Inductor, manufacturing method of inductor, packaging module and manufacturing method of packaging module

A technology of inductors and encapsulations, which is applied in the directions of inductance/transformer/magnet manufacturing, transformer/inductor cooling, transformer/inductor coil/winding/connection, etc., which can solve the problems of electromagnetic interference and high loss, and achieve reduction Reduced current resistance and loss, contributes to heat dissipation

Pending Publication Date: 2020-05-15
HEFEI SILERGY SEMICON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The advantage of the inductance structure is that it has a higher window filling rate, but the disadvantage is that in the application of high current, the DCR (direct current resistance) loss of the winding is relatively high, and it is not easy to dissipate
And in high-frequency applications, since the air gap of the inductance structure is exposed, it is easy to generate electromagnetic interference

Method used

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  • Inductor, manufacturing method of inductor, packaging module and manufacturing method of packaging module
  • Inductor, manufacturing method of inductor, packaging module and manufacturing method of packaging module
  • Inductor, manufacturing method of inductor, packaging module and manufacturing method of packaging module

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Embodiment Construction

[0047] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the present invention, some specific details are described in detail. Those skilled in the art can fully understand the present invention without the description of these details. In order to avoid obscuring the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.

[0048] In addition, those of ordinary skill in the art should understand that the drawings provided herein are for illustrative purposes, and the drawings are not necessarily drawn to scale.

[0049] At the same time, it should be understood that in the following description, “circuit” refers to a conductive loop formed by at least one element or sub-circuit through electrical or electromagnetic connection. When an element or circuit is referred to as being "connected to" anoth...

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Abstract

The invention discloses an inductor, a manufacturing method of the inductor, a packaging module and a manufacturing method of the packaging module. The inductor comprises a magnetic core and a winding, and the winding comprises a winding outer ring and a winding middle column located in the winding outer ring. The winding middle column is surrounded by the magnetic core, and the magnetic core is wrapped by the winding outer ring, so that the upper surface of the magnetic core is exposed. The magnetic core is wrapped by the winding outer ring, the sectional area of the winding is increased, thearea of current flowing through the winding is increased, the current impedance of the inductor is reduced, and the loss of the inductor is reduced. Besides, the air gap of the inductor is surroundedby the winding, and when the inductor is applied to a high-frequency occasion, no electromagnetic interference is generated to the outside.

Description

Technical field [0001] The present invention relates to a semiconductor technology, and more specifically, to an inductor and a manufacturing method thereof, and a package module and a manufacturing method thereof. Background technique [0002] Since the increase in switching frequency can significantly reduce the volume of magnetic components, the current IC package integrated power supply is continuously developing towards high frequency in order to increase the overall power density of the power supply. Power products have lower and lower requirements for the inductance of magnetic components. For high-power and high-current inductors, DC impedance is very important, which directly determines the loss of the inductor. There are many types of inductors at present. In high current applications, many single-turn inductor schemes are proposed, such as figure 1 In the shown inductive structure 100, the inductive structure 100 includes a magnetic core 102, a winding 100 and an upper...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/08H01F27/28H01F27/30H01F27/34H01F27/36H01F41/00H01L23/64
CPCH01F27/08H01F27/28H01F27/306H01F27/34H01F27/36H01F41/00H01L23/645
Inventor 代克危建颜佳佳
Owner HEFEI SILERGY SEMICON TECH CO LTD
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