Integrated circuit structure and forming method thereof

Abstract

The invention discloses an integrated circuit structure and a forming method thereof. The integrated circuit comprises raw materials, by weight,: a main material including 80-150 parts of alicyclic modified epoxy resin, 20-40 parts of olfactory epoxy resin, 30-80 parts of linear phenolic resin, 20-70 parts of aromatic polyamide, 10-20 parts of silicon dioxide, 15-30 parts of alumina, 10-20 parts of aluminum nitride, 12-22 parts of calcium silicate and 12-18 parts of polymethylsiloxane; and an auxiliary material including 10-20 parts of aromatic tertiary amine, 10-15 parts of a phosphorus compound, 8-22 parts of aliphatic polyester, 5-12 parts of fatty acid, 15-25 parts of titanate and 15-20 parts of antimony trioxide. According to the integrated circuit structure and the forming method thereof, the flame-retardant capability of the integrated circuit board during working is greatly improved; the stability of the integrated circuit board is effectively improved, toughening agents, namely organic silicon rubber and nitrile butadiene rubber, are added into the integrated circuit structure, the overall toughness of the integrated circuit is greatly improved, and cracking and damage, caused by bending of the integrated circuit board, of the circuit board are effectively avoided.

Description

Technical field [0001] The present invention relates to the field of integrated circuit technology, in particular to an integrated circuit structure and its forming method. Background technique [0002] The integrated circuit board is a carrier for loading integrated circuits. But it is often said that the integrated circuit is also brought on the integrated circuit board. The integrated circuit board is mainly composed of silica gel, so it is generally green. The integrated circuit board adopts the semiconductor manufacturing process. Many transistors, resistors, capacitors and other components are fabricated on a small single crystal silicon wafer, and the components are combined into a complete device according to the method of multilayer wiring or tunnel wiring. electronic circuit. An integrated circuit is a miniature electronic device or component. A certain process is adopted to interconnect the transistors, resistors, capacitors, and inductors and other components and ...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit structure and its forming method, which solves the problem that only one side of the surface of an ordinary integrated circuit contains conductive circuits when it is used, which is not conducive to reducing the volume of the circuit and improving The utilization rate of integrated circuits, and traditional integrated circuits often lack flame retardant and waterproof materials during preparation, resulting in serious shortage of waterproof and flame retardant performance of current integrated circuit structures, which affects the use of problems

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