to a cyanide-free electroplating solution and an electroplating method thereof. Background technique [0002] The electroplating on the body material mainly uses the electroplating process to coat a layer of metal on the surface of the object, which can protect the body material. Due to the good coordination ability of cyanide, cyanide is a very strong complexing agent, and its ability to disperse and cover is better, resulting in fine and uniform crystallization of the coating, and the plating solution is alkaline, with good It has good degreasing ability, so a coating with good bonding force can be obtained. As a complexing agent, cyanide is widely used in the electroplating fields of copper, gold, silver and other metals. However, because cyanide is highly toxic, it not only endangers human health but also pollutes the environment. From the perspective of environmental protection an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 陈子跃张中奎陈宇朱东晖
Owner 广东超导电子有限公司
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