Film for flexible circuit board and preparation method thereof

A thin-film preparation and thin-film technology, applied in the field of thin-film materials, can solve the problems of insufficient production capacity, high difficulty, and inability to process the cast film, so as to improve the film-forming efficiency, save processing steps and manufacturing costs, and avoid defects in the quality process. Effect

Inactive Publication Date: 2020-06-23
上海恒什塑料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the polyimide film is found to have a large dielectric loss during high-frequency transmission.
However, industrialized liquid crystal polymers are very difficult to process during film formation, and cannot be processed with normal casting film machines (belonging to equipment known in the art). unfriendly environment

Method used

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  • Film for flexible circuit board and preparation method thereof
  • Film for flexible circuit board and preparation method thereof
  • Film for flexible circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Pass through the extruded film production line with the following formula table, set the torque at 90%, and control the melt temperature at 340°C to obtain polyphenylene ether resin film A (the present invention) and resin film B (commonly used) with a width of 200 mm and a thickness of 100 μm. Modified polyphenylene ether resin film)

[0036] Resin film A component is:

[0037] Chemical Name Purchasing Specifications weight component Polyphenylene ether Bluestar LXR040 70％ Silicone resin Nanjing Peiwei MS0825 10％ Inorganic filler Chemours Titanium Dioxide R-101 20％

[0038] Resin film component B is:

[0039] Chemical Name Purchasing Specifications weight component Polyphenylene ether Bluestar LXR040 70％ polystyrene Ningbo Taihua GP535N 10％ Inorganic filler Chemours Titanium Dioxide R-101 20％

[0040] Respectively take 5 samples of resin film A and resin film B to carry out physical p...

Embodiment 2

[0048] Use the following formula table to set the torque 90% by the extruded film production line, and when the temperature of the melt is controlled at 340° C., the polyphenylene ether resin film C (the present invention) and the resin film D (commonly improved) that the width is 200 mm and the thickness is 100 μm are obtained. permanent polyphenylene ether resin film)

[0049] Resin film C component:

[0050] Chemical Name Purchasing Specifications weight component Polyphenylene ether Bluestar LXR040 94.9％ Silicone resin Nanjing Peiwei MS0825 2.1％ Inorganic phosphorus compound Zhejiang Wansheng PX220 3％

[0051] Resin film D component:

[0052]

[0053]

[0054] The flame retardancy test of UL94 soft film plastics (film thickness <0.25mm) was carried out on resin film C and resin film D. According to ASTM D4804-03, the results are as follows:

[0055]

[0056] It can be seen that only a small amount of inorganic phosphorus...

Embodiment 3

[0059] Use the following formula table to set the torque 90% by extruding the film production line, and control the melt temperature at 340 ° C to obtain a polyphenylene ether resin film E (the present invention) with a width of 200 mm and a thickness of 100 μm

[0060] Resin film E component:

[0061]

[0062] It can be seen that as the content of titanium dioxide is different, films with different dielectric constants can be obtained to meet the transmission of signals of different frequencies, and the dielectric loss of the polyphenylene ether resin film of the present invention does not change for signals of different frequencies, and still maintains high efficiency. transmission effect.

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Abstract

In order to overcome the defects in the prior art, the invention discloses the thin film for the flexible circuit board and the preparation method of the thin film, and a copper-clad plate prepared from the thin film has the advantages of extremely small high-frequency dielectric loss performance, excellent temperature resistance, good processability and the like. The formula comprises the following components in parts by weight: 40%-94.9% of polyphenyl ether, 0.1%-10% of organic silicon resin and 0.1%-50% of inorganic filler.

Description

technical field [0001] The invention relates to the field of film materials and is applied to flexible circuit boards. Background technique [0002] As the computing performance of chips continues to improve, high-speed signal transmission requires circuit boards to have lower latency. According to the laws of physics, the signal is transmitted in the material, and the energy loss increases with the increase of frequency. At present, the frequency of 4G communication is still lower than 3GHz. China has opened the new frequency bands 3.3-3.6GHz and 4.8-5GHz for 5G applications. In the future, 5G technology will promote millimeter wave technology, and it will face signal transmission above 30GHz, and the transmission loss will be much higher than The current 4G frequency band, so the corresponding RF cable and antenna soft board will face performance challenges. The requirements of high-frequency and high-speed circuits include the speed and quality of transmission signals. ...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L83/04C08K3/013C08K3/22C08K3/32C08J5/18
CPCC08J5/18C08J2371/12C08J2483/04C08K2003/2241C08K3/013C08K3/32
Inventor 方宝成夏荣捷
Owner 上海恒什塑料技术有限公司
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