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Single-component conductive adhesive stored and cured at normal temperature as well as preparation method and application thereof

A conductive adhesive, one-component technology, applied in the field of conductive adhesive, can solve problems such as dispensing, thickening, and repeated use, and achieve excellent moisture and heat aging resistance and excellent adhesion.

Active Publication Date: 2020-04-07
南京金世家新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It solves many problems of epoxy conductive adhesive, such as: it needs low temperature (≦-10℃) to be inactive, that is, it can only be stored stably in the refrigerator; it will slowly solidify at room temperature, the glue will thicken, and finally it cannot be dispensed; the glue needs to be It needs to be thawed for more than 1 hour before it can be used normally; it needs to be cured at 80°C, which is not as convenient as curing at room temperature, and cannot be used multiple times, etc.

Method used

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  • Single-component conductive adhesive stored and cured at normal temperature as well as preparation method and application thereof
  • Single-component conductive adhesive stored and cured at normal temperature as well as preparation method and application thereof
  • Single-component conductive adhesive stored and cured at normal temperature as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A single-component conductive adhesive stored and cured at room temperature, its raw material composition is shown in Tables 1 and 2:

[0034] Table 1

[0035]

[0036] Table 2

[0037]

[0038] Put thermoplastic acrylic resin, thermoplastic polyurethane elastomer rubber (TPU) toughening agent, silane coupling agent, thixotropic agent and organic solvent into the double planetary mixer (Taiyi (Shanghai) Industrial Co., Ltd., the model is TSJ-5) in the stainless steel kettle, open the cooling water, stirring and high-speed dispersion in sequence. Control the temperature and flow rate of the cooling water to keep the material temperature in the kettle not exceeding 30°C (the temperature and flow rate of the cooling water should be adjusted according to the actual temperature in the kettle. , to ensure that the temperature of the material in the kettle does not exceed 30°C), until the material is completely dissolved. Then add silver powder and continue to stir and ...

Embodiment 2

[0040] A single-component conductive adhesive stored and cured at room temperature, its raw material composition is shown in Table 3 and Table 4:

[0041] table 3

[0042]

[0043] Table 4

[0044]

[0045] Put thermoplastic acrylic resin, urethane (TPU) toughening agent, silane coupling agent, thixotropic agent and organic solvent into the stainless steel kettle of the double planetary mixer according to the weight ratio described in the above table 1, and open in sequence Cooling water, stirring and high-speed dispersion. Control the temperature and flow rate of the cooling water to keep the temperature of the material in the kettle not exceeding 30°C until the material is completely dissolved. Then add silver powder and continue to stir and disperse at high speed until the mixture is even. Then vacuumize and defoam, filter with 400-mesh steel mesh, then pack into syringes, and finally store in a dry and ventilated environment at room temperature.

Embodiment 3

[0047] A single-component conductive adhesive stored and cured at room temperature, its raw material composition is shown in Table 5 and Table 6:

[0048] table 5

[0049]

[0050] Table 6

[0051]

[0052] Put thermoplastic acrylic resin, urethane (TPU) toughening agent, silane coupling agent, thixotropic agent and organic solvent into the stainless steel kettle of the double planetary mixer according to the weight ratio described in the above table 1, and open in sequence Cooling water, stirring and high-speed dispersion. Control the temperature and flow rate of the cooling water to keep the temperature of the material in the kettle not exceeding 30°C until the material is completely dissolved. Then add silver powder and continue to stir and disperse at high speed until the mixture is even. Then vacuumize and defoam, filter with 400-mesh steel mesh, then pack into syringes, and finally store in a dry and ventilated environment at room temperature.

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Abstract

The invention discloses a single-component conductive adhesive stored and cured at normal temperature as well as a preparation method and application thereof. The conductive adhesive is prepared fromthe following raw materials in percentage by weight: 30-60% of silver powder, 5-15% of thermoplastic acrylic resin, 1-7% of a toughening agent, 0.1-1.0% of a silane coupling agent, 2-5% of a thixotropic agent and 20-40% of an organic solvent. The conductive adhesive prepared by the invention has the following advantages: (1) the conductive adhesive comprises a single component; (2) the dispensingproperty is good, and wiredrawing is avoided; (3) cold storage is not needed, and normal-temperature storage can be realized; (4) the conductive adhesive can be cured at normal temperature without heating; (5) the adhesive force to various materials is strong; (6) the electrical conductivity is good after curing; and (7) the conductive adhesive is resistant to damp heat and aging and resistant tocold-heat alternating impact, the process is simple, the efficiency is high, and large-scale production and application can be achieved. The single-component conductive adhesive stored and cured at normal temperature prepared by the invention can be effectively used for conducting upper and lower glass of a liquid crystal display screen, resisting static electricity of a fingerprint module, repairing breakpoints of various conductive circuits and the like.

Description

technical field [0001] The invention relates to the field of conductive adhesives, in particular to a single-component conductive adhesive stored and cured at room temperature and its preparation method and application. [0002] technical background [0003] As human beings enter the era of mobile communication and artificial intelligence, more and more electronic products such as mobile phones, tablets, and laptops use touch technology. The glass or plastic on the surface will generate static electricity after frequent touches, which will affect the conduction of current or signals. . Therefore, when assembling these electronic products, a conductive adhesive will be placed on a specific part to connect the outer surface of the IPS screen or fingerprint module with some metal components inside the machine to eliminate the impact of static electricity. role. At the same time, because some core components in the assembled machine cannot be baked at high temperature, the cond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J133/04C09J175/04C09J11/04C09J11/08C09J11/06B29B7/00B29B13/00B29B13/10
CPCB29B7/005B29B13/00B29B13/10B29B2013/005C08K2003/0806C08K2201/001C08K2201/003C08K2201/006C08L2201/08C08L2205/03C08L2207/04C09J9/02C09J11/04C09J11/06C09J11/08C09J133/04C09J175/04C08L75/04C08K7/00C08K3/08C08K5/544C08K7/26C08L33/04C08K5/5435C08K9/00C08K3/346C08L91/00C08K5/5425C08L77/00
Inventor 杜尚霏刘伟
Owner 南京金世家新材料科技有限公司
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