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Preparation method for nano-metal in-situ conductive ink

A conductive ink and nano-metal technology, applied in metal processing equipment, ink, application, etc., to achieve low cost, controllable size, and small size

Inactive Publication Date: 2020-05-08
SHENZHEN INST OF WIDE BANDGAP SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This traditional preparation method faces the problem that the conductive filler needs to be prepared in advance and successfully separated from the preparation system. After proper storage and post-treatment, it is evenly mixed with solvents and various additives to prepare metal conductive inks.

Method used

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  • Preparation method for nano-metal in-situ conductive ink
  • Preparation method for nano-metal in-situ conductive ink

Examples

Experimental program
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preparation example Construction

[0025] The invention provides a preparation method of nanometer metal in-situ conductive ink, such as figure 1 As shown, a preparation system consisting of a spark ablation device 1 and a collection device 2 connected in sequence is used, including the following steps:

[0026] Step 1, use the spark ablation device 1 to prepare nano-metal particles, and prepare the nano-metal particles through the discharge of the electrode 3 of the spark ablation device and the gasification process of the electrode material, and gas input pipes are respectively provided on both sides of the spark ablation device The gas output pipe is provided with a first valve 11, the gas output pipe of the spark ablation device communicates with the cavity of the collection device, the gas output pipe is provided with a second valve 12, and one end of the gas output pipe is connected to the collection device. The bottom of the device, the top or side of the collection device chamber is equipped with a one-...

Embodiment 1

[0032] Example 1 This example provides a method for preparing a nano-copper-silver alloy in-situ conductive ink

[0033] Use a preparation system consisting of a spark ablation device 1 and a collection device 2 connected in sequence, comprising the following steps:

[0034] Step 1, using a spark ablation device 1 to prepare nano-copper-silver alloy particles;

[0035] Step 2: Put the prepared ethanol, ethyl cellulose, triethylhexyl phosphoric acid and organosiloxane into the composite solvent mixed in the collection device 2, and prepare the nano-copper-silver alloy particles with a flow rate of 2L / min The nitrogen gas is brought into the collecting device 2 to directly prepare the conductive ink with 30% solid content.

Embodiment 2

[0036] Example 2 This example provides a method for preparing a nano-copper-tin alloy in-situ conductive ink

[0037]Use a preparation system consisting of a spark ablation device 1 and a collection device 2 connected in sequence, comprising the following steps:

[0038] Step 1, using the spark ablation device 1 to prepare nano-copper-tin alloy particles;

[0039] Step 2, put diethylene glycol, ethylene glycol butyl ether and fumed silicon oxide composite solvent into the collection device 2, and purging the prepared nano-copper-tin alloy particles with the nitrogen gas with a flow rate of 4L / min Into the collecting device 2, directly make the conductive ink of 40% solid content.

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Abstract

The invention discloses a preparation method for nano-metal in-situ conductive ink. The preparation method is performed by using a preparation system composed of a spark ablation device and a collection device which are sequentially in communication, and comprises the following steps: step 1, preparing nano-metal particles by using the spark ablation device; step 2, putting a prefabricated composite solvent into the collection device; and step 3, blowing the nano-metal particles into the collection device through gas purging, and uniformly mixing the nano-metal particles with a mixed solvent so as to prepare the in-situ conductive ink with a solid content of less than 50%. The method provided by the invention avoids the complex technological processes of preparation, aftertreatment, storage and ink preparation for a traditional conductive filling material; the prepared nano-metal particles and the composite solvent are directly mixed to obtain the in-situ conductive ink; and the complex preparation technological processes of the conductive ink are greatly reduced.

Description

technical field [0001] The invention relates to the technical field of material engineering, in particular to a preparation method of nanometer metal in-situ conductive ink. Background technique [0002] Conductive inks are widely used in industries such as printed circuits and electronic packaging. Conductive inks mainly use conductive fillers dispersed in solvents to make inks with a certain viscosity. Conductive fillers are divided into metal-based conductive fillers and carbon-based conductive fillers according to their properties. Metal-based conductive fillers mainly include conductive powders such as gold, silver, and copper, and have good electrical conductivity. At present, nano-metal-based conductive inks on the market have become very important materials in the field of electronic packaging due to their low sintering temperature, fine-scale processing capabilities, and adaptability to flexible printing. [0003] At present, the preparation of conductive ink is u...

Claims

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Application Information

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IPC IPC(8): C09D11/52B22F1/00B22F9/14
CPCC09D11/52B22F9/14B22F1/054
Inventor 张昱赖韬叶怀宇张国旗
Owner SHENZHEN INST OF WIDE BANDGAP SEMICON