Shell, preparation method of shell and electronic device with shell

Abstract

A shell comprises a first shell body and a second shell body, the first shell body is annular, and the first shell body comprises an inner surface and an outer surface opposite to the inner surface; and the second shell comprises a peripheral wall, the peripheral wall is arranged on the outer surface of the first shell in a sleeving mode, the second shell is of a composite structure and comprisesat least one composite material layer, and each composite material layer comprises a single-layer or multi-layer stacked composite layer. The invention further provides a preparation method of the shell and an electronic device with the shell.

Description

technical field [0001] The invention relates to a casing, a method for preparing the casing and an electronic device with the casing. Background technique [0002] With the advent of the 5G communication era, all-metal mobile phone back shells will be abandoned by mobile terminals due to interference with antenna signals. Non-metallic materials such as plastics, composite plates, glass, and ceramics have little interference with antenna signals, but plastics , Composite plates are difficult to give products a high-end, atmospheric and calm temperament, and cannot reflect the added value of products. The overall strength of glass and ceramic materials has not yet reached the level of application as the core mechanism of electronic product shells (middle frame / integrated rear shell). In response to the above problems, the industry currently mainly implements them through the selection of different materials and corresponding surface treatment processes, such as plastic materia...

AI Technical Summary

Problems solved by technology

[0002] With the advent of the 5G communication era, all-metal mobile phone back shells will be abandoned by mobile terminals due to interference with antenna signals. Non-metallic materials such as plastics, composite plates, glass, and ceramics have little interference with antenna signals, but plastics , Composite plates are difficult to endow products with high-end, atmospheric and stable temperament, and cannot reflect the added value of products. The overall strength of glass and ceramic materials has not yet reached the level of application as the core mechanism (middle frame / integrated rear shell) of electronic products.

In response to the above problems, the industry currently mainly implements them through the selection of different materials and corresponding surface treatment processes, such as plastic materials with baking paint and in-mold decoration technology, glass and ceramic materials with grinding and polishing, printing, and physical vapor deposition (PVD) processes. There are some problems, such as: (1) Defects in the plastic material process: a. After the plastic material is molded, it needs to be painted or printed for many times to meet the requirements for appearance and reliability; b. The surface hardness of the plastic shell and the Insufficient overall strength; c. The baking paint process has serious environmental pollution; (2) Defects in the glass material process: a. The glass forming process is more complicated, and it is more difficult to form a 3D structure, and the process and yield rate are not easy to control; b. Glass shell products Insufficient structure, unable to meet the strength requirements of mechanical components of electronic products; (3) Defects in the ceramic material process: a. The ceramic dry pressing process cannot form the complex internal structure of the electronic product shell, which needs to be processed by CNC, grinding and thinning , polishing and other post-processing to meet the product size and appearance requirements; b. The zirconia ceramic material widely used in the industry as the mechanism shell generally has brittleness problems, and the anti-drop performance is not good; c. The stable production color of the ceramic shell is relatively single, The appearance is mainly black and white; d. The ceramic grinding and polishing process produces a large amount of ceramic grinding waste and sewage, which increases the burden on the environment

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