Epoxy resin composition

A technology of epoxy resin and epoxy resin layer, which is applied in the field of composite materials, can solve problems such as easy fracture and collapse, weak rigidity, and low melting point, and achieve the effect of improving surface hardness, enhancing toughness, and not being easily damaged

Inactive Publication Date: 2020-05-05
TONGLING TONGFEI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to make up for the deficiencies of the prior art and solve the problems of low toughness, low melting point and weak rigidity of epoxy resin sheets in high-temperature environments, which are relatively prone to fracture and collapse, an epoxy resin composition proposed by the present invention

Method used

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  • Epoxy resin composition
  • Epoxy resin composition
  • Epoxy resin composition

Examples

Experimental program
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Effect test

preparation example Construction

[0038] This epoxy resin composition preparation method comprises the following steps:

[0039] S1: Add epoxy resin, ethanol, and ethyl acetate into the reaction kettle and mix, then heat to 80-90°C. After the epoxy resin and ethyl acetate are completely dissolved in the ethanol solution, turn on the emulsifying disperser and adjust the dispersion speed to 5000rmp for high-speed dispersion, stop emulsification and dispersion after 2 hours of timing and keep warm for 1 hour;

[0040] S2: After mixing the nano-ceramic powder and polyester fiber, it is pulverized by a nano-high-pressure pulse mill and then filtered through a 500-mesh screen to obtain a mixed powder. The mixed powder is added to the reaction kettle and the emulsification disperser is turned on. The dispersion speed is adjusted to 2000rmp for dispersing for 20 Minutes later, when the temperature of the reactor drops to 60°C, add cationic polyacrylamide, adjust the dispersion speed to 5000rmp and disperse for 1 hour,...

Embodiment approach

[0052] As an embodiment of the present invention, the decoration plate includes an epoxy resin layer 1 and a filling layer 2; the number of the epoxy resin layer 1 is two and the filling layer 2 is located between the two epoxy resin layers 1; The epoxy resin layer 1 is fixed with glass fiber cloth 3 near the side of the filling layer 2; the filling layer 2 includes a support frame 4 and a sound-absorbing sponge 5; the support frame 4 has a honeycomb structure; the sound-absorbing sponge 5 It is filled inside the honeycomb of the support frame 4; the sound-absorbing sponge 5 is fixed with uniformly arranged rubber capsules 6; the interior of the rubber capsule 6 is filled with water; the surface of the rubber capsule 6 is provided with micropores, and the micropores in the initial state in a closed state;

[0053] During work, the epoxy resin layer 1 is poured on both sides of the filling layer 2 to obtain a plate, which is used for decoration. When a fire breaks out, the envi...

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Abstract

The invention belongs to the technical field of composite materials, and particularly relates to an epoxy resin composition. The decorative plate comprises epoxy resin layers and a filling layer, thenumber of the epoxy resin layers is two, and the filling layer is located between the two epoxy resin layers. The side, close to the filling layer, of each epoxy resin layer is fixedly connected withglass fiber cloth. The filling layer comprises a supporting frame and sound absorption sponge. The supporting frame is of a honeybee-worm-shaped structure. The supporting frame honeycomb is filled with the sound absorption sponge. Rubber bags which are uniformly distributed are fixedly connected to the interior of the sound absorption sponge. The rubber bags are filled with water. Micropores are formed in the surfaces of the rubber bags and are closed in an initial state. According to the invention, sodium bicarbonate filling the sound absorption sponge is self-decomposed in a high-temperatureenvironment, so that the sodium bicarbonate is matched with water in the rubber bags to cool the whole plate, and meanwhile, the sodium bicarbonate reacts with a compound in epoxy resin to generate calcium carbonate to play a role in supporting and reinforcing while the temperature is reduced.

Description

technical field [0001] The invention belongs to the technical field of composite materials, in particular to an epoxy resin composition. Background technique [0002] Epoxy resins generally refer to organic polymer compounds containing two or more epoxy groups in their molecules, and their relative molecular weights are not high except for a few. The molecular structure of epoxy resin is characterized by active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or ring structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can cross-link with various types of curing agents to form insoluble, infusible high polymers with a three-way network structure, and epoxy resin sheets are Refers to boards made of epoxy resin as the main raw material. In today's house decoration, epoxy resin boards are frequently used in home decoration because of their high mechanical and dielectric properties and good ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L33/26C08L23/12C08K13/02C08K3/26C08K3/22C08K3/04C08K3/36C08J9/08B32B27/38B32B27/12B32B3/12B32B5/18B32B5/02B32B3/08B32B3/24B32B27/20B32B33/00
CPCB32B3/085B32B3/12B32B3/266B32B5/02B32B5/18B32B27/12B32B27/20B32B27/38B32B33/00B32B2262/101B32B2307/102B32B2307/302B32B2307/306B32B2307/536B32B2307/554B32B2307/558B32B2307/714B32B2307/734B32B2607/00C08J9/0061C08J9/0066C08J9/0071C08J9/0095C08J9/08C08J2203/02C08J2363/00C08J2423/12C08J2433/26
Inventor 汤泽波徐湘华
Owner TONGLING TONGFEI TECH
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