Graphene AB adhesive and preparation method thereof

Abstract

The invention relates to a graphene AB adhesive and a preparation method. The graphene AB adhesive comprises a component A and a component B. The component A comprises the following components by weight: 30%-60% of bisphenol glycidyl ether epoxy resin, 10%-30% of polyphenol type glycidyl ether epoxy resin, 1%-10% of heterocyclic mixed epoxy resin, 1%-10% of a reactive diluent, 1-10% of a toughening agent, 5%-30% of graphene, 1%-10% of carbon nanotubes, 0.1%-2% of a carbon interface treating agent, and 0.01%-1% of a reactive organic silicon modifier. The component B comprises the following components by weight: 40%-60% of a curing agent, 1%-10% of a curing accelerator, 1%-10% of an inactive diluent, 5%-30% of graphene, 1%-10% of carbon nanotubes, 0.1%-2% of a carbon interface treating agent, and 0.01%-1% of a reactive organic silicon modifier. Compared with the prior art, according to the graphene AB glue and a graphene-based electromagnetic and heat shielding epoxy material, the excellent electronic effect, heat effect and other physical properties of graphene are utilized, the electromagnetic and heat simultaneous shielding performance is achieved, the weight ratio and the volumeratio are properly controlled, all the components achieve a synergistic effect, and excellent mechanical strength and reliable stability are achieved.

Description

technical field [0001] The invention belongs to the technical field of adhesive materials, and relates to a graphene AB glue and a preparation method thereof. Background technique [0002] Epoxy resin molecular chains contain epoxy groups and epoxy-based ring structures. The unique three-membered ring structure can be cross-linked with acid-base curing agents to form a thermosetting material with a three-way network structure and a bulk molecular structure. Polar groups such as epoxy group, hydroxyl group, ether bond and ester bond lead to high mechanical properties, excellent adhesion performance, small curing shrinkage rate and stable electrical properties of epoxy resin thermosetting materials, which can meet various special performance and process performance The requirements of other thermosetting materials cannot match it. Epoxy AB glue is an adhesive made of epoxy resin. Its chemical resistance, physical resistance and process ease of operation make it widely used in...

AI Technical Summary

Problems solved by technology

Traditional metals and metal oxides have single electronic and electrical functions, limited functions, and are prone to chemical reactions with acidic and alkaline curing agents in epoxy thermosetting materials, which seriously affects the stability and reliability of electronic electrification performance.

A large number of functionalized metals and metal oxides occupy a large volume ratio and weight ratio in epoxy resins, which are easy to migrate, settle and delaminate, resulting in a substantial increase in the viscosity of epoxy thermosetting materials before curing, poor process operability, and Hard and brittle, the flexibility and fatigue resistance are seriously reduced, the mechanical properties are reduced, the adhesion with the substrate is deteriorated, and the thermosetting materials filled with a large amount of functionalized metals and metal oxides have poor stability during operation. In special environments such as humidity and heat, Force and functionality fade over time and reliability is severely compromised

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