P-type single crystal PERC battery capable of improving LeTID phenomenon and manufacturing method thereof
A production method and single crystal technology, applied in sustainable manufacturing/processing, circuits, photovoltaic power generation, etc., can solve the problems that do not conform to the development trend of cost reduction and efficiency improvement in the photovoltaic industry, the decline in the efficiency of batteries and modules, and excess hydrogen atoms in batteries, etc. Problems, to achieve good field passivation effect, reduce the amount of use, reduce the effect of excess hydrogen atom content
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[0032] Example 1
[0033] Step S1, surface texture, also called alkali texturing, that is, the silicon wafer substrate 4 is etched with an alkaline solution, and the surface of the silicon wafer substrate 4 is etched to form a pyramidal surface morphology, wherein the reaction alkali solution: 1.2wt% NaOH, reaction time: 400s, temperature: 80°C, reflectivity after treatment: 11%;
[0034] Step S2, high-temperature phosphorus diffusion, the diffusion source phosphorus oxychloride is brought into the high-temperature diffusion furnace with nitrogen through a constant temperature liquid source bottle, and at the same time sufficient oxygen is introduced, after the reaction, phosphorus atoms diffuse into the P-type silicon wafer , Forming an N-type impurity distribution to obtain a PN junction, where nitrogen flow rate: 700 sccm, oxygen flow rate: 800 sccm, reaction time: 88 min, temperature: 800 ℃, diffusion resistance: 120 ohm; laser doping method is formed in the front electrode are...
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[0043] Example 2
[0044] Step S1, surface texture, also called alkali texturing, that is, the silicon wafer substrate is corroded by an alkali solution, and the surface of the silicon wafer substrate is corroded to form a pyramidal surface morphology, wherein the reaction alkali solution: 1.2wt% NaOH, Reaction time: 400s, temperature: 80℃, reflectivity after treatment: 11%;
[0045] Step S2, high-temperature phosphorus diffusion, in which nitrogen flow rate: 700 sccm, oxygen flow rate: 800 sccm, reaction time: 88 min, temperature: 800°C, diffusion resistance: 120 ohms; and the laser doping method forms a heavily doped area in the front electrode area, The square resistance is: 95 ohms;
[0046] Step S3, peripheral etching and back polishing, using 49% HF acid solution to etch the back and edges of the silicon wafer diffused in step 2, and then using 45% KOH and polishing additives to polish the back of the silicon wafer Treatment, weight loss: 0.25g, back reflectivity: 42%;
[0047...
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