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Acidic copper plating additive and preparation method thereof

A technology of acidic copper plating and additives, which is applied in the field of additives for electroplating, which can solve the problems of poor performance improvement of electroplating bath, poor performance improvement of coating, and insufficient corrosion resistance, etc., to improve coating adhesion and smooth surface Brightening, Gloss Improvement Effect

Inactive Publication Date: 2020-05-01
浙江金欣新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] 1. The performance of the coating after electroplating is not improved well, such as the corrosion resistance is not good enough, and the gloss is low;
[0007] 2. Poor improvement of the performance of the electroplating bath

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A kind of acidic copper plating additive, is made from the raw material that comprises following parts by weight:

[0032] Main complexes, secondary complexes, surfactants and other additives;

[0033] The main complex is sodium polydisulfide dipropanesulfonate;

[0034] The auxiliary complex is 2-mercaptobenzimidazole copper salt;

[0035] The surfactant is a mixture of phenethylphenol polyoxyethylene ether and 2-mercaptobenzimidazole, wherein the molar ratio of the two is 1:0.35-0.45;

[0036] The other additives are 5-methylbenzotriazole.

[0037] Preferably, the dosage of the acidic copper plating additive is that the contents of each raw material in each liter of electroplating zinc plating solution are respectively: 10-20 mg / L of the main complex, 4-8 mg / L of the auxiliary complex, and 45 mg / L of the surfactant. ~75mg / L and other additives 8~13mg / L.

[0038] Preferably, the amount of the acidic copper plating additive is such that the contents of each raw mate...

Embodiment 2

[0046] A kind of acidic copper plating additive, is made from the raw material that comprises following parts by weight:

[0047] Main complexes, secondary complexes, surfactants and other additives;

[0048] The main complex is sodium polydisulfide dipropanesulfonate;

[0049] The auxiliary complex is 2-mercaptobenzimidazole copper salt;

[0050] The surfactant is a mixture of phenethylphenol polyoxyethylene ether and 2-mercaptobenzimidazole, wherein the molar ratio of the two is 1:0.35;

[0051] The other additives are 5-methylbenzotriazole.

[0052] In this embodiment, the amount of the acidic copper plating additive is that the content of each raw material in each liter of electro-galvanizing bath is respectively: 12 mg / L of the main complex, 5 mg / L of the auxiliary complex, and 50 mg / L of the surfactant. L and other additives 9mg / L.

[0053] In this embodiment, hydrochloric acid is also included; the hydrochloric acid adjusts the pH of the electro-galvanizing bath to ...

Embodiment 3

[0058] A kind of acidic copper plating additive, is made from the raw material that comprises following parts by weight:

[0059] Main complexes, secondary complexes, surfactants and other additives;

[0060] The main complex is sodium polydisulfide dipropanesulfonate;

[0061] The auxiliary complex is 2-mercaptobenzimidazole copper salt;

[0062] The surfactant is a mixture of phenethylphenol polyoxyethylene ether and 2-mercaptobenzimidazole, wherein the molar ratio of the two is 1:0.45;

[0063] The other additives are 5-methylbenzotriazole.

[0064] In this embodiment, the dosage of the acidic copper plating additive is that the content of each raw material in each liter of electro-galvanizing bath is respectively: main complex 18mg / L, auxiliary complex 7.2mg / L, surfactant 68mg / L and other additives 12mg / L.

[0065] In this embodiment, hydrochloric acid is also included; the hydrochloric acid adjusts the pH of the electro-galvanizing bath to 4.5.

[0066] In the present...

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PUM

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Abstract

The invention discloses an acidic copper plating additive. The additive is prepared from, by weight, a main complex, an auxiliary complex, a surfactant and other additives, wherein the main complex isbis-(sodium sulfopropyl)-disulfide, the auxiliary complex is 2-mercaptobenzimidazol copper salt, the surfactant is a mixture of pesticide emulsifier 603 and 2-mercaptobenzimidazole, the molar ratio of pesticide emulsifier 603 to 2-mercaptobenzimidazole is 1:(0.35-0.45), and other additives are tolyltriazole. The acidic copper plating additive can greatly improve the coating adhesion of a copper-plated product, the corrosion resistance is remarkably improved, the glossiness is improved, and the surface is flat and bright.

Description

technical field [0001] The invention relates to the technical field of additives for electroplating, in particular to an acidic copper plating additive and a preparation method thereof. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation ( Such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the appearance. [0003] Copper electroplating is the most important method to achieve electrical interconnection in electronic products. Organic additives are usually used to achieve uniform conductive patterns and obtain excellent coating properties. The electroplating copper additives currently used in the production of printe...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 潘璐洁黄海宾
Owner 浙江金欣新材料科技股份有限公司
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