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Insulating flame-retardant potting mixture and preparation method thereof

A mixture and potting technology, applied in the direction of adhesive types, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of high unit price of high-end flame retardant epoxy, high energy consumption, and increased use cost of enterprises , to prevent toxic gases and corrosive odors, reduce the cost of use, good flame retardant and smoke suppression effects

Pending Publication Date: 2020-05-05
鹤山市欧克特电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary insulating and flame-retardant potting adhesives mostly use halogen-containing flame retardants, which tend to emit toxic odors at high temperatures; while the unit price of high-end flame-retardant epoxy is relatively high, and low-halogen products are more than five to ten times the price of halogen-containing products
In addition, the insulation and flame-retardant potting adhesive made of ordinary epoxy resin as the matrix cannot meet the requirements of insulation performance and voltage resistance after epoxy curing; and the epoxy resin is greatly affected by the environment during curing, which has a great impact on The environment (curing temperature, humidity) is demanding. Generally, the curing temperature reaches above 100 degrees Celsius, and the curing time is about 5 hours, which leads to excessive energy consumption and increases the use cost of the enterprise.

Method used

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  • Insulating flame-retardant potting mixture and preparation method thereof
  • Insulating flame-retardant potting mixture and preparation method thereof
  • Insulating flame-retardant potting mixture and preparation method thereof

Examples

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Effect test

Embodiment 1

[0029] A preparation method for an insulating flame-retardant potting mixture, comprising the following steps:

[0030] Step 1, preparation of agent A: take the following raw materials in proportion by mass percentage, bisphenol A epoxy resin 36%, bisphenol F epoxy resin 9%, aluminum hydroxide 18%, silicon dioxide 13%, hypophosphorous acid Aluminum 9%, benzyl alcohol 8%, defoamer 2%, leveling agent 2%, anti-settling agent 1%, thickener 2%; first mix bisphenol A epoxy resin and bisphenol F epoxy resin Evenly, add aluminum hydroxide and silicon dioxide to it, move to the disperser to disperse until its fineness is within 100 microns; add aluminum hypophosphite and transfer to the emulsifier for emulsification, the speed of the emulsifier is 1000 rpm Minutes; emulsify the material to heat up, measure the temperature, add defoamer, leveling agent, anti-settling agent, benzyl alcohol after the temperature reaches 110 degrees, test its viscosity after adding, if the viscosity is not...

Embodiment 2

[0034] A preparation method for an insulating flame-retardant potting mixture, comprising the following steps:

[0035] Step 1, preparation of agent A: take the following raw materials by mass percentage, 30% of bisphenol A epoxy resin, 10% of bisphenol F epoxy resin, 20% of aluminum hydroxide, 15% of silicon dioxide, zinc borate 10%, benzyl alcohol 10%, defoamer 1%, leveling agent 1%, anti-settling agent 2%, thickener 1%; first mix bisphenol A epoxy resin and bisphenol F epoxy resin and stir well , then add aluminum hydroxide and silicon dioxide to it, move to a disperser to disperse until its fineness is within 100 microns; add zinc borate and transfer to an emulsifier for emulsification, and the speed of the emulsifier is 1000 rpm; Emulsify to heat up the material, measure the temperature, add defoamer, leveling agent, anti-settling agent, benzyl alcohol after the temperature reaches 110 degrees, test its viscosity after adding, if the viscosity is not enough, add a thicken...

Embodiment 3

[0039] A preparation method for an insulating flame-retardant potting mixture, comprising the following steps:

[0040] Step 1, preparation of agent A: Weigh the following raw materials by mass percentage, bisphenol A epoxy resin 40%, bisphenol F epoxy resin 5%, aluminum hydroxide 19%, silicon dioxide 12%, melamine 8% %, benzyl alcohol 9%, defoamer 2%, leveling agent 2%, anti-settling agent 1.5%, thickener 1.5%; first mix bisphenol A epoxy resin and bisphenol F epoxy resin evenly, Add aluminum hydroxide and silicon dioxide therein again, move to disperser and disperse to its fineness in the scope of 100 microns; Add melamine and transfer to emulsifying machine for emulsification, the rotating speed of emulsifying machine is 1000 rev / min; Heat up the material, measure the temperature, add defoamer, leveling agent, anti-settling agent, benzyl alcohol after the temperature reaches 110 degrees, test its viscosity after adding, if the viscosity is not enough, add a thickener to mak...

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Abstract

The invention relates to an insulating flame-retardant potting mixture and a preparation method thereof. The potting mixture is composed of an agent A and an agent B in a ratio of (95-105): (35-45) byperforming mixing, wherein the agent A comprises the following components in percentage by mass: 30-40% of bisphenol A epoxy resin, 5-10% of bisphenol F epoxy resin, 15-20% of aluminum hydroxide, 10-15% of silicon dioxide, 5-10% of an environment-friendly flame retardant, 5-10% of benzyl alcohol, 1-2% of an antifoaming agent, 1-2% of a leveling agent, 1-2% of an anti-settling agent and 1-2% of athickener. And the agent B comprises the following components in percentage by mass: 90-95% of an anhydride curing agent and 5-10% of an accelerant. The insulating flame-retardant potting mixture disclosed by the invention is moderate in price and relatively low in production energy consumption, and the preparation method of the insulating flame-retardant potting mixture is simple and low in cost.

Description

technical field [0001] The invention relates to the technical field of electronic component packaging, in particular to an insulating and flame-retardant potting mixture and a preparation method thereof. Background technique [0002] Insulating flame-retardant potting adhesives are widely used in potting of mechanical and electronic components due to their excellent mechanical properties, chemical resistance and electrical insulation properties. Most of the insulation flame retardant potting glue is based on ordinary epoxy resin and mixed with curing agent in a certain proportion. Ordinary insulating and flame-retardant potting adhesives mostly use halogen-containing flame retardants, which tend to emit toxic odors at high temperatures; while the unit price of high-end flame-retardant epoxy is relatively high, and low-halogen products are more than five to ten times the price of halogen-containing products . In addition, the insulation and flame-retardant potting adhesive ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C08G59/42C09J11/04
CPCC09J163/00C09J11/04C08G59/4215C08L2205/025C08L2203/206C08L2201/02C08K2003/2227C08L63/00C08K13/02C08K3/22C08K3/36
Inventor 杨小平
Owner 鹤山市欧克特电子科技有限公司
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