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Low-temperature lead-free solder paste and preparation method

A lead-free solder paste and low-temperature solder technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of low toughness, high cost, and difficulty in dispersion of solder joints, and achieve poor reinforcement effect and improve strength and toughness. , the effect of enhancing compatibility

Active Publication Date: 2020-04-17
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the large amount of bismuth metal contained in this solder paste, the toughness of the solder joints is low, and the electronic devices cannot meet the performance requirements.
Carbon nanotubes are developing into an excellent reinforcing phase for traditional solder paste due to their good mechanical, electrical and thermal properties. However, carbon nanotube nanoscale effects and fiber entanglement are not easy to disperse in solder paste. The compatibility of carbon nanotubes is poor, and the reinforcing effect of carbon nanotubes in solder paste cannot be exerted
In the current research, the surface metallization treatment of carbon nanotubes is mostly carried out to enhance the compatibility with tin alloys. Although this method can achieve the effect of strengthening and toughening carbon nanotubes, the process is relatively complicated, the cost is high, and the product quality is high. Unstable, there is no research on adding carbon nanotubes in the form of pure substances in the existing research, but also achieving the effect of strengthening and toughening solder paste

Method used

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  • Low-temperature lead-free solder paste and preparation method

Examples

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Embodiment 1

[0047] This embodiment provides a kind of low-temperature lead-free solder paste, according to weight percentage, its raw material comprises 85% low-temperature solder, 15% solder paste; Based on low-temperature solder, described low-temperature solder comprises 99.63wt% Sn42Bi58 alloy powder and 0.37wt% carbon nanotubes, wherein the carbon nanotubes are short carboxylated multi-walled carbon nanotubes, purchased from Suzhou Carbonfeng Graphene Technology Co., Ltd., the product brand is HQNANO-CNTs-007-1C (the outer diameter is 8~ 15 nanometers, the length is 0.5 ~ 2 microns); based on the solder paste, according to parts by weight, the solder paste includes 35 parts of rosin, 30 parts of solvent, 8 parts of active agent, 7 parts of thickener, and 12 parts of additives , wherein the rosin is hydrogenated rosin and polymerized rosin, the weight ratio of the two is 4:1, the solvent is diethylene glycol hexyl ether, and the active agent is adipic acid and hexadecylamine hydrofluor...

Embodiment 2

[0049] This embodiment provides a low-temperature lead-free solder paste. According to weight percentage, its raw materials include 85% low-temperature solder and 15% solder paste; based on low-temperature solder, the low-temperature solder includes 99.63wt% Sn42Bi58 alloy powder And 0.37wt% carbon nanotubes, wherein the carbon nanotubes are short hydroxylated multi-walled carbon nanotubes, purchased from Suzhou Carbonfeng Graphene Technology Co., Ltd., the product brand is HQNANO-CNTs-007-1H (the outer diameter is 8~ 15 nanometers, the length is 0.5 ~ 2 microns); based on the solder paste, according to parts by weight, the solder paste includes 35 parts of rosin, 30 parts of solvent, 8 parts of active agent, 7 parts of thickener, and 12 parts of additives , wherein the rosin is hydrogenated rosin and polymerized rosin, the weight ratio of the two is 4:1, the solvent is diethylene glycol hexyl ether, and the active agent is adipic acid and cetylamine hydrofluoride, and the weig...

Embodiment 3

[0051] This embodiment provides a kind of low-temperature lead-free solder paste, according to weight percentage, its raw material comprises 85% low-temperature solder, 15% solder paste; Based on low-temperature solder, described low-temperature solder comprises 99.63wt% Sn42Bi58 alloy powder and 0.37wt% carbon nanotubes, wherein the carbon nanotubes are short multi-walled carbon nanotubes, purchased from Suzhou Carbonfeng Graphene Technology Co., Ltd., the product brand is HQNANO-CNTs-007-1 (the outer diameter is 8 to 15 nanometers , with a length of 0.5 to 2 microns); based on the solder paste, according to parts by weight, the solder paste includes 35 parts of rosin, 30 parts of solvent, 8 parts of active agent, 7 parts of thickener, and 12 parts of additives, wherein The rosin is hydrogenated rosin and polymerized rosin, the weight ratio of the two is 4:1, the solvent is diethylene glycol hexyl ether, and the active agent is adipic acid and cetylamine hydrofluoride, and the...

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Abstract

The invention relates to the technical field of electronic welding, in particular to low-temperature lead-free solder paste and a preparation method. The low-temperature lead-free solder paste comprises the following raw materials in weight percentage: 84-87% of low-temperature solder and 13-16% of flux paste. The low-temperature solder comprises tin-bismuth series alloy and carbon nanotubes; andthe flux paste comprises rosin, a solvent, an active agent, a thickening agent and an additive. By adding the multi-walled carbon nanotubes with a specific length-diameter ratio, and assistantly adding the specific active agent and thickening agent, the dispersity of the carbon nanotubes in the solder paste is improved, the compatibility of the carbon nanotubes with other components is enhanced, and the problems of insufficient strength and toughness of soldering spots of the conventional tin-bismuth-accommodating solder paste are solved.

Description

technical field [0001] The invention relates to the technical field of electronic welding, in particular to a low-temperature lead-free solder paste and a preparation method thereof. Background technique [0002] With the development of electronic information products towards ultra-large-scale integration and miniaturization, solder paste has become the most important process material in surface mount technology (SMT). Traditional solder paste generally uses SAC series alloys (tin-silver-copper series alloys) as welding materials, and the welding temperature usually needs to be higher than 240°C. Problems such as device deformation are easy to occur during the welding process of highly integrated microelectronic devices. Solder paste with tin-bismuth series alloy as low-temperature solder is used. [0003] But because this kind of solder paste contains a large amount of bismuth metal components, the toughness of the solder joints is low, and the electronic devices cannot me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/26B23K35/14
CPCB23K35/025B23K35/262B23K35/3613
Inventor 陈钦宫梦奇梁少杰陈旭徐华侨张阳张义宾翁若伟
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU