A carbon nanotube supported by nanometer γ-alumina, preparation method and high thermal conductivity electrical insulation elastomer thermal interface material

A technology of alumina loading and thermal interface materials, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of high thermal conductivity, electrical insulation and high flexibility of elastomer TIM, and achieve simple processing technology Easy to operate, ensure electrical insulation properties, good shielding effect

Active Publication Date: 2021-07-20
BEIJING UNIV OF CHEM TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the main disadvantage of elastomer TIM is that it is difficult to balance high thermal conductivity, electrical insulation and high flexibility (low contact thermal resistance).

Method used

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  • A carbon nanotube supported by nanometer γ-alumina, preparation method and high thermal conductivity electrical insulation elastomer thermal interface material
  • A carbon nanotube supported by nanometer γ-alumina, preparation method and high thermal conductivity electrical insulation elastomer thermal interface material
  • A carbon nanotube supported by nanometer γ-alumina, preparation method and high thermal conductivity electrical insulation elastomer thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The formula is made up of the following raw materials in parts by weight: silicone gel A component / silica gel B component (100 parts in total), 1 part of carbon nanotubes supported by nano-γ-alumina (carbon nanotube content is 60%), 200 parts of micron alumina, 0.02 parts of platinum catalyst, and 2 parts of silicone oil plasticizer.

[0042] The specific experimental process is: mix 200ml of acidified carbon nanotube aqueous slurry (concentration: 1%) with 200ml of nano-alumina aqueous dispersion (concentration: 1%), then ultrasonically stir and electrostatically self-assemble for 4 hours, and then centrifuge and freeze-dry to obtain nano-alumina Supported acidified carbon nanotube powder. Put all the raw materials in the formula in a planetary mixer, stir and mix at 40 rpm for 10 minutes, put the mixture in a certain-shaped tetrafluoro mold at 80°C for 15 minutes to obtain the final sample.

Embodiment 2

[0044]The formula is made up of the following raw materials in parts by weight: silicone gel A component / silica gel B component (100 parts in total), 3 parts of carbon nanotubes supported by nanometer gamma-alumina (carbon nanotube content is 60%), 800 parts of micron alumina, 0.02 parts of platinum catalyst, and 2 parts of silicone oil plasticizer.

[0045] The specific experimental process is: mix 200ml of acidified carbon nanotube aqueous slurry (concentration: 1%) with 200ml of nano-alumina aqueous dispersion (concentration: 1%), then ultrasonically stir and electrostatically self-assemble for 4 hours, and then centrifuge and freeze-dry to obtain nano-alumina Supported acidified carbon nanotube powder. Put all the raw materials in the formula in a planetary mixer, stir and mix at 40 rpm for 10 minutes, put the mixture in a certain-shaped tetrafluoro mold at 80°C for 15 minutes to obtain the final sample.

Embodiment 3

[0047] The formula is made up of the following raw materials in parts by weight: silicone gel A component / silica gel B component (100 parts in total), 3 parts of carbon nanotubes supported by nanometer gamma-alumina (carbon nanotube content is 60%), 200 parts of micron aluminum nitride, 0.02 parts of platinum catalyst, and 2 parts of silicone oil plasticizer.

[0048] The specific experimental process is: mix 200ml of acidified carbon nanotube aqueous slurry (concentration: 1%) and nano-alumina aqueous dispersion (concentration: 1%) 200ml, then ultrasonically stir and electrostatically self-assemble for 3 hours, and then centrifuge and freeze-dry to obtain nano-alumina Supported acidified carbon nanotube powder. Put all the raw materials in the formula in a planetary mixer, stir and mix at 40 rpm for 10 minutes, put the mixture in a certain-shaped tetrafluoro mold at 80°C for 15 minutes to obtain the final sample.

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Abstract

A carbon nanotube supported by nanometer γ-alumina, a preparation method, and a thermal interface material of high thermal conductivity and electrical insulation elastomer. The invention discloses a method for preparing carbon nanotubes supported by nanometer γ-alumina. The slurry of carbon nanotubes with a concentration of 3‰-1% is mixed with a dispersion of nanometer γ-alumina with a concentration of 1%-30%. , electrostatically self-assembled by ultrasonic stirring for 0.5-5 hours, and centrifuged and freeze-dried to obtain the carbon nanotubes supported by nano-γ-alumina. The obtained nano-γ-alumina-supported carbon nanotube hybrid filler and micron filler are compounded and filled into silicone rubber. The resulting elastomeric thermal interface material has high volume resistivity and thermal conductivity, which can meet the heat dissipation requirements of integrated circuit packaging. performance requirements. In addition, the present invention also has the advantages of simple and easy processing technology, does not involve the use of toxic solvents, can be matched with actual factory processing equipment, and can be directly used for production.

Description

technical field [0001] The invention relates to the field of thermal interface materials for integrated circuit packaging, in particular to a carbon nanotube supported by nano-γ-alumina, a preparation method and a thermal interface material of high thermal conductivity and electrical insulation elastomer. Background technique [0002] With the rapid development of contemporary electronic technology, the electronic industry continues to develop towards high power loss, integration and miniaturization, and the energy density of modern electronic equipment has been greatly improved. etc.), the operating temperature is relatively high, and the heating power of electronic components and the whole machine is also increasing. The resulting excessive temperature will reduce the working stability of the chip and increase the error rate. At the same time, the thermal stress formed between the inside of the module and its external environment will directly affect the electrical perform...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K9/12C08K3/04C08K3/22C08K9/00C08L83/04C09K5/14
CPCC08K3/22C08K9/00C08K9/12C08K2003/2227C08K2201/011C08L83/04C08L2205/025C09K5/14C08K3/041
Inventor 卢咏来嵇小旺赵秀英李京超张立群王军艳冯予星
Owner BEIJING UNIV OF CHEM TECH
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