Photosensitive solder resist ink and preparation method thereof, printed circuit board and electronic equipment

A technology of photosensitive solder resist ink and polymerization inhibitor, which is applied in the fields of printed circuit, optomechanical equipment, printed circuit manufacturing, etc. It can solve the problems of easy charge accumulation, difficult PCB effective heat dissipation, electromigration, etc., and achieve excellent antistatic performance , Excellent heat dissipation capacity, the effect of excellent thermal conductivity

Inactive Publication Date: 2020-07-24
GUANGZHOU SHIYUAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the surface resistance of photosensitive solder resist ink used in PCB is generally greater than 10 10 Ω, easy to accumulate charge, generate static electricity, easily cause electromigration, and cause PCB short circuit
Moreover, the PCB is equipped

Method used

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  • Photosensitive solder resist ink and preparation method thereof, printed circuit board and electronic equipment
  • Photosensitive solder resist ink and preparation method thereof, printed circuit board and electronic equipment
  • Photosensitive solder resist ink and preparation method thereof, printed circuit board and electronic equipment

Examples

Experimental program
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Example Embodiment

[0059] figure 1 Shown is a flow chart of a method for preparing photosensitive solder resist ink according to an exemplary embodiment of the present disclosure. Some embodiments of the present disclosure also provide a method for preparing any of the above-mentioned photosensitive solder resist inks, refer to figure 1 , The preparation method of photosensitive solder resist ink includes:

[0060] Step 11. According to the weight parts of each component, a first mixture of resistance adjusting agent, surfactant, and first coupling agent is configured.

[0061] Among them, the first coupling agent can improve the interface performance between the resistance adjusting agent and other components, and the resistance adjusting agent can be uniformly dispersed in the first mixture through the combination of the first coupling agent and the surfactant.

[0062] figure 2 Shown is a flowchart of a method for configuring a first mixture according to an exemplary embodiment of the present disc...

Example Embodiment

[0084] Example 1

[0085] This embodiment provides a photosensitive solder resist ink, and its preparation method includes:

[0086] According to the parts by weight of each component, 2 parts of conductive carbon black and 2 parts of short carbon nanotubes are mixed and added to absolute ethanol, and ultrasonic dispersion treatment is performed. 0.5 part of sodium dodecylbenzene sulfonate was added to the mixture of conductive carbon black, short carbon nanotubes and absolute ethanol, and ultrasonic dispersion treatment was carried out. The power of the ultrasonic dispersion treatment was 400W and the temperature was 30°C. Add 2 parts of silane coupling agent KH550 to the mixture of conductive carbon black, short carbon nanotubes, absolute ethanol and sodium dodecylbenzene sulfonate, and stir for 2 hours at a stirring speed of 400 rpm to obtain a first mixture.

[0087] 80 parts photosensitive resin, 12 parts first acrylic monomer, 2 parts first mixture, 8 parts photoinitiator 784,...

Example Embodiment

[0091] Example 2

[0092] This embodiment provides a photosensitive solder resist ink, and its preparation method includes:

[0093] According to the parts by weight of each component, 5 parts of conductive carbon black was added to absolute ethanol and subjected to ultrasonic dispersion treatment. 0.5 part of sodium dodecylbenzene sulfonate was added to the mixture of conductive carbon black and absolute ethanol, and ultrasonic dispersion treatment was carried out. The power of the ultrasonic dispersion treatment was 400W and the temperature was 30°C. 1.5 parts of silane coupling agent KH570 was added to the mixture of conductive carbon black, absolute ethanol and sodium dodecylbenzene sulfonate, and stirred at a stirring speed of 400 rpm for 3 hours to obtain a first mixture.

[0094] 100 parts photosensitive resin, 16 parts first acrylic monomer, 3 parts first mixture, 10 parts photoinitiator 819, 1 part polydimethylsiloxane, 0.2 part leveling agent, 0.1 part first polymerization...

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Abstract

The invention provides photosensitive solder resist ink and a preparation method thereof, a printed circuit board and electronic equipment. The photosensitive solder resist ink comprises a main agentand a curing agent according to a mass ratio of 2-4:0.5-1.5. The main agent comprises the following components in parts by weight: 50-100 parts of photosensitive resin, 7-20 parts of a first acrylic monomer, 0.5-5 parts of a resistance regulator, 6-12 parts of a photoinitiator, 0.01-0.2 parts of a first polymerization inhibitor, 0.5-5 parts of a first coupling agent, 0.1-2 parts of a surfactant and 10-25 parts of a first solvent. The curing agent comprises the following components in parts by weight: 40-100 parts of modified epoxy resin, 7-20 parts of a second acrylic monomer, 8-20 parts of aninorganic filler, 0.01-0.2 parts of a second polymerization inhibitor, 0.5-5 parts of a second coupling agent and 10-25 parts of a second solvent. A solder resist film layer formed by the photosensitive solder resist ink has the good antistatic performance, heat conduction performance and heat dissipation performance.

Description

technical field [0001] The present disclosure relates to the technical field of electronic equipment, in particular to a photosensitive solder resist ink and a preparation method thereof, a printed circuit board and electronic equipment. Background technique [0002] With the rapid development of electronic integration technology, the integration of PCB (Printed Circuit Board, printed circuit board) is getting higher and higher, which requires the use of photosensitive solder resist ink in the PCB manufacturing process to protect the non-welded parts of the PCB to avoid Problems such as PCB short circuit, open circuit and parameter degradation caused by electromigration ensure the reliability of PCB. [0003] At present, the surface resistance of photosensitive solder resist ink used in PCB is generally greater than 10 10 Ω, it is easy to accumulate charges, generate static electricity, easily cause electromigration, and cause PCB short circuit. Moreover, the PCB is equipp...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/03G03F7/027H05K3/28
CPCC09D11/101C09D11/03G03F7/027H05K3/287
Inventor 万虎冯先强
Owner GUANGZHOU SHIYUAN ELECTRONICS CO LTD
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