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A ceramic/polytetrafluoroethylene composite dielectric substrate and its preparation method

A polytetrafluoroethylene and ceramic technology, used in the field of composite dielectric substrates, can solve the problems of unevenness, non-leveling, high dispersibility, stability and rheological requirements.

Active Publication Date: 2021-09-21
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the casting method has high requirements on the dispersion, stability and rheology of the slurry, and the viscosity must be within an appropriate range, and the slurry behaves as a shear-thinning fluid, which is beneficial to the casting process. However, the currently used Polytetrafluoroethylene (PTFE) emulsion has a low viscosity and behaves as a dilatant fluid, which is not suitable for the tape casting process, and defects such as unevenness and inability to flow will occur

Method used

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  • A ceramic/polytetrafluoroethylene composite dielectric substrate and its preparation method
  • A ceramic/polytetrafluoroethylene composite dielectric substrate and its preparation method
  • A ceramic/polytetrafluoroethylene composite dielectric substrate and its preparation method

Examples

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Effect test

Embodiment 1

[0041] The silicon dioxide powder was uniformly mixed with 60wt% polytetrafluoroethylene emulsion (brand SFN-2H) at a ratio of 35:101.7 parts by weight. Then add 4 parts by weight of additive polyvinyl alcohol to adjust the viscosity of the slurry to the range of 500mPa·s-1500mPa·s. Adjust the height of the scraper to 2mm, cast the slurry on a glass fiber cloth substrate with a thickness of 0.04mm at a speed of 15cm / min, put it in an oven for drying, and use a gradient temperature rise program to discharge the additives and other impurities in the casting sheet. Then cool to room temperature. The specific gradient temperature program is: keep at 80°C for 2h, keep at 180°C for 2h, keep at 260°C for 4h, and keep at 330°C for 4h. Cut the cooled sheet, and use a hot press to perform double-sided copper-clad hot pressing in a vacuum high-temperature and high-pressure environment, where the pressure is 18MPa, the holding time is 1h, and the thickness of the copper foil is 35μm to o...

Embodiment 2

[0043] A ceramic / polytetrafluoroethylene composite dielectric substrate was prepared according to the method of Example 1, except that the weight ratio of silicon dioxide powder, polytetrafluoroethylene emulsion and polyvinyl alcohol was 30:110:4.

Embodiment 3

[0045] A ceramic / polytetrafluoroethylene composite dielectric substrate was prepared according to the method of Example 1, except that the weight ratio of silicon dioxide powder, polytetrafluoroethylene emulsion and polyvinyl alcohol was 25:118.3:4.

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Abstract

The present invention relates to the field of composite dielectric substrates, in particular to a composite material used in a casting process and a ceramic / polytetrafluoroethylene casting sheet prepared therefrom with glass fiber cloth as a base, and also relates to a ceramic / polytetrafluoroethylene casting sheet. A vinyl fluoride composite dielectric substrate and a preparation method thereof. The ceramic / polytetrafluoroethylene composite dielectric substrate of the present invention has a simple preparation process, environmentally friendly raw materials, can achieve high content of ceramic filling and large ceramic / resin layer thickness requirements, and has excellent electrical properties and low thermal expansion coefficient.

Description

technical field [0001] The invention relates to the field of composite dielectric substrates, in particular to a ceramic / polytetrafluoroethylene composite dielectric substrate prepared by a water-based casting method. Background technique [0002] Copper Clad Laminate (CCL), referred to as CCL, is a plate-shaped material formed by covering one or both sides of an insulating material with copper foil and hot pressing. Copper-clad laminates are often used as substrate materials for printed circuit boards (PCBs), which play the roles of interconnection, conduction, insulation, and support in printed circuit boards, and their performance directly affects the quality of electronic products. In recent years, with the rapid development of electronic information technology, the performance requirements of copper clad laminates are getting higher and higher, and composite dielectric substrates have received more and more attention. [0003] Polytetrafluoroethylene (PTFE) material ha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/32B32B27/18B32B9/00B32B9/04B32B27/12B32B17/02B32B17/10B32B15/20B32B15/14B32B15/085B32B33/00C08L27/18C08L29/04C08K3/36B29D7/01B29C65/02
CPCB29C65/02B29D7/01B32B5/02B32B9/005B32B9/047B32B15/085B32B15/14B32B15/20B32B17/10B32B27/12B32B27/18B32B27/322B32B33/00B32B2262/101B32B2457/08C08K2201/003C08L27/18C08L29/04C08K3/36
Inventor 沈杰李强志周静金伟祁琰媛陈文
Owner WUHAN UNIV OF TECH
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