Flash etching liquid medicine, and preparation method and application thereof

A potion and flash etching technology, applied in chemical instruments and methods, removal of conductive materials by chemical/electrolytic methods, and printed circuit manufacturing, etc. Problems such as side erosion phenomenon occur, and the effect of maintaining the rectangular shape, reducing the side erosion effect, and protecting the edges and corners is achieved.

Active Publication Date: 2020-05-08
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the common etching potion on the market has a strong side erosion effect on the copper surface after graphic plating, and the solution is more likely to attack the side wall of the circuit, which is very prone to side erosion, and it is difficult to achieve the effect of only etching the bottom copper; at the same time , the edges and corners of the line are bitten by the potion in two directions, and the rectangular shape of the line section cannot be maintained
[0004] CN102296293A discloses a micro-etching agent for printed circuit boards, including a potassium persulfate compound, a stabilizer, a persulfate and a sulfuric acid system, or a potassium persulfate compound, a stabilizer, a persulfate and a phosphoric acid system; The microetch provided by the patent application has a better biting surface, but does not consider the influence of side etching on the circuit
This patent application uses air atomization technology to achieve the purpose of correcting the amount of side erosion, and the preparation method is relatively complicated

Method used

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  • Flash etching liquid medicine, and preparation method and application thereof
  • Flash etching liquid medicine, and preparation method and application thereof
  • Flash etching liquid medicine, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] A flash corrosion potion with a volume of 1L, including the following components dissolved in deionized water:

[0041]

[0042] The preparation method is as follows:

[0043] (1) 0.3L deionized water, sulfuric acid solution (50%) and hydrogen peroxide solution (50%) are mixed;

[0044] (2) The mixed solution obtained in step (1), 1,2-propanediol, n-propanol, lactic acid and acetic acid are mixed;

[0045] (3) Mix and react the pure copper foil (purchased from Kunshan Luzhifa Electronic Technology Co., Ltd.) with the mixed solution obtained in step (2) three times, and control the reaction temperature to 30°C. After the pure copper foil is completely dissolved, Transfer the mixed solution to a volumetric flask, and wash the reaction vessel three times with deionized water. The cleaning solution is also transferred to a volumetric flask, and finally the volume is adjusted to 1 L with deionized water to obtain a flash corrosion solution.

Embodiment 2-3

[0047] The difference from Example 1 is that in this example, 20g of 1,2-propanediol and 5g of n-propanol (Example 2), 5g of 1,2-Propanediol and 15g of n-propanol (Example 3) are included.

Embodiment 4

[0049] The difference from Example 1 is that in this example, n-propanol is replaced by isopropanol of equal mass.

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Abstract

The invention provides a flash etching liquid medicine, and a preparation method and an application thereof. The flash etching liquid medicine comprises 50-100 g / L of sulfuric acid, 10-50 g / L of hydrogen peroxide, 5-45 g / L of copper ions and 10-35 g / L of mixed alcohol, which are dissolved in deionized water, and the balance of deionized water, wherein the mixed alcohol is a mixture of any two alcohols. The flash etching liquid medicine can be used for effectively removing bottom copper and reducing lateral erosion, effectively protecting edges and corners of a circuit and maintaining the rectangular shape of the cross section of the circuit, and can be suitable for an MSAP process; and the flash etching liquid medicine has good storage stability.

Description

technical field [0001] The invention belongs to the technical field of etching solution, and relates to a flash etching potion and its preparation method and application, in particular to a flash etching potion for MSAP process and its preparation method and application. Background technique [0002] With the rapid development of electronic devices represented by smart phones and tablet computers, electronic products are becoming more and more comprehensive in function and smaller in size, so the requirements for printed circuit boards (PCB) are getting higher and higher, and Driving the PCB industry to develop in the direction of high density, high integration, packaging, miniaturization and multi-layering, the requirements for the refinement level of PCB product lines are also getting higher and higher. At present, the line width and spacing above 75μm / 75μm have already It cannot meet the development requirements of today's electronic products. The line width and line spac...

Claims

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Application Information

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IPC IPC(8): C09K13/06H05K3/06
CPCC09K13/06H05K3/067
Inventor 刘江波李晓红王亚君
Owner 上海天承化学有限公司
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