A modified urea-formaldehyde resin adhesive for moisture-proof particleboard and preparation method thereof
A technology of urea-formaldehyde resin glue and particleboard, which is applied in the field of particleboard manufacturing, can solve the problems of high water absorption thickness expansion rate, easy to be deformed by moisture, not water resistant, etc., and achieve the effects of improving reactivity, low free formaldehyde content and good water resistance.
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Embodiment 1
[0030] This embodiment provides a modified urea-formaldehyde resin adhesive for moisture-proof particleboard, including the following raw materials in parts by weight: 50 parts of formaldehyde, 38 parts of urea, 6 parts of melamine, 0.5 parts of modifier, and formaldehyde is 44% by mass. Formaldehyde solution, the modifier is a mixture of urotropine, sodium bicarbonate, and ammonium chloride in a weight ratio of 2:0.5:1.
[0031] The preparation method of the modified urea-formaldehyde resin adhesive of the present embodiment comprises the following steps:
[0032] (1) Put formaldehyde into the reaction kettle at one time, stir, and add acid solution to adjust the pH to 3.5-5.0;
[0033] (2) add urea for the first time, melamine and modifying agent for the first time;
[0034] (3) Heating to 70°C for 30 minutes of heat preservation;
[0035] (4) Add lye to adjust the pH to 6.0-6.5, add urea for the second time, and keep warm at 80°C for 60 minutes;
[0036] (5) Add acid sol...
Embodiment 2
[0042] This embodiment provides a modified urea-formaldehyde resin adhesive for moisture-proof particleboard, including the following raw materials in parts by weight: 60 parts of formaldehyde, 40 parts of urea, 8 parts of melamine, 0.6 parts of modifier, and formaldehyde is 44% by mass. Formaldehyde solution, the modifier is a mixture of urotropine, sodium bicarbonate, and ammonium chloride in a weight ratio of 2:0.8:1.
[0043] The preparation method of the modified urea-formaldehyde resin adhesive of the present embodiment comprises the following steps:
[0044] (1) Put formaldehyde into the reaction kettle at one time, stir, and add acid solution to adjust the pH to 4.0-4.5;
[0045] (2) add urea for the first time, melamine and modifying agent for the first time;
[0046] (3) Heating to 60°C and keeping it warm for 40 minutes;
[0047] (4) Add lye to adjust the pH to 6.5-7, add urea for the second time, and keep warm at 90°C for 30 minutes;
[0048] (5) Add acid solution...
Embodiment 3
[0054] This embodiment provides a modified urea-formaldehyde resin adhesive for moisture-proof particleboard, including the following raw materials in parts by weight: 50 parts of formaldehyde, 40 parts of urea, 8 parts of melamine, 0.55 parts of a modifier, and the concentration of formaldehyde is 44.3% by mass. For formaldehyde solution, the modifier is a mixture of urotropine, sodium bicarbonate, and ammonium chloride in a weight ratio of 2:0.5:1.5.
[0055] The preparation method of the modified urea-formaldehyde resin adhesive of the present embodiment comprises the following steps:
[0056] (1) Put formaldehyde into the reaction kettle at one time, stir, and add acid solution to adjust the pH to 4.5-5.0;
[0057] (2) add urea for the first time, melamine and modifying agent for the first time;
[0058] (3) Heating to 80°C and keeping it warm for 40 minutes;
[0059] (4) Add lye to adjust the pH to 6.0-6.5, add urea for the second time, and keep warm at 80°C for 60 minu...
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