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High-resolution printing low-temperature conductive silver paste and preparation method thereof

A high-resolution, conductive silver paste technology, applied in printed circuits, printed circuit components, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of great research and development significance, poor printing stability, and short storage time.

Active Publication Date: 2020-07-07
SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resolution of current products is generally around 200μm / 200μm (printing line width / printing spacing), and the printing stability is poor, and the storage time is short, so the research and development of this product is of great significance

Method used

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  • High-resolution printing low-temperature conductive silver paste and preparation method thereof
  • High-resolution printing low-temperature conductive silver paste and preparation method thereof
  • High-resolution printing low-temperature conductive silver paste and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0037] A preparation method of high-resolution printing low-temperature conductive silver paste, each component and composition are shown in Table 1. Among them, the polyurethane resin carrier is used as the binder phase, and its formula is: firstly, the polyurethane resin is added into the reaction kettle, and the temperature is gradually raised to 50°C, and then the dibasic acid ester, propylene glycol methyl ether acetate, and isophorone are dropped in proportion. It is made by heating and melting after adding; the nano-spherical silver powder used is superfine powder with an average particle size of 300-500nm; the nano-rod-shaped silver powder used is the filler of nano-spherical silver powder with an average particle size of 150-200nm.

[0038] Table 1

[0039]

[0040]

[0041] Add the saturated polyester resin into the reaction kettle according to the formula ratio, and gradually heat up to 50°C, then add the dibasic acid ester, propylene glycol methyl ether aceta...

Embodiment 6

[0046] A high-resolution printing low-temperature conductive silver paste is obtained by the following methods:

[0047] (1) Weigh each component by the following parts by weight:

[0048]

[0049] (2) Resin carrier premix

[0050] Add the polyurethane resin into the reaction kettle, and gradually raise the temperature to 50°C, then add the dibasic acid ester, propylene glycol methyl ether acetate, and isophorone dropwise into the reaction kettle, the dropping time is 1.5h, and the dropping is completed Then continue to react for 2 hours, then, heat up the reaction kettle to 70°C, add flake graphite into the reaction kettle, discharge the material while it is hot after reacting for 2 hours, filter with a 250-mesh stainless steel mesh to obtain a polyurethane resin carrier, and store in the dark;

[0051] (3) Powder heat treatment

[0052] Mix the nano-spherical silver powder and the nano-rod-shaped silver powder and pre-disperse them, then place them in a vacuum oven at 8...

Embodiment 7

[0059] A high-resolution printing low-temperature conductive silver paste is obtained by the following methods:

[0060] (1) Weigh each component by the following parts by weight:

[0061]

[0062]

[0063] (2) Resin carrier premix

[0064] Add the polyurethane resin into the reaction kettle, and gradually raise the temperature to 50°C, then add the dibasic acid ester, propylene glycol methyl ether acetate, and isophorone into the reaction kettle in a dropwise manner, and the dropping time is 1.5h. Continue to react for 2 hours after completion, then raise the temperature of the reaction kettle to 70°C, add flake graphite into the reaction kettle, discharge the material while it is hot after reacting for 2 hours, filter with a 250-mesh stainless steel mesh to obtain a polyurethane resin carrier, and store in the dark;

[0065] (3) Powder heat treatment

[0066] Mix the nano-spherical silver powder and the nano-rod-shaped silver powder and pre-disperse them, then place ...

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Abstract

The invention relates to high-resolution printing low-temperature conductive silver paste and a preparation method thereof. The high-resolution printing low-temperature conductive silver paste comprises the following components in parts by weight: 45 to 50 parts of nano spherical silver powder, 10 to 15 parts of nano rod-like silver powder, 15 to 20 parts of polyurethane resin, 5 to 10 parts of divalent acid ester, 5 to 10 parts of propylene glycol methyl ether acetate, 5 to 10 parts of isophorone, 0.2 to 0.5 part of polyethylene wax, 0.2 to 0.5 part of dimethyl siloxane, 0.2 to 0.5 part of fumed silica, and 0.1 to 0.5 part of flaky graphite. The production process mainly comprises nine steps of resin carrier premixing, powder heat treatment, burdening, high-speed dispersion, three-rollergrinding, filtering, finished product detection, homogeneous stirring and canning. Compared with the prior art, the conductive silver paste has the advantages of low curing temperature, high resolution and the like.

Description

technical field [0001] The invention relates to conductive silver paste, in particular to a low-temperature conductive silver paste for high-resolution printing and a preparation method thereof. Background technique [0002] Conductive inks are widely used in printed circuits, semiconductor packaging, solar cells and other fields. Conductive silver paste is the most widely used series of products in conductive ink. High-resolution printing low-temperature conductive silver paste is usually printed on transparent materials such as polymer films, plastic sheets, and glass. After printing high-resolution low-temperature conductive silver paste on these materials, there will be excellent conductivity and high resolution. With the rapid development of touch screen technology, the requirements for high-resolution printing are getting higher and higher. Now the requirements for precision printing generally reach 80μm / 80μm~100μm / 100μm (printing line width / printing spacing). Ordin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00H05K1/09C09D11/52
CPCH01B1/22H01B13/00H05K1/097C09D11/52
Inventor 江海涵朱庆明
Owner SHANGHAI BAOYIN ELECTRONICS MATERIALS CO LTD
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