Heat-conducting and heat-storing phase-change plate and preparation method thereof

Abstract

The invention relates to the technical field of heat dissipation. The invention provides a heat-conducting and heat-storing phase-change plate and a preparation method thereof. The heat-conducting andheat-storing phase-change plate comprises a phase change plate shell and a phase change composite material. A closed containing cavity is defined by the phase change plate shell. The phase-change composite material is filled in the containing cavity, the phase change plate shell is made of a heat conduction material, and the phase change composite material comprises the following raw material components in parts by weight: 300-600 parts of a phase change material, 100-250 parts of a heat conduction filler, 0-80 parts of a base material, 0-15 parts of a coupling agent and 0-3 parts of a heat stabilizer. The heat-conducting and heat-storing phase-change plate is high in phase change latent heat, large in heat conduction coefficient, good in durability, free of toxicity and corrosion to electronic components, easier to clean and repair, good in interface compatibility, low in manufacturing cost, simple in formula and convenient to use.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a heat conduction heat storage phase change plate and a preparation method thereof. Background technique [0002] With the rapid development of electronic integration technology, electronic equipment is developing in the direction of miniaturization and thinning, and the integration degree of the system is getting higher and higher. On the other hand, with the application of high-power components in electronic equipment, the thermal power consumption increases sharply, and the resulting heat does not have enough space to dissipate, which directly affects the working performance and service life of the product. Statistics show that more than 40% of the The reliability (life) failure of electronic products is caused by the problem of temperature rise. With the advent of the 5G era, the heat dissipation task of electronic products has become particularly severe...

AI Technical Summary

Problems solved by technology

[0005] (1) The durability of phase change materials, that is, the physical and chemical properties are easy to degrade during the phase change cycle, which affects its heat storage and thermal conductivity

Some common heat-conducting phase-change materials on the market are prone to drying and cracking during medium and long-term use;

[0006] (2) The pollution of electronic components by phase change materials, because the materials after phase change have a certain fluidity, they are easy to leak from the matrix, immerse into the gaps of the devices, and cause pollution to the devices;

[0007] (3) It is relatively difficult to repair electronic components after using phase change materials. The phase change materials fully fill the surface and gaps of wetted devices, which are difficult to remove during the repair process, and are easy to damage electronic components, which greatly increases the cost of repair;

[0008] (4) The interface compatibility between phase change materials and electronic components. The phase change material formula involves materials with multiple components, and the difference in expansion coefficient between them and the device is likely to cause internal stress. The material also has the risk of chemical reaction with the surface of the device, which greatly affects the performance of electronic components

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