Resin composition

A technology of resin composition and compound, applied in the direction of epoxy resin coating, coating, etc., can solve the problems of cost and productivity, and achieve the effect of low linear thermal expansion coefficient and excellent flexibility

Pending Publication Date: 2020-06-09
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for two-layer films, there

Method used

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  • Resin composition
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Examples

Experimental program
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Example Embodiment

[0148] Examples of solvents that can be used in the preparation of component (C) include N,N-dimethylacetamide, N,N-diethylacetamide, N,N-dimethylformamide, and N-methyl -2-pyrrolidone and other amide solvents; ketone solvents such as acetone, methyl ethyl ketone (MEK) and cyclohexanone; ester solvents such as γ-butyrolactone; hydrocarbon systems such as cyclohexane and methylcyclohexane Solvent. In addition, in the preparation of the component (C), if necessary, an imidization catalyst, an azeotropic dehydration solvent, an acid catalyst, etc. can be used. As the imidization catalyst, for example, triethylamine, triisopropylamine, triethylenediamine, N-methylpyrrolidine, N-ethylpyrrolidine, N,N-dimethyl-4 -Tertiary amines such as aminopyridine and pyridine. Examples of the azeotropic dehydration solvent include toluene, xylene, and ethylcyclohexane. As an acid catalyst, acetic anhydride etc. are mentioned, for example. The usage amount of imidization catalyst, azeotropic d...

Example Embodiment

[0249] Example

[0250] Hereinafter, the present invention will be specifically explained through examples. The present invention is not limited by these examples. It should be noted that, hereinafter, for "parts" and "%" indicating amounts, unless otherwise clearly stated, "parts by mass" and "% by mass" are represented respectively.

Example Embodiment

[0251]

[0252] Into a 500ml separable flask equipped with a nitrogen introduction tube and a stirring device, 9.13g of 4-aminobenzoic acid 5-amino-1,1'-biphenyl-2-yl ester (compound of formula (1'')) 30 mmol), 4,4'-(4,4'-isopropylidene diphenoxy) bisphthalic dianhydride 15.61g (30 mmol), N-methyl-2-pyrrolidone 94.64g , 0.47g (6mmol) of pyridine, 10g of toluene, under nitrogen atmosphere, at 180°C, while venting toluene out of the system in the middle, the imidization reaction was carried out for 4 hours to obtain a polyimide containing Polyimide solution of resin 1 (non-volatile content 20% by mass). In the polyimide solution, precipitation of the synthesized polyimide resin 1 was not observed.

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Abstract

Provided is a resin composition with which it is possible to obtain a cured product having a low coefficient of linear thermal expansion in the Z direction (the thickness direction when a layered cured product is obtained) and excellent flexibility. The present invention is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a polyimide resin, the resin composition beingcharacterized in that the component (B) contains (B-1) a maleimide compound having three or more functional groups.

Description

technical field [0001] The present invention relates to a resin composition comprising an epoxy resin and a curing agent; a cured product of the above resin composition; a resin sheet comprising the above resin composition; a multilayer flexible substrate comprising an insulating layer formed of the above resin composition; and A semiconductor device including the above-mentioned multilayer flexible substrate. Background technique [0002] In recent years, there has been an increasing demand for semiconductor components that are thinner, lighter in weight, and have higher mounting density. In order to meet this demand, attention has been paid to the use of flexible substrates as base substrates used in semiconductor components. Flexible substrates can be thin and lightweight compared to rigid substrates. In addition, for flexible substrates, since they are soft and deformable, they can be bent and installed. [0003] A flexible substrate is generally manufactured by perfo...

Claims

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Application Information

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IPC IPC(8): C09D179/08C09D163/00C09D7/61
CPCC09D179/08C09D163/00C09D7/61C08L2205/035C08L2205/025C08L2205/02C08L79/085C08L63/00C08K9/06C08K7/18
Inventor 鹤井一彦
Owner AJINOMOTO CO INC
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