Integrated circuit structure and forming method thereof

A technology of integrated circuit and epoxy resin, which is applied in circuits, electrical components, electric solid devices, etc., can solve the problems of insufficient waterproof and flame-retardant performance, lack of flame-retardant and waterproof materials, and reduce the volume of circuits, so as to avoid cracking of circuit boards and Damage, Overall Toughness Improvement, Stability Improvement Effect

Pending Publication Date: 2020-06-02
四川豪威尔信息科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit structure and its forming method, which solves the problem that only one side of the surface of an ordinary integrated circuit contains conductive circuits when it is used, which is not conducive to reducing the volume of th

Method used

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  • Integrated circuit structure and forming method thereof
  • Integrated circuit structure and forming method thereof

Examples

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Example Embodiment

[0036] Example 1

[0037] Step 1: Prepare preparation tools: Take out all the production tools involved in the preparation work, wipe them with a clean soft cloth, and place them for use;

[0038] Step 2: Organize and summarize the reaction materials: After taking out all the reaction materials involved in the preparation and weighing, put them on the special preparation table according to the type, and cover and seal them, and then place them for use;

[0039] Step 3: Add the reaction material for the first time: Pour the weighed basic resin (80 parts of cycloaliphatic modified epoxy resin, 20 parts of olfactory epoxy resin, 30 parts of novolac resin) into the reaction crucible, and then slowly heat up To 150 degrees Celsius, then add 20 parts of aromatic polyamide, 10 parts of silica, 15 parts of alumina, 10 parts of aluminum nitride, 12 parts of calcium silicate, 12 parts of polymethylsiloxane, and heat slowly after adding To 260 degrees Celsius, then keep it warm for 5 minutes; ...

Example Embodiment

[0043] Example 2

[0044] Step 1: Prepare preparation tools: Take out all the production tools involved in the preparation work, wipe them with a clean soft cloth, and place them for use;

[0045] Step 2: Organize and summarize the reaction materials: After taking out all the reaction materials involved in the preparation and weighing, put them on the special preparation table according to the type, and cover and seal them, and then place them for use;

[0046] Step 3: Add the reaction material for the first time: Pour the weighed basic resin (100 parts of cycloaliphatic modified epoxy resin, 30 parts of olfactory epoxy resin, and 50 parts of novolac resin) into the reaction crucible, and then slowly heat up To 150 degrees Celsius, then add 45 parts of aromatic polyamide, 15 parts of silica, 25 parts of alumina, 15 parts of aluminum nitride, 18 parts of calcium silicate, 15 parts of polymethylsiloxane, and slowly heat after adding To 260 degrees Celsius, then keep it warm for 5 minu...

Example Embodiment

[0050] Example 3

[0051] Step 1: Prepare preparation tools: Take out all the production tools involved in the preparation work, wipe them with a clean soft cloth, and place them for use;

[0052] Step 2: Organize and summarize the reaction materials: After taking out all the reaction materials involved in the preparation and weighing, put them on the special preparation table according to the type, and cover and seal them, and then place them for use;

[0053] Step 3: Add the reaction material for the first time: Pour the weighed basic resin (150 parts of cycloaliphatic modified epoxy resin, 40 parts of olfactory epoxy resin, and 80 parts of novolac resin) into the reaction crucible, and then slowly heat up To 150 degrees Celsius, then add 70 parts of aromatic polyamide, 20 parts of silica, 30 parts of alumina, 20 parts of aluminum nitride, 22 parts of calcium silicate, and 18 parts of polymethylsiloxane. After the addition, heat slowly To 260 degrees Celsius, then keep it warm for...

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Abstract

The invention discloses an integrated circuit structure and a forming method thereof. The integrated circuit comprises raw materials, by weight,: a main material including 80-150 parts of alicyclic modified epoxy resin, 20-40 parts of olfactory epoxy resin, 30-80 parts of linear phenolic resin, 20-70 parts of aromatic polyamide, 10-20 parts of silicon dioxide, 15-30 parts of alumina, 10-20 parts of aluminum nitride, 12-22 parts of calcium silicate and 12-18 parts of polymethylsiloxane; and an auxiliary material including 10-20 parts of aromatic tertiary amine, 10-15 parts of a phosphorus compound, 8-22 parts of aliphatic polyester, 5-12 parts of fatty acid, 15-25 parts of titanate and 15-20 parts of antimony trioxide. According to the integrated circuit structure and the forming method thereof, the flame-retardant capability of the integrated circuit board during working is greatly improved; the stability of the integrated circuit board is effectively improved, toughening agents, namely organic silicon rubber and nitrile butadiene rubber, are added into the integrated circuit structure, the overall toughness of the integrated circuit is greatly improved, and cracking and damage, caused by bending of the integrated circuit board, of the circuit board are effectively avoided.

Description

Technical field [0001] The present invention relates to the field of integrated circuit technology, in particular to an integrated circuit structure and its forming method. Background technique [0002] The integrated circuit board is a carrier for loading integrated circuits. But it is often said that the integrated circuit is also brought on the integrated circuit board. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board adopts the semiconductor manufacturing process. Many transistors, resistors, capacitors and other components are fabricated on a small single crystal silicon wafer, and the components are combined into a complete device according to the method of multilayer wiring or tunnel wiring. electronic circuit. An integrated circuit is a miniature electronic device or component. A certain process is adopted to interconnect the transistors, resistors, capacitors, and inductors and other components and ...

Claims

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Application Information

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IPC IPC(8): H01L23/492H01L23/14H01L21/48C08L63/00C08L61/06C08L77/10C08L83/04C08L9/02C08K13/02C08K3/36C08K3/28C08K3/34C08K5/09
CPCH01L23/492H01L23/14H01L21/4846C08L63/00C08L2205/025C08L2205/035C08K2003/282C08L2201/02C08L2203/20C08L61/06C08L77/10C08L83/04C08L9/02C08K13/02C08K3/36C08K3/28C08K3/34C08K5/09
Inventor 向彦瑾
Owner 四川豪威尔信息科技有限公司
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