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A high ductility electrolytic copper foil and its preparation method

An electrolytic copper foil, ductility technology, applied in the electrolytic process, electroforming, coating and other directions, can solve the problems of poor copper foil ductility, affecting the yield of copper foil, residual organic impurities, etc., to achieve both anti-oxidation ability , Easy to store for a long time, the surface is not rough

Active Publication Date: 2021-01-26
GUANGDONG FINE YUAN SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing electrolytic copper foil is simply produced by electrolytic copper sulfate solution during preparation. The ductility of the copper foil is not good, it is easy to soften and break under high temperature conditions, and it is extremely easy to oxidize and change color, which affects performance. At the same time, the existing In the preparation process, more or less organic impurities will remain in the copper foil, which will affect the yield of the copper foil. Therefore, the present invention proposes a high-ductility electrolytic copper foil and a preparation method to solve the deficiencies in the prior art

Method used

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  • A high ductility electrolytic copper foil and its preparation method
  • A high ductility electrolytic copper foil and its preparation method
  • A high ductility electrolytic copper foil and its preparation method

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Effect test

Embodiment 1

[0028] according to figure 1 As shown, a high-ductility electrolytic copper foil includes a raw foil 1, a barrier layer 2 and an anti-oxidation coating 3. The surface of the raw foil 1 is a roughened surface, and a barrier layer 2 is provided on the roughened surface. The barrier layer 2 is externally coated with an anti-oxidation coating 3 .

[0029] The thickness of the raw foil 1 is 50 μm, and the arithmetic mean value Ra of roughness of the rough surface of the raw foil 1 is 0.6 μm.

[0030] The barrier layer 2 is zinc particles.

[0031] The anti-oxidation coating 3 is a chromate solution.

[0032] according to figure 2 Shown, a kind of preparation method of high ductility electrolytic copper foil, comprises the following steps:

[0033] Step 1: Select copper material and copper wire of the same purity as the main material. The purity of the main material is greater than 99.8%. First, remove the impurities from the main material. The specific operation is annealing t...

Embodiment 2

[0041] according to figure 1 As shown, a high-ductility electrolytic copper foil includes a raw foil 1, a barrier layer 2 and an anti-oxidation coating 3. The surface of the raw foil 1 is a roughened surface, and a barrier layer 2 is provided on the roughened surface. The barrier layer 2 is externally coated with an anti-oxidation coating 3 .

[0042] The thickness of the raw foil 1 is 50 μm, and the arithmetic mean value Ra of roughness of the rough surface of the raw foil 1 is 0.6 μm.

[0043] The barrier layer 2 is zinc particles.

[0044] The anti-oxidation coating 3 is zinc salt solution.

[0045] according to figure 2 Shown, a kind of preparation method of high ductility electrolytic copper foil, comprises the following steps:

[0046] Step 1: Select copper material and copper wire of the same purity as the main material. The purity of the main material is greater than 99.8%. First, remove the impurities from the main material. The specific operation is annealing to...

Embodiment 3

[0054] according to figure 1 As shown, a high-ductility electrolytic copper foil includes a raw foil 1, a barrier layer 2 and an anti-oxidation coating 3. The surface of the raw foil 1 is a roughened surface, and a barrier layer 2 is provided on the roughened surface. The barrier layer 2 is externally coated with an anti-oxidation coating 3 .

[0055] The thickness of the raw foil 1 is 50 μm, and the arithmetic mean value Ra of roughness of the rough surface of the raw foil 1 is 0.6 μm.

[0056] The barrier layer 2 is brass particles.

[0057] The anti-oxidation coating 3 is a chromate solution.

[0058] according to figure 2 Shown, a kind of preparation method of high ductility electrolytic copper foil, comprises the following steps:

[0059] Step 1: Select copper material and copper wire of the same purity as the main material. The purity of the main material is greater than 99.8%. First, remove the impurities from the main material. The specific operation is annealing ...

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Abstract

The invention discloses a high ductility electrolytic copper foil and a preparation method thereof, comprising a raw foil, a barrier layer and an anti-oxidation coating, the surface of the raw foil is a roughened surface, and a barrier layer is provided on the roughened surface, the The barrier layer is coated with an anti-oxidation coating; the present invention adds a barrier layer and an anti-oxidation coating on the raw foil, specifically, depositing a layer of brass particles or zinc particles in the particle gaps of the roughened surface and forming them integrally. Reduce the roughness of the surface of the roughened layer, so that the surface of the copper foil is relatively flat without delamination, optimize the overall ductility of the copper foil, not easy to break and damage, and take into account the anti-oxidation ability, and use chromic acid on the barrier layer Salt or zinc salt solution is used for anti-oxidation treatment to form an anti-oxidation coating mainly composed of chromium or zinc, so that the raw foil will not be oxidized and discolored due to direct contact with air, and it also improves heat resistance and is convenient for long-term storage.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil manufacturing, in particular to a high ductility electrolytic copper foil and a preparation method thereof. Background technique [0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL), printed circuit boards (PCB), and lithium-ion batteries; in today's rapid development of the electronic information industry, electrolytic copper foil is known as the electronic product signal and power transmission, communication the "neural network" of [0003] The existing electrolytic copper foil is simply produced by electrolytic copper sulfate solution during preparation. The ductility of the copper foil is not good, it is easy to soften and break under high temperature conditions, and it is extremely easy to oxidize and change color, which affects performance. At the same time, the existing In the preparation process, more or less organi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/04C23C22/05C23C26/00B29C63/02
CPCB29C63/02C23C22/05C23C26/00C25D1/04
Inventor 陈志海肖建斌罗尚新丘坚聪温志豪古达宏
Owner GUANGDONG FINE YUAN SCI TECH CO LTD
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