MEMS capacitive air pressure sensor based on PN junction electrical isolation and anodic bonding technologies
An air pressure sensor and anodic bonding technology, applied in the direction of microstructure technology, fluid pressure measurement using capacitance changes, instruments, etc., can solve complex micro-nano processing procedures, multi-high-end micro-nano processing equipment, undisclosed electrodes Lead technology and other issues, to achieve excellent long-term vacuum maintenance ability, ensure long-term stability, and good commercialization effect
Active Publication Date: 2020-04-21
BEIJING RES INST OF TELEMETRY +1
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[0004] NASA of the United States and Vaisala of the Netherlands have cooperated to develop a MEMS capacitive air pressure sensor for the Mars rover. It adopts a silicon-glass anode bonding process, and prepares pits and electrode plates on silicon and glass at the same time. The resolution can reach 0.2Pa. However, due to the protection of technical secrets, its electrode lead technology has not been disclosed, and it has not been commercialized; The nano-manufacturing process uses multiple polysilicon growth, heavy doping, corrosion self-stop, silicon-silicon fusion bonding, anodic bonding, etc. The micro-nano processing process of this scheme is complicated and difficult, and requires more high-end micro-nano processing Instruments and equipment, and it is difficult to guarantee a high yield, so the commercialization effect is not very good
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[0035] The specific implementation process of the present invention will be described in detail below in conjunction with the accompanying drawings and examples.
[0036]figure 1 It is a schematic diagram of the three-dimensional separation anatomy of the present invention. The capacitive air pressure sensor is composed of one side of the air pressure sensitive film 200 anodically bonded to the glass substrate 300 , and the other side of the air pressure sensitive film 200 is anodically bonded to the glass cover plate 100 .
[0037] The base material of the air pressure sensitive film 200 of the capacitive air pressure sensor is the device layer of an N-type ultra-low resistivity (<0.005Ω·cm) SOI wafer, on which a P-type silicon electrical isolation region 203 is formed by heavy doping, and the P The P-type silicon electrical isolation region 203 is an annular structure with an open end, and a rectangular isolation grid is processed in the inner diameter direction of the annula...
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Abstract
The invention discloses an MEMS capacitive air pressure sensor based on PN junction electrical isolation and anodic bonding technologies. The MEMS capacitive air pressure sensor comprises an air pressure sensitive film, a glass substrate and a glass cover plate. One surface of the air pressure sensitive film is anodically bonded with the glass substrate to form a vacuum reference cavity; the othersurface of the air pressure sensitive film is in anodic bonding with the glass cover plate to form an open type air pressure sensing cavity, an external air pressure is applied to the air pressure sensitive film, a pressure difference is formed between the external air pressure and the vacuum reference cavity to deform the air pressure sensitive film, so that the distance between capacitance plates of the air pressure sensitive film and the glass substrate is changed and thus the capacitance value is changed to reflect the external air pressure. The invention also discloses a processing technology of the MEMS capacitive air pressure sensor. The capacitive air pressure sensor is simple in processing technology, high in yield and good in commercialization effect.
Description
technical field [0001] The invention relates to a MEMS capacitive air pressure sensor based on PN junction electric isolation and anode bonding technology, and belongs to the field of MEMS micromachining and manufacturing. Background technique [0002] Air pressure sensors are widely used in aerospace fields, vacuum instrumentation equipment, industrial field control and detection, land-based and marine meteorology, health monitoring and smart medical care, and are also used in space science, deep space atmospheric physics exploration (moon, Mars, Saturn) ) is one of the important sensors needed in the field of exploration. Different from traditional mechanical air pressure sensors, Micro-Electro-Mechanical System (MEMS) air pressure sensors are becoming more and more widely used due to their advantages of small size, light weight, low power consumption and integration. Applications. How to achieve low-cost small-volume packaging and reliable electrical extraction technolo...
Claims
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Login to View More IPC IPC(8): G01L9/12B81C3/00
CPCB81C3/001G01L9/12
Inventor 郭伟龙焦海龙杨挺王晓宇冯建尹玉刚金小锋
Owner BEIJING RES INST OF TELEMETRY