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Resin composition

A technology of resin composition and compound, applied in the direction of epoxy resin coating, coating, etc., can solve the problems of cost and productivity, and achieve the effect of low linear thermal expansion coefficient and excellent flexibility

Pending Publication Date: 2020-06-09
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for two-layer films, there are problems in cost and productivity

Method used

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  • Resin composition
  • Resin composition
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Examples

Experimental program
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Effect test

preparation example Construction

[0148] Examples of solvents usable for the preparation of component (C) include N,N-dimethylacetamide, N,N-diethylacetamide, N,N-dimethylformamide, N-methyl -Amide-based solvents such as 2-pyrrolidone; ketone-based solvents such as acetone, methyl ethyl ketone (MEK) and cyclohexanone; ester-based solvents such as γ-butyrolactone; hydrocarbon-based solvents such as cyclohexane and methylcyclohexane solvent. Moreover, in preparation of (C)component, an imidization catalyst, an azeotropic dehydration solvent, an acid catalyst, etc. can be used as needed. Examples of imidization catalysts include triethylamine, triisopropylamine, triethylenediamine, N-methylpyrrolidine, N-ethylpyrrolidine, N,N-dimethyl-4 - Tertiary amines such as aminopyridine and pyridine. Examples of the azeotropic dehydration solvent include toluene, xylene, ethylcyclohexane and the like. As an acid catalyst, acetic anhydride etc. are mentioned, for example. The usage-amount of an imidization catalyst, an a...

Embodiment

[0250] Hereinafter, the present invention will be specifically described by way of examples. The present invention is not limited by these examples. In addition, hereinafter, "parts" and "%" indicating amounts represent "parts by mass" and "% by mass", respectively, unless otherwise specified.

Synthetic example 1

[0251]

[0252] Drop into 5-amino-1,1'-biphenyl-2-yl ester of 4-aminobenzoic acid (compound of formula (1 '')) 9.13g ( 30 mmol), 4,4'-(4,4'-isopropylidene diphenoxy) diphthalic dianhydride 15.61g (30 mmol), N-methyl-2-pyrrolidone 94.64g , 0.47 g (6 mmol) of pyridine, 10 g of toluene, under a nitrogen atmosphere, at 180 ° C, while discharging toluene to the outside of the system in the middle, carry out imidization reaction for 4 hours, thus obtaining polyimide containing Polyimide solution of resin 1 (20 mass % of non-volatile components). In the polyimide solution, precipitation of the synthesized polyimide resin 1 was not observed.

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Abstract

Provided is a resin composition with which it is possible to obtain a cured product having a low coefficient of linear thermal expansion in the Z direction (the thickness direction when a layered cured product is obtained) and excellent flexibility. The present invention is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a polyimide resin, the resin composition beingcharacterized in that the component (B) contains (B-1) a maleimide compound having three or more functional groups.

Description

technical field [0001] The present invention relates to a resin composition comprising an epoxy resin and a curing agent; a cured product of the above resin composition; a resin sheet comprising the above resin composition; a multilayer flexible substrate comprising an insulating layer formed of the above resin composition; and A semiconductor device including the above-mentioned multilayer flexible substrate. Background technique [0002] In recent years, there has been an increasing demand for semiconductor components that are thinner, lighter in weight, and have higher mounting density. In order to meet this demand, attention has been paid to the use of flexible substrates as base substrates used in semiconductor components. Flexible substrates can be thin and lightweight compared to rigid substrates. In addition, for flexible substrates, since they are soft and deformable, they can be bent and installed. [0003] A flexible substrate is generally manufactured by perfo...

Claims

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Application Information

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IPC IPC(8): C09D179/08C09D163/00C09D7/61
CPCC09D179/08C09D163/00C09D7/61C08L2205/035C08L2205/025C08L2205/02C08L79/085C08L63/00C08K9/06C08K7/18
Inventor 鹤井一彦
Owner AJINOMOTO CO INC
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